Patents Assigned to Auk Co., Ltd.
  • Patent number: 6420780
    Abstract: According to a voltage regulator of the present device, a drive IC and an output transistor are formed separately, and the drive IC is mounted on the ground lead and connected electrically to an input lead. The output transistor is mounted on an output lead and connected to the drive IC and to the input lead. As such, the leads, the drive IC and the output transistor are arranged as a package so that the regulator can accomodate various output voltage or current, and it is not necessary to specially make a number of drive ICs which have different output current levels respectively so that the number of masks is reduced. Due to the fact that the output transistor is separated from the drive IC, the size of the drive IC chip is made smaller, thereby reducing the manufacturing costs.
    Type: Grant
    Filed: December 30, 1999
    Date of Patent: July 16, 2002
    Assignee: Auk Co., Ltd.
    Inventor: Young-Keun Ko
  • Patent number: 6417017
    Abstract: The present invention relates to an optosemiconductor device, improved in light-emission efficiency and heat-radiation capability due to its production by molding an anode lead frame and a cathode lead frame with transmission-type epoxy resin and by forming, in the lower end part of the said transmission-type epoxy resin, a layer either of reflective heat-radiating epoxy resin (organic, inorganic, metallic) which contains a heat-radiating filler or of reflective heat-radiating epoxy resin (organic, inorganic, metallic) of mixed hues, along with a method for its manufacture; and by producing this optosemiconductor device by placing such resin as has a filler of a reflective and highly heat-radiating(organic, inorganic, metallic) epoxy resin or reflective heat-radiating(organic, inorganic, metallic) epoxy resin of mixed hues at the lower end of the transmission-type epoxy resin, the present invention is enabled both to prevent the thermal aging inherent in the conventional light-emitting or light-receiving diod
    Type: Grant
    Filed: March 5, 2001
    Date of Patent: July 9, 2002
    Assignee: AUK Co., Ltd.
    Inventor: Teng-Yul Ih
  • Patent number: 6285549
    Abstract: A power package lead frame comprises a lead frame, a chip attached to the lead frame, and a mold encasing the chip and a portion of the lead frame. The lead frame comprises a paddle part, a radiation plate, and a leg part. The radiation plate comprises a first plate extending from the paddle part and a second plate extending from the first plate. The first and second plates have the same thickness as the paddle part or the leg part. The second plate is folded towards the first plate and fixed tightly thereto, so that the radiation plate is twice as thick as the paddle part or the leg part.
    Type: Grant
    Filed: December 30, 1999
    Date of Patent: September 4, 2001
    Assignee: Auk Co., Ltd.
    Inventor: Teng Yul Lee