Abstract: The present invention relates to a copper ceramic substrate incorporating a ceramic carrier, and a copper layer joined to a surface of the ceramic carrier, wherein the copper layer incorporates at least one first layer, which faces the ceramic carrier and has an average first grain size, and a second layer, which is arranged on the face of the copper layer facing away from the ceramic carrier and has an average second grain size, the second grain size being smaller than the first grain size.
Type:
Grant
Filed:
December 6, 2016
Date of Patent:
April 27, 2021
Assignee:
AURUBIS STOLBERG GMBH & CO. KG
Inventors:
Karl Zeiger, Benjamin Cappi, Helge Lehmann, Robert Koch
Abstract: The invention relates to a brass alloy substantially consisting of copper and zinc. The alloy has at least one additional alloy component. A lead content is at most 0.1 weight percent. The zinc fraction is 40.5 to 46 weight percent. The alloy comprises a mixed crystal having fractions of an alpha micro structure and of a beta microstructure. The weight proportion of the beta microstructure is at least 30% and at most 70%.
Type:
Application
Filed:
August 17, 2010
Publication date:
August 16, 2012
Applicant:
AURUBIS STOLBERG GMBH & CO. KG
Inventors:
Karl Zeiger, Ulrich Lorenz, Michael Hoppe