Patents Assigned to Autosplice Systems, Inc.
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Patent number: 6966440Abstract: A non-intrusive surface mount interconnect that provides a through-hole interconnect to the opposite side of a PCB board. A headed pin (head up/shank down) can be picked by standard placement equipment from a specially configured pocket tape using a hole that is tightly controlled for pin location. The head of the pin rests on top of the packaging tape preventing the pin from passing through the hole. A tapered section on the pin fits with minimal clearence assuring that a vacuum nozzle on the placement equipment when it descends sees and contacts the head top for vacuum nozzle pick-up.Type: GrantFiled: August 12, 2002Date of Patent: November 22, 2005Assignee: Autosplice Systems, Inc.Inventors: Craig M. Kennedy, Gregory K. Torigian
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Publication number: 20040209495Abstract: A solder transfer method which uses an electrically-conductive, e.g., metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In on of the preferred embodiments, a solder deposit previously formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solder joint. The method and construction are useful for attaching a daughter board to motherboard, and for surface mounting a long header with multiple pins to the contact surfaces of a PCB without the need to separately add solder during a second reflow step to make a robust solder joint between the contact surfaces.Type: ApplicationFiled: May 13, 2004Publication date: October 21, 2004Applicant: Autosplice Systems Inc.Inventors: Craig M. Kennedy, Donald S. Eisenberg
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Patent number: 6780028Abstract: A solder transfer method which uses an electrically-conductive, e.g., metal, surface, of a stamping or pin or pad as a vehicle to transfer molten solder from a remote solder reserve to a solder joint to be made. In a preferred embodiment, a solder deposit previously-formed on a surface mount pad during a first reflow step will transfer up to the adjoining contact surfaces by a wicking process to provide the additional solder needed to fabricate a robust solderjoint. When one of the contact surfaces is a contact or pin on a first PCB, and the other contact surface is a SMT pad on a second PCB serving, for example, as a memory card, the process of the invention makes for an easy SMT processed attachment of the memory card to the first PCB without the need to add solder during a second reflow step to make a robust solder joint between the contact surfaces.Type: GrantFiled: December 6, 2002Date of Patent: August 24, 2004Assignee: Autosplice Systems Inc.Inventors: Craig M. Kennedy, Donald S. Eisenberg
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Patent number: 6691859Abstract: A novel feeder construction, and method of operation, that is easily interfaced to a variety of conventional pick-and-place machines and can readily and reliably feed components suspended from a carrier for pickup at a pickup location by the pick-and-place machine. In a preferred embodiment, the carrier with suspended components is fed in a line spaced laterally from the pickup location. The lead component when separated from the strip must then be moved laterally to the pickup location. By laterally spacing the carrier strip of components from the pickup location it is ensured that the feeder parts involved in separating the component from the carrier do not obstruct movement of the vacuum nozzle of the pick-and-place machine during the pickup operation and advancement of the carrier to present the next component.Type: GrantFiled: December 20, 2001Date of Patent: February 17, 2004Assignee: Autosplice Systems, Inc.Inventor: Jerome L. Weber
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Publication number: 20030118429Abstract: A novel feeder construction, and method of operation, that is easily interfaced to a variety of conventional pick-and-place machines and can readily and reliably feed components suspended from a carrier for pickup at a pickup location by the pick-and-place machine. In a preferred embodiment, the carrier with suspended components is fed in a line spaced laterally from the pickup location. The lead component when separated from the strip must then be moved laterally to the pickup location. By laterally spacing the carrier strip of components from the pickup location it is ensured that the feeder parts involved in separating the component from the carrier do not obstruct movement of the vacuum nozzle of the pick-and-place machine during the pickup operation and advancement of the carrier to present the next component.Type: ApplicationFiled: December 20, 2001Publication date: June 26, 2003Applicant: Autosplice Systems Inc.Inventor: Jerome L. Weber
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Patent number: 6202853Abstract: A new continuous carrier for surface mount or other electrical or mechanical parts, and a method of fabricating same, formed by molding one or a pair of continuous flexible film strips to a side or sides of a series of desired electrical or mechanical components such that the components are attached to the single strip or filament or suspended between the film strips or filaments. Following the initial molding step, the components, while still supported by the film strips or filament, are subjected to secondary processing Examples are: providing electrically-conductive coatings on the component throughout or selectively, providing electrically-conductive traces on the moldings, or molding in a second molding stage a part of a different composition or shape to the initial molded part.Type: GrantFiled: May 25, 1999Date of Patent: March 20, 2001Assignee: AutoSplice Systems, Inc.Inventors: Giuseppe Bianca, Robert M. Bogursky
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Patent number: 6190214Abstract: A novel press-fit electrically-conductive contact member, as, for example, an electrically-conductive metal pin, characterized by a conforming section which has an elastically-deformable region which acts as a spring and which is adapted to engage a substrate hole in a press-fitting relationship. The conforming section comprises opposed beam members configured to accommodate a considerably larger hole tolerance yet still provide sufficient retention force to stabilize the pin during a soldering process that such substrates may typically undergo. The beam cross-sections are configured to allow them to occupy a side-by-side position. Contact members with the conforming section can be manufactured by a wire-forming process in which end-to-end connected pins are formed as a continuous strip needing no excess material for carrying the pins, nor are any air gaps formed between the pins, and thus the finished continuous strip of pins can be wound up on a reel.Type: GrantFiled: December 7, 1999Date of Patent: February 20, 2001Assignee: Autosplice Systems, Inc.Inventors: Giuseppe Bianca, Robert M. Bogursky
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Patent number: 6148500Abstract: Inductive electrical components fabricated by PWB techniques of ferromagnetic core or cores are embedded in an insulating board provided with conductive layers. Conductive through-holes are provided in the board on opposite sides of a core. The conductive layers are patterned to form with the conductive through-holes one or more sets of conductive turns forming a winding or windings encircling the core. The conductive layers can also be patterned to form contact pads on the board and conductive traces connecting the pads to the windings.Type: GrantFiled: September 8, 1997Date of Patent: November 21, 2000Assignee: Autosplice Systems Inc.Inventors: Kenneth P. Krone, John F. Trites
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Patent number: 6042429Abstract: A novel press-fit pin or socket member, as, for example, an electrically-conductive metal pin, characterized by a knurl section which has spaced bumps and adjacent grooves perimetrically and longitudinally spaced from one another and which is adapted to engage a substrate hole in a press-fitting relationship. Pin or socket members with the knurl section can be manufactured by a wire-forming process in which end-to-end connected pins are formed as a continuous strip needing no excess material for carrying the pins, nor are any air gaps formed between the pins, and thus the finished continuous strip of pins can be wound up on a reel.Type: GrantFiled: August 18, 1997Date of Patent: March 28, 2000Assignee: Autosplice Systems Inc.Inventors: Giuseppe Bianca, Robert M. Bogursky
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Patent number: 5967365Abstract: A feeder for a pick and place machine used in connection with the mounting of small discrete parts such as electrical and mechanical components comprises a frame and mechanisms connected to the frame for advancing a carrier tape product from a supply reel. The carrier tape product preferably includes a pair of spaced apart continuous parallel carrier tapes having a series of longitudinally spaced parts with opposite sides molded over adjacent inner side edges of corresponding ones of the carrier tapes so that each part bridges the two carrier tapes. The feeder further comprises a separation station mounted to the frame for receiving the carrier tape from the supply reel.Type: GrantFiled: August 1, 1997Date of Patent: October 19, 1999Assignee: Autosplice Systems, Inc.Inventors: Robert M. Bogursky, Giuseppe Bianca, Douglas Green, John Hover, Richard Howe, Scott Proctor
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Patent number: 5957739Abstract: A continuous stamping of plated metal components, with carrier links between their ends, for surface mount soldering. A strip of components is formed which can be individually easily separated at severance regions between the adjacent components. The severance regions are located in the carrier links between the components. Preferably, the carrier links are offset upwardly from a solderable surface (20) of the components, or alternatively may be coplanar with such surface (FIG. 17). The carrier regions (21) that remain after severance may also serve as an overtravel stop during insertion of the component into a support. In a two-row embodiment (FIG. 10), the carrier regions (50, 52) are formed to be asymmetrical in order to increase spacing between pins. Advantages include: less material required, lower cost for selective plating, adjustable pin length in the die, flat stamping, tip plating for better electrical contact, and scrapless end product.Type: GrantFiled: April 14, 1997Date of Patent: September 28, 1999Assignee: Autosplice Systems Inc.Inventors: Giuseppe Bianca, Robert M. Bogursky
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Patent number: 5938996Abstract: A new continuous carrier for surface mount or other electrical or mechanical parts, and a method of fabricating same, formed by molding one or a pair of continuous flexible film strips to a side or sides of a series of desired electrical or mechanical components such that the components are attached to the single strip or filament or suspended between the film strips or filaments. The film strips may be provided with sprocket holes or other equivalent structure for advancing the film strips during the molding process and for reeling up the resultant assembly onto a reel for sale or distribution to a PCB assembler. The latter places the reel of molded parts onto a conventional feeding device. The parts are then separated from the supporting strips or filament, picked-up by a pick-and-place device and placed onto the PCB in the normal manner. The filament or strip may be constituted of plastic, paper or metal.Type: GrantFiled: February 5, 1997Date of Patent: August 17, 1999Assignee: Autosplice Systems, Inc.Inventors: Giuseppe Bianca, Robert M. Bogursky
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Patent number: 5893779Abstract: A novel press-fit electrically-conductive contact member, as, for example, an electrically-conductive metal pin, characterized by a conforming section which has an elastically-deformable region which acts as a spring and which is adapted to engage a substrate hole in a press-fitting relationship. The conforming section comprises opposed beam members configured to accommodate a considerably larger hole tolerance yet still provide sufficient retention force to stabilize the pin during a soldering process that such substrates may typically undergo. The beam cross-sections are configured to allow them to occupy a side-by-side position. Contact members with the conforming section can be manufactured by a wire-forming process in which end-to-end connected pins are formed as a continuous strip needing no excess material for carrying the pins, nor are any air gaps formed between the pins, and thus the finished continuous strip of pins can be wound up on a reel.Type: GrantFiled: October 18, 1996Date of Patent: April 13, 1999Assignee: Autosplice Systems Inc.Inventors: Giuseppe Bianca, Robert M. Bogursky
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Patent number: 5781091Abstract: Inductive electrical components fabricated by PWB techniques of ferromagnetic core or cores are embedded in an insulating board provided with conductive layers. Conductive through-holes are provided in the board on opposite sides of a core. The conductive layers are patterned to form with the conductive through-holes one or more sets of conductive turns forming a winding or windings encircling the core. The conductive layers can also be patterned to form contact pads on the board and conductive traces connecting the pads to the windings.Type: GrantFiled: July 24, 1995Date of Patent: July 14, 1998Assignee: Autosplice Systems Inc.Inventors: Kenneth P. Krone, John F. Trites
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Patent number: 5775945Abstract: A continuous electrical connector or component part of plastic or metal manufactured by injection molding of axial discrete segments. A novel in-line chaining structure is provided for interlocking adjacent discrete segments. The interlocking structure comprises complementary reduced-size fitted end units pinned together by a matching component, or a multi-component splicing device which engages one or more holes in adjacent segment units. The resultant strip can be wound up on a reel.Type: GrantFiled: December 13, 1996Date of Patent: July 7, 1998Assignee: Autosplice Systems Inc.Inventors: Giuseppe Bianca, Robert M. Bogursky
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Patent number: 5725392Abstract: A continuous electrical connector or related part manufactured by injection molding axial segments in sequence. A novel in-line interlocking structure is provided for interlocking adjacent segments. The interlocking structure comprises end units nested together. Electrical or mechanical parts are simultaneously incorporated in the units of each segment during the molding process.Type: GrantFiled: November 22, 1996Date of Patent: March 10, 1998Assignee: Autosplice Systems, Inc.Inventors: Giuseppe Bianca, Robert M. Bogursky
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Patent number: 5709574Abstract: Surface mountable socket connector having first and second base portions providing for top, bottom, or horizontal entry of a male mating projecting member depending on the mounting position of the socket connector on a substrate such as a PCB. A spring contact member cantilevered at the first base portion, is configured to contact the projecting member via a hole at the first base portion or at an opposite end of the socket connector. The socket connectors are preferably fabricated from a continuous strip for loading onto a PCB by placement equipment.Type: GrantFiled: August 30, 1996Date of Patent: January 20, 1998Assignee: Autosplice Systems Inc.Inventors: Giuseppe Bianca, Robert M. Bogursky
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Patent number: 5706952Abstract: A new continuous carrier for surface mount or other electrical or mechanical parts, and a method of fabricating same, formed by molding one or a pair of continuous flexible film strips to a side or sides of a series of desired electrical or mechanical components such that the components are attached to the single strip or filament or suspended between the film strips or filaments. The film strips may be provided with sprocket holes or other equivalent structure for advancing the film strips during the molding process and for reeling up the resultant assembly onto a reel for sale or distribution to a PCB assembler. The latter places the reel of molded parts onto a conventional feeding device. The parts are then separated from the supporting strips or filament, picked-up by a pick-and-place device and placed onto the PCB in the normal manner. The filament or strip may be constituted of plastic, paper or metal.Type: GrantFiled: January 11, 1996Date of Patent: January 13, 1998Assignee: Autosplice Systems Inc.Inventors: Giuseppe Bianca, Robert M. Bogursky
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Patent number: 5620086Abstract: A low profile, push-pull, jumper switch that relies on movement of the switch housing to make and break the connection between two contact members mounted on the housing. The only metal used are the two contact members, which are cammed into contact by movement of the housing when placed in its closed-switch position. In a preferred embodiment, the two contact members are identical and are each constituted of a one-piece U-shaped metal member, with the U-bight depending from the housing and configured to be solderable to the PCB pads or through-holes and thus being fixed. Protrusions on the contacts latch the housing in its open-switch position or closed-switch position. The switch in one embodiment lends itself to SMT applications.Type: GrantFiled: February 23, 1996Date of Patent: April 15, 1997Assignee: Autosplice Systems, Inc.Inventors: Giuseppe Bianca, Robert M. Bogursky
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Patent number: 5607313Abstract: A method and device for improved assembly to hole-free PCBs of high aspect ratio components or any other components that are not easily assembled to a hole-free PCB by standard surface-mount technology (SMT), such as pins, lugs, tabs, and test points. A metal or other electrically conductive member having one or more holes ("holed component") is mounted to the PCB, typically on a solder pad on the PCB. The said electrically conductive member, will have a low aspect ratio. The hole, which may be round, rectangular, or threaded, is sized to provide an interference fit with the male projection of the component which will be inserted within the hole. The holed component, like other low aspect ratio SMT components, may be delivered on tape and reel and conventional surface mount or pick and place equipment is used to surface mount the holed component on the hole-free PCB, following which the holed component is soldered in place.Type: GrantFiled: February 27, 1995Date of Patent: March 4, 1997Assignee: Autosplice Systems, Inc.Inventor: Bengt E. Nyman