Abstract: A method for electrolytically plating copper onto a base metal, such as steel (18), utilizing an insoluble anode (16) includes the steps of: providing a pyrophosphate plating solution (14); adding a copper source, copper hydroxide, to the plating solution (14); and passing an electric current through the plating solution between the insoluble anode (16) and the base metal (18) to be plated. The apparatus (10) includes a plating tray (12), a pyrophosphate plating solution (14) including a soluble source of copper, an insoluble anode (16) and a power source (20). A copper plated product (P) is also disclosed and claimed.