Abstract: In a method for the unidirectional and interference-safe transmission of digital data via radio waves, wherein the data which are composed of data packets each comprising a defined number of bytes and of at least one synchronization packet are transmitted from a transmitter to a receiver, it is proceeded such that each byte is transmitted in a manner comprised of flag bits as start bits, information-representing information bits and identification bits encoding the number of the respective byte and carrying the parity information and that the flag bits and the information bits are inverted in every second byte.

Abstract: A method for producing structures in chips is realized by carrying out a sequence of structuring steps in a self-adjusting manner. By structuring a first auxiliary layer applied on a substrate, a first masking structure is formed after a first masking procedure, which first masking structure has at least one partial region projecting beyond the surface of the substrate. After this, a further structuring step is carried out, for instance, by etching, implantation or CVD, using the previously produced first masking structure as a mask. After this, the first masking structure with a view to forming a second masking structure is inverted by applying at least one second auxiliary layer onto the first masking structure. The thus formed structure is at least partially taken off and the thus denuded first auxiliary layer is selectively removed, whereupon the second masking structure is used as a mask for a further structuring step.

Abstract: In a method for obtaining a temperature-independent voltage reference by an energy gap reference circuit using at least one bipolar transistor and a voltage source, only a single bipolar transistor is connected in series with a resistor. Different voltages are facultatively applied to the resistor. The voltages are detected upstream and downstream of the series resistor and fed to an A/D converter. The gain constant of the A/D converter is calculated from the digitalized measurements and used for measurement correction. The circuit arrangement for obtaining such a temperature-independent voltage reference includes a bipolar transistor and a resistor connected in series with the transistor. An A/D converter configured to yield digitalized voltage measurements is connected via switches to ports provided on either side of the resistor. The digital signals from the A/D converter are fed to a computer to determine the gain constant, from which the corrected voltage signal can be read out digitally.

Abstract: In a microsensor with a micro-electromechanical sensor element and an integrated circuit for measuring, calibration and compensation electronics, whereby the sensor is connected electrically to the integrated circuit (IC), the micro-electromechanical sensor element is arranged directly on the integrated circuit with accurate positioning, and is connected with electric conductivity via a circulating soldered joint.

Abstract: A method for compensating mechanical stresses in measuring the magnetic field strength by Hall sensors is disclosed. It is proceeded in a manner that the electric resistance and/or a measuring quantity proportional to the electric resistance of the Hall sensor is determined in at least two different directions, that the mean value of the determined resistances and/or measuring quantities proportional thereto is calculated, and that the current conducted through the Hall sensor is chosen to be proportional to the mean value calculated.

Abstract: A method for housing sensors in a package and, in particular, housing chemical sensors, flow sensors or optical sensors in a synthetic package. In a first step, the active sensor surface of a semiconductor or IC sensor is provided with a cap forming a hollow space above the active sensor surface and the sensor is connected with contacts and bond wires. In a second method step, the package is formed by molding, in particular injection molding. In a third method step, or simultaneously with the second method step, the hollow space formed above the active sensor surface is opened.