Abstract: An optoelectronic device is disclosed. The optoelectronic device may be employed as a single or multi-channel opto-coupler that electrically isolates one circuit from another circuit. The opto-coupler may include one or more folded leads that establish an enhanced isolation gap. The enhanced isolation gap increases the creepage distance of the opto-coupler and increases operational voltages that can be accommodated by the opto-coupler.

Abstract: An optoelectronic device is disclosed. The optoelectronic device may be employed as a single or multi-channel opto-coupler that electrically isolates one circuit from another circuit. The opto-coupler may include one or more premolded cavities with a light-coupling medium contained therein. Walls of the one or more premolded cavities advantageously help shape the light-coupling medium during manufacture, therefore, resulting in a light path with controlled shape and dimensions.

Abstract: In one embodiment, an optical lens assembly comprising a primary lens and an optical structure located at an outer portion of the lens is disclosed. The primary lens is configured to direct a substantial amount of light to a predetermined first distance whereas the optical structure is configured to direct light towards a second distance that is relatively close to the optical lens assembly compared to the first distance. Other embodiments disclose light-emitting devices and proximity sensors having such an optical lens assembly. Alternative embodiments of the optical lens assembly are disclosed, including but not limited to an optical structure defining an optical surface located at a lens flange and optical structure defining a light guide located at a base portion of the optical lens assembly.

Abstract: A semiconductor device and methods of manufacturing the same are disclosed. Specifically, methods and devices for manufacturing opto-couplers are disclosed. Even more specifically, the opto-coupler includes a lens assembly to enhance light coupling efficiency between an optical transmitter and an optical receiver. An encapsulant material may also be utilized.

Abstract: An LED current regulator can regulate an LED current of an encoder system. The LED current regulator may comprise a first analog multiplier and a second analog multiplier. Each of the first and second analog multipliers may be configured to receive respective photodetector output signals, characterized by a peak-to-peak voltage, Vpp, and may be configured to generate respective first and second multiplier output signals. The first and second multiplier output signals may be combined to produce a first DC level, which may be representative of the peak-to-peak voltage, Vpp, of the photodetector output signals.

Abstract: A coding member having a plurality of base structures is illustrated. The base structures are arranged in a predetermined periodic manner and each base structure comprises first and second metal layers. The base structures are embedded in a body made from an encapsulant such that a surface of the first metal layer is exposed externally whereas the second metal layer is completely embedded inside the body. Encoders, having such coding member are illustrated. The encoders include transmissive and reflective optical encoders, as well as non-optical encoders such as magnetic and capacitive encoders.

Abstract: A lighting system and method are disclosed. Specifically, the lighting system includes a hybrid canopy that can provide an optimum light beam shape for a number of different lighting applications. The hybrid canopy is equipped with lighting clusters of different types, thereby enabling a broader beam output without sacrificing beam intensity or brightness.

Abstract: A coupler is disclosed that employs hall-effect sensing technology. Specifically, the coupler is configured to produce an output voltage by converting the magnetic field generated by a current conductor at an input side. The output and input sides may be electrically isolated from one another but may be coupled via the hall-effect sensing technology, such as a hall-effect sensor.

Abstract: Various embodiments of methods and devices are provided for an optocoupler comprising an optically reflective compound comprising silicone and inner and outer surfaces. A molding compound surrounds and encapsulates at least portions of the outer surfaces of the optically reflective compound to form an enclosure. A surface functional coating layer is provided in the optically reflective compound to promote adhesion and increase breakdown voltages between inner walls of the enclosure and the outer surfaces of the optically reflective compound.

Abstract: An offset correction system for correcting signal offset of an encoder. The offset correction system may include a light emitter, an encoder disk, a reticle, a light detector; an offset detection circuit and an offset correction circuit. The offset detection circuit may comprise a comparator and an offset detector configured to receive sinusoidal output signals from the light detector and a reference signal to create digital pulses for determining the signal offset. The offset correction circuit may be configured to apply a gain to correct the offset output signal. The offset correction may be implemented in real time mode.

Abstract: Various embodiments of methods and devices are provided for an optocoupler comprising a layer of dielectric optically semi-reflective and transmissive material disposed between an LED and a first photodetector located above an upper surface of the layer, and a second photodetector located beneath the lower surface of the layer. The layer reflects a first portion of light generated by the LED towards the first photodetector to generate LED feedback control signals, and transmits a second portion of light generated by the LED through the layer for detection by the second photodetector to generate isolated output signals.

Abstract: Various embodiments of methods and devices are provided for a self-aligning pick and place collet having proximal and distal ends configured for use with a tape and reel machine. A suction area is located at a distal end of the collet. A pick and place collet contact area is located adjacent to and outwardly from the suction area, and comprises tapered sidewalls that depend downwardly and outwardly away from the outer periphery of the suction area. The tapered sidewalls and the outer periphery of the suction area are configured and dimensioned to cause an electronic device to substantially self-align and center itself with respect to the collet when engaged thereby.

Abstract: Various embodiments of methods and devices are provided for a thermally-sensitive optocoupler package. A layer in the optocoupler package has an upper surface and a lower surface, and comprises a thermally-sensitive material. In the package, an LED emits infrared or near-infrared light and a photodetector receives at least a portion of such emitted light and in response provides isolated output signals therefrom. The LED is located above the upper surface, and the photodetector is located beneath the lower surface. The thermally-sensitive material is configured such that an amount of light emitted by the LED, incident on the material and the layer, and transmitted through the material and the layer, changes in accordance with changes in ambient temperature or local thermal conditions.

Abstract: Various embodiments of methods and devices are provided for a mutual capacitance touchscreen controller comprising a first on-chip low drop out regulator (LDO) configured to receive and regulate as a first input thereto an input supply voltage (VSUPPLY), and to provide as an output therefrom a first regulated output voltage (VDDA). A first comparator in the controller is configured to receive as first and second inputs thereto VSUPPLY and VDDA and to provide as an output therefrom a signal EN, EN being provided to the first LDO as a second input thereto. The first LDO is configured to operate in a first off mode and is turned off by signal EN when the difference between VSUPPLY and VDDA is less than a predetermined threshold.

Abstract: A semiconductor device and methods of manufacturing the same are disclosed. Specifically, methods and devices for manufacturing optocouplers are disclosed. Even more specifically, methods and devices that deposit one or more encapsulant materials on optocouplers are disclosed. The encapsulant material may include silicone and the devices used to deposit the silicone may be configured to simultaneously deposit the silicone on different sides of the optocoupler, thereby reducing manufacturing steps and time.

Abstract: Disclosed herein are various embodiments of widebody coil isolators containing multiple coil transducers, where integrated circuits are not stacked vertically over the coil transducers. The disclosed coil isolators provide high voltage isolation and high voltage breakdown performance characteristics in small packages that provide a high degree of functionality at a low price.

Abstract: An optical proximity sensor is provided that comprises an infrared light emitter operably connected to and driven by a light emitter driving circuit and a light detector operably connected to and driven by a detector sensing circuit. A metal housing or shield formed of metal and comprising first and second apertures surrounds the light emitter and the light detector such that at least a first portion of light emitted by the light detector passes through the first aperture, and at least a second portion of the first portion of light reflected from an object of interest in proximity to the sensor passes through the second aperture for detection by the light detector. The metal housing or shield further comprises first and second modules within which the light detector and light detector are disposed, respectively.

Abstract: A light-emitting device having at least one spacer located at a bottom surface is disclosed. In two other embodiments, an electronic display system and an electronic system having such light-emitting device are disclosed. The light-emitting device comprises a plurality of leads, a light source die, and a body. The body encapsulates a portion of the plurality of leads and the light source die. The body has a least one side surface and a bottom surface. The at least one spacer is located at the bottom surface. In use, the light-emitting device is attached to a top surface of a substrate. The spacer is configured to create an air vent between the bottom surface and the top surface of the substrate when the light-emitting device is attached to, and the spacer is in contact with the substrate.

Abstract: Disclosed are various embodiments of a navigation input device, and methods, systems and components corresponding thereto. According to some embodiments, the navigation input device has a large depth of field associated therewith and employs time- and/or frequency-domain processing algorithms and techniques. The device is capable of providing accurate and reliable information regarding the (X,Y) position of the device on a navigation surface as it is moved laterally thereatop and thereacross, notwithstanding changes in a vertical position of the device that occur during navigation and that do not exceed the depth of field of an imaging lens incorporated therein. According to one embodiment, the navigation input device is a writing instrument that does not require the use of an underlying touch screen, touch pad or active backplane to accurately and reliably record successive (X,Y) positions of the writing device as it is moved across and atop an underlying writing medium.

Abstract: An optical navigation device includes an image sensor, a light source, and illumination optics. The image sensor generates images of a tracking surface. The image sensor has a field of view via imaging optics interposed between the image sensor and the tracking surface. The light source generates light to illuminate a portion of the tracking surface. The illumination optics are interposed between the light source and the tracking surface to direct the light from the light source toward the tracking surface. The illumination optics include an output surface with a primary region illuminated above a threshold intensity. The illumination optics are located relative to the tracking surface so that an image of the output surface excludes the primary region from the field of view of the image sensor.