Abstract: Process steps for bonding substrates of a touch panel. Steps include forming an insulator layer around a flexible printed cable (FPC) contact formed on electrodes, forming a low resistive metal layer, to which the FPC is attached, on the insulator layer, forming dot spacers out of insulating material within the active area. Next, connecting the FPC with a band region formed by the insulator layer and the low resistive metal layer after the insulator layer, the low resistive metal layer and the dot spacers have been formed. Finally, bonding the substrates for reading an X coordinate and for reading a Y coordinate after connection between the insulator layer, the low resistive metal layer, the dot spacers and the FPC.