Abstract: Device and method for regulating the temperature of a substrate, in particular of a wafer, by means of a device comprising two temperature-regulating circuits that are operated with different temperature-regulating fluids.

Abstract: The invention concerns a device and a method for tempering a substrate (S), as well as a method for making such a device, which comprises the following elements: a first subelements (10) provided with a support surface (20) to be pressed against the substrate (S) and with a first connecting surface, a second subelement (12) provided with a second connecting surface (28) whereby it is pressed at least partly against the first connecting surface (10). At least one of the two subelements (10, 12) contains a ceramic material. At least one of the two connecting surfaces (22, 28) comprises at least one recess (24, 30) which defines at least one cavity (32) in the device. At least one first connecting opening enables a thermostatic liquid to be circulated and/or supplied towards and/or from the cavity (32).