Abstract: A pixel array substrate includes a base, pixel structures, first bonding pads, first wirings, and a first testing element. The pixel structures are disposed on an active area of a first surface of the base. The first bonding pads are disposed on a peripheral region of the first surface. Each of the first wirings is disposed on a corresponding first bonding pad, a first sidewall of the base, and a corresponding second bonding pad. The first testing element is disposed on the active area of the first surface and has a first testing line. The first testing line is electrically connected to at least one of the first bonding pads, and an end of the first testing line is substantially aligned with an edge of the base.

Abstract: A display device includes a circuit board and a plurality of light-emitting units disposed on the circuit board. The circuit board includes a substrate and a plurality of signal lines disposed on the substrate. Each light-emitting unit includes a base board, at least one light-emitting element and a driving circuit layer. The light-emitting element is between the base board and the substrate. The driving circuit layer is between the light-emitting element and the base board, and electrically connected to the light-emitting element and the signal line.

Abstract: A display panel including a pixel circuit substrate, a planarization layer, a plurality of bonding pads, a plurality of light-emitting devices, a plurality of auxiliary electrodes, and a reflective structure layer is provided. The pixel circuit substrate has a plurality of signal lines. The planarization layer covers the signal lines. The bonding pads are disposed on the planarization layer and are electrically connected to the signal lines. The light-emitting devices are electrically bonded to the bonding pads. The auxiliary electrodes are disposed between the bonding pads. The reflective structure layer is disposed between the light-emitting devices and overlaps at least part of the auxiliary electrodes and the bonding pads. A method of fabricating the display panel is also provided.

Abstract: A bi-directional optical module includes a substrate, at least one first light-emitting diode (LED), and at least one second LED. The first LED is disposed on a surface of the substrate. The first LED has a first reflection surface and a first light-outlet surface that are opposite to each other, and the first light-outlet surface is away from the substrate relative to the first reflection surface. The second LED is disposed on the same surface of the substrate. The second LED has a second reflection surface and a second light-outlet surface that are opposite to each other, and the second light-outlet surface is close to the substrate relative to the second reflection surface. The substrate has at least one light-transparent area that is not occupied by the first LED and the second LED.

Abstract: A touch display device including a display panel and a touch device is provided. The display panel includes a plurality of sub-pixels. Each of the sub-pixels includes a pixel electrode and a switching element. The touch device is located on the display panel and includes a touch electrode area and a dummy electrode area. The touch device includes an electrode structure and a conductive mesh. The conductive mesh includes a plurality of reticulated repeating units. Each of the reticulated repeating units is overlapped with at least one corresponding sub-pixel and includes first and second X-shaped conductive structures. Two ends of the first X-shaped conductive structure are connected to two ends of the second X-shaped conductive structure. The first and second X-shaped conductive structures in the touch electrode area are in a continuous pattern. The first and second X-shaped conductive structures in the dummy electrode area are in a discontinuous pattern.

Abstract: A display apparatus including a display panel, a sealant, a haptic plate, a vibration source, a buffer layer, and a plurality of supports is provided. The sealant is disposed on the display panel. The haptic plate is disposed on the sealant. The sealant and the haptic plate define an accommodating space. The vibration source is connected to the haptic plate. The vibration source is adapted to vibrate to generate an ultrasonic wave on the haptic plate. The buffer layer is disposed between the haptic plate and the display panel. The buffer layer includes a liquid, and the liquid is disposed within the accommodating space. The supports are disposed between the haptic plate and the display panel. The ultrasonic wave has a node distribution on the haptic plate, and the supports are disposed corresponding to the node distribution.

Abstract: An electronic device includes a substrate, multiple side wires, and a protection structure. The substrate has a first main surface, a side surface, and a first multi-turning surface connected between the first main surface and the side surface. The first multi-turning surface includes multiple first turning surfaces with differing normal directions. The side wires are disposed on the substrate. Each of the side wires extends from the first main surface over the first multi-turning surface to the side surface. The protection structure is disposed on the substrate and includes a wire protection part covering the side wires. The wire protection part has a first thickness at the side surface, a second thickness at the first main surface, and a third thickness at at least one of the first turning surfaces. The first thickness is greater than the second thickness, and the second thickness is greater than the third thickness.

Abstract: A display panel including an array substrate, a first sub-pixel, a second sub-pixel, and a first light-emitting diode is provided. The array substrate includes a first connection pad and a second connection pad. The first sub-pixel includes a first driving unit electrically connected to the first connection pad. The second sub-pixel includes a second driving unit electrically connected to the second connection pad. The first light-emitting diode completely overlaps and is physically isolated from the second connection pad. The first light-emitting diode is not completely overlapped and is electrically connected to the first connection pad. A manufacturing method of a display panel is also provided.

Abstract: A stretchable electronic device includes a substrate, a plurality of electronic elements, and a conductive wiring. The electronic elements and the conductive wiring are disposed on the substrate, and the conductive wiring is electrically connected to the electronic elements. The conductive wiring is formed by stacking an elastic conductive layer and a non-elastic conductive layer. A fracture strain of the elastic conductive layer is greater than a fracture strain of the non-elastic conductive layer, and the non-elastic conductive layer includes a plurality of first fragments which are separated from one another.

Abstract: An electronic device including a substrate, transversal signal lines, a first vertical signal line, a second vertical signal line, and a first shielding vertical line is provided. The transversal signal lines, the first vertical signal line, the second vertical signal line, and the first shielding vertical line are disposed on the substrate. The first vertical signal line and the second vertical signal line are intersected with the transversal signal lines. The second vertical signal line is connected to one of the transversal signal lines. An orthogonal projection of the first shielding vertical line on the substrate is between an orthogonal projection of the first vertical signal line on the substrate and an orthogonal projection of the second vertical signal line on the substrate.

Abstract: A display device includes a plurality of transparent voltage-dividing common electrodes and a plurality of pixel units. The transparent voltage-dividing common electrodes are electrically isolated from each other in a first direction. Each of the pixel units includes a first pixel electrode, a second pixel electrode, and a voltage-dividing switch. The first pixel electrode is configured to receive a data voltage. The second pixel electrode is configured to receive the data voltage. The voltage-dividing switch is configured to divide the data voltage on the second pixel electrode to one of the transparent voltage-dividing common electrodes.

Abstract: A light-emitting device includes a substrate, an active device layer, a bank structure and organic light-emitting materials. The active device layer is located on the substrate. The bank structure is located on the active device layer. The bank structure includes at least one first bank and a plurality of second banks. The at least one first bank has arc surfaces and includes hydrophilic materials. The second banks extend along the first direction, and the second banks include a hydrophobic material. The bank structure has a plurality of openings. Two sides of each opening are defined by two corresponding arc surfaces of the at least one first bank, and the other two sides of each opening are defined by two opposite side walls of the corresponding two second banks. The organic light-emitting materials are filled into the openings of the bank structure.

Abstract: A display device has a display area and a peripheral area and includes data lines, scan lines, gate transmission lines, and sub-pixels. The data lines and the gate transmission lines extend from the peripheral area into the display area. The data lines located in the display area extend along a first direction. The scan lines are located in the display area and extend along a second direction intersecting the first direction. The gate transmission lines are electrically connected to the scan lines. One of the gate transmission lines includes first, second, and third wires located in the display area. The first and third wires extend along the first direction. The second wire extends along the second direction. The first, second and third wires are electrically connected in sequence. The third wire is electrically connected to one of the scan lines.

Abstract: A pixel array is provided. The pixel array includes a plurality of red pixels, a plurality of green pixels, and a plurality of blue pixels. Each green pixel includes a light emitting diode (LED), a first transistor, a second transistor, a third transistor, and a fourth transistor. The LED receives a system low voltage. The first transistor receives a first data signal and a first scan signal. The second transistor is coupled to a second end of the first transistor and the anode of the light emitting diode. The third transistor receives a system high voltage and a first control signal, and is coupled to a first end of the second transistor. The fourth transistor is coupled to the anode of the light-emitting diode of an adjacent green pixel, a control terminal of the third transistor, and the anode of the light-emitting diode.

Abstract: A fingerprint sensing device includes a first substrate, a sensing element layer, a second substrate, a micro-structure layer, and a spacer layer. The sensing element layer is located on the first substrate and includes multiple sensing elements. The second substrate is located on the sensing element layer. The micro-structure layer is located between the second substrate and the sensing element layer, and includes multiple micro-lens structures and multiple dummy structures. Orthogonal projections of the micro-lens structures on the first substrate overlap orthogonal projections of the sensing elements on the first substrate. The spacer layer is located between the second substrate and the sensing element layer, and includes multiple main spacers. Each of the main spacers covers at least one of the dummy structures.

Abstract: A light-emitting device, including a first type semiconductor layer, a patterned insulating layer, a light-emitting layer, and a second type semiconductor layer, is provided. The patterned insulating layer covers the first type semiconductor layer and has a plurality of insulating openings. The insulating openings are separated from each other. The light-emitting layer is located in the plurality of insulating openings and covers a portion of the first type semiconductor layer. The second type semiconductor layer is located on the light-emitting layer.

Abstract: An optical sensing device includes a substrate, a sensing element layer, a light-shielding layer, and a light absorbing layer. The substrate has a first surface and a second surface opposite to each other. The sensing element layer is disposed on the first surface and includes multiple sensing elements. The light-shielding layer is disposed on the sensing element layer and has multiple openings. An orthogonal projection of the opening on the substrate overlaps an orthogonal projection of the sensing element on the substrate. The light absorbing layer is disposed on the second surface. An electronic apparatus including the optical sensing device is also provided.

Abstract: A fingerprint recognition device including a light emitting layer, an image sensing layer and a micro-lens layer is provided. The image sensing layer has a plurality of pixels. The micro-lens layer is disposed between the light emitting layer and the image sensing layer and has a plurality of micro lenses respectively corresponding to the pixels. A distance between the micro-lens layer and the light emitting layer is less than or equal to 800 um and greater than or equal to h1, where h1=x/(2×tan ?), x is the minimum distance between two micro lenses respectively corresponding to different pixels on a plane where the micro-lens layer is disposed, and ? is an FWHM light receiving angle of each of the micro lenses.

Abstract: A photosensitive device includes a first substrate, a second substrate, a supporting structure, multiple first microlenses, multiple second microlenses, a first photosensitive element, a second photosensitive element, and a collimating structure. The second substrate is opposite to the first substrate, and there is a gap between the first substrate and the second substrate. The supporting structure is located in the gap between the first substrate and the second substrate. The first microlenses and the second microlenses are respectively disposed on a first side and a second side of the gap. The first photosensitive element is overlapping with one of the first microlenses and one of the second microlenses. The second photosensitive element is overlapping with another one of the second microlenses. The collimating structure is located between the first substrate and the first microlenses.

Abstract: A biometric verification device includes a backlight module, a photodetector, a switching element, and at least one collimation structure. The photodetector is disposed on the backlight module. The switching element is disposed on the backlight module and electrically connected with the photodetector. The at least one collimation structure is disposed on the backlight module and has a first pinhole and a second pinhole, The horizontal projections of the first pinhole and the second pinhole on the backlight module do not overlap with the horizontal projection of the photodetector on the backlight module.