Abstract: A dual solder-hole layout for expansion slots is disclosed. The dual solder-hole layout, which comprises a first solder-hole layout and a second solder-hole layout, can be electrically connected to one of various types of expansion slots. The first solder-hole layout comprises a first solder-hole row and a second solder-hole row. Solder holes in the first solder-hole row form a straight line. The second solder-hole row is separated into a first solder-hole portion and a second solder-hole portion. The first solder-hole portion of the second solder-hole row is parallel to the first solder-hole row but far from the first solder-hole row. The second solder-hole portion of the second solder-hole row is also parallel to the first solder-hole row and is closer to the first solder-hole row. The second solder-hole layout comprises a third solder-hole row. The third solder-hole row is parallel to the first solder-hole row and the first solder-hole portion of the second solder-hole row.