Abstract: Optical devices having a first semiconductor slab including a first lateral boundary for an optical mode and a second semiconductor slab above and asymmetrically overlapping the first lateral boundary included in the first semiconductor slab and including an edge of a second lateral boundary for the optical mode. The second lateral boundary is disposed above and to a side of the first lateral boundary. The first semiconductor slab is of a silicon material while the second semiconductor slab is of a III-V material. A first and a second electrical contact are coupled to the second semiconductor slab, one on each lateral side of the second lateral boundary. The optical device further includes an optical waveguide region formed by the first and second lateral optical mode boundaries, wherein a complex refractive index of the optical waveguide region changes based on an electrical difference applied between the first and second electrical contacts.

Abstract: An electro-optic modulator comprising a first region of silicon material and a second region of non-silicon material. The second region may at least partially overlap the first region to create a lateral overlap region. An optical waveguide of the modulator may be included in the lateral overlap region and comprise of both the silicon and the non-silicon material. The refractive index of at least one of the silicon material and the non-silicon material within the optical waveguide may change based on an electrical difference applied between electrical contacts of the modulator.

Abstract: Embodiments of the invention relate to an electro-optic device comprising a first region of silicon semiconductor material and a second region of III-V semiconductor material. A waveguide of the optical device is formed in part by a ridge in the second region. An optical mode of the waveguide is laterally confined by the ridge of the second region and vertically confined by a vertical boundary included in the first region. The ridge structure further serves as a current confinement structure over the active region of the electro-optic device, eliminating the need for implantation or other structures that are known to present reliability problems during manufacturing. The lack of “voids” and implants in electro-optic devices according to embodiments of the invention leads to better device reliability, process repeatability and improved mechanical strength.

Abstract: Embodiments of the invention are hybrid photonic devices including a first semiconductor slab (i.e. region) comprising a silicon material and a second semiconductor slab, comprising a III-V material, above and partially overlapping the first semiconductor slab to create a lateral overlap region. A bonding layer may be formed on the second semiconductor slab to enable the bonding of the first and second semiconductor slabs at the lateral overlap region. An optical waveguide is formed to be included in the lateral overlap region and comprising the silicon semiconductor material, the III-V semiconductor material and the bonding layer. Thus, in embodiments of the invention the bonding layer comprises a material with a refractive index of at least 2.0 so as to not affect the optical mode shape or propagation loss of the hybrid electro-optical device.