Abstract: In one embodiment, a semiconductor device having a die attach pad, an interlocking wire bond, a semiconductor die and an adhesive material is disclosed. The adhesive material may be configured to adjoin the semiconductor die and the die attach pad. A portion of the interlocking wire bond may be submerged within the adhesive material. In another embodiment, a device having a semiconductor die, a die attach glue and a die attach pad is disclosed. The device may comprise an interlock bonding structure submerged within the adhesive material. In yet another embodiment, a light-emitting device comprising an interlock structure is disclosed.
Type:
Application
Filed:
February 12, 2014
Publication date:
August 13, 2015
Applicant:
Avago Technologes General IP (Singapore) Pte. Ltd.
Inventors:
Keat Chuan Ng, Kiam Soon Ong, Kheng Leng Tan