Abstract: A finger biometric sensor may include a finger biometric sensing layer having an upper major surface and at least one sidewall surface adjacent thereto. The finger biometric layer may be for generating signals related to at least one biometric characteristic of the user's finger when positioned adjacent the first major surface. The finger biometric sensor may also include a piezoelectric transducer layer coupled to the at least one sidewall surface of the finger biometric sensing layer and a plurality of electrically conductive layers coupled to the piezoelectric transducer layer to define transducer electrodes. At least one of the electrically conductive layers may also cooperate with the finger biometric sensing layer for sensing the at least one biometric characteristic.

Abstract: An electronic device includes a housing and a finger sensor carried by the housing to receive a fingerprint area of a user's finger adjacent thereto. A processor can be carried by the housing and connected to the finger sensor. The processor determines a plurality of finger motion patterns of the fingerprint area of the user's finger relative to the finger sensor. The processor also matches the determined finger motion patterns to stored finger motion patterns of respective characters, and may display the characters as text on a display. The finger sensor may also be used to verify the user based upon a fingerprint, for example.

Abstract: An IC package preferably includes an IC and encapsulating material surrounding the IC, with the encapsulating material having an opening therein to define an exposed portion of the IC. Vestigial portions of encapsulating material may be left on the exposed portion of the IC and spaced inwardly from a periphery of the opening based upon molding using a mold protrusion which includes a bleed-through retention channel positioned inwardly from peripheral edges. The channel collects and retains any bleed-through of the encapsulating material. The IC package may further include a leadframe carrying the IC. The leadframe may include a die pad, finger portions, and a plurality of die pad support bars. The die pad may be downset below a level of the finger portions. Each of the die pad support bars may be resilient deformed to accommodate the downset of the die pad. Low stress encapsulating material and adhesive may also be included in the IC package.

Abstract: A method for making an IC package preferably includes providing a mold including first and second mold portions, and wherein the first mold portion carries a mold protrusion defining an IC-contact surface with peripheral edges and a bleed-through retention channel positioned inwardly from the peripheral edges. The method also preferably includes closing the first and second mold portions around the IC and injecting encapsulating material into the mold to encapsulate the IC and make the IC package having an exposed portion of the IC adjacent the mold protrusion. Morever, the bleed-through retention channel retains any encapsulating material bleeding beneath the peripheral edges of the IC contact surface, and prevents the encapsulating material from reaching further onto the exposed portion of the IC. The method may also include releasing the IC package with the exposed portion from the mold.