Abstract: The present invention concerns a method for forming a metal layer for electromagnetic shielding and thermal management of active components, preferably by wet chemical metal plating, using an adhesion promotion layer on the layer of molding compound and forming at least one metal layer on the adhesion promotion layer or forming at least one metal layer on the adhesion promotion layer by wet chemical metal plating processes.
Type:
Application
Filed:
December 22, 2015
Publication date:
November 16, 2017
Applicant:
Atotech Deustschland GmbH
Inventors:
Kenichiroh MUKAI, Kwonil KIM, Lee GAHERTY, Lutz BRANDT, Tafadzwa MAGAYA