Abstract: A diffractive coupling element based on a computer-generated hologram is used in an optical coupling system of a transmitter to control the launch of laser light from a laser light source onto an end of an optical fiber. The diffractive coupling element controls the launch of the laser light such that a desired optical intensity distribution pattern is provided that substantially avoids the center and edge refractive index defects contained in the optical fiber.

Abstract: An optical transceiver module is provided that has a pivoting bail latching mechanism that is extremely stiff and locks via a cam locking configuration rather than relying on spring-loading forces to bias the latching mechanism to and maintain the latching mechanism in a desired position. The stiffness of the pivoting bail latching mechanism provided by the cam locking configuration better ensures that forces exerted the transceiver module will not cause the transceiver module to come out of the cage while latched.

Abstract: D-shaped POFs are used to form a 2-to-1 optical coupler. The D-shaped POFs are produced via an extrusion process that is relatively inexpensive to perform and that can be performed with relatively high manufacturing throughput. The D-shaped POFs are bonded together to form a coupler end face having a generally circular cross-sectional area. The coupler end face is interfaced with an end face of a main POF that is generally circular in cross-sectional shape. The resulting D-shaped 2-to-1 optical POF couplers have relatively low insertion loss and relatively high optical coupling efficiency.

Abstract: A connector having a Ball-Grid Array on one side of a connector circuit board and a socket recess on the other side of the connector circuit board can be used to mate an opto-electronic transceiver module to a system circuit board. A base portion of the transceiver module can be received in the socket recess. Within the socket recess, an exposed portion of the connector circuit board has an array of resilient conductive contacts corresponding to an array of conductive pads on the lower surface of the base portion of the transceiver module.

Abstract: An optical communications system is provided in which module locating pins of the system mate with inwardly-shaped corners formed on parallel optical transceiver modules of the system when the parallel optical transceiver modules are mounted on a mid-plane mounting structure of the system. The inwardly-shaped corners of the parallel optical transceiver modules are complementary in shape to portions of the module locating pins. The mating of the module locating pins with the inwardly-shaped corners of the modules operates to passively position the modules at intended spatial locations relative to each other and relative to the mid-plane mounting structure. The inwardly-shaped corners consume very little space in the modules and the pins consume very little space in the optical communications system. Consequently, the pitch between adjacent parallel optical transceiver modules can be kept very small and the mounting density of the modules on the mid-plane mounting structure can be very high.

Abstract: Disclosed are various embodiments of an optical wavelength division demultiplexer or multiplexer sub-assembly configured to receive or transmit optical signals conveyed thereto or therefrom by a fiber optic cable. Selected portions of external surfaces of the sub-assembly are coated with an electrically conductive paint, polymer or adhesive to provide an EMI, EMP or ESD shield. Typically, the sub-assembly comprises an integrally molded plastic optical block and a separate integrally molded coupling module with a ferrule and fiber optic cable receptacle. In one embodiment, selected external surfaces of the optical block and coupling module are coated with a coating having a predetermined electrical conductivity to provide a desired degree of EMI, EMP or ESD shielding.

Abstract: A low cost, high speed, short haul, optic interconnect and data link which employs an array of vertical cavity surface emitting laser (VCSEL) arrays through which several optical signals are simultaneously transmitted through collimating optics that generate multiple, multiple-wavelength optical signals. Each combined optical signal is transmitted to a receiver array comprising a plurality of optical filters and photodetector arrangements that have a number of sections, each having an optical filter to pass a specific optical wavelength, and a mating photodetector element to convert the specific optical signal to an electrical signal. The signals may be coupled between the transmitter array and the receiver array through free space or through optical fibers.

Abstract: A molded interconnect device (MID) optical connector includes a molded plastic body and a metal retaining clip. The body has a receptacle portion shaped to receive and guide a mating optical fiber ferrule into a connected position. In the connected position, the end of a fiber retained in the ferrule is in optical alignment with an opto-electronic device in the MID optical connector. The retaining clip has one or more contact portions that extend into the receptacle portion of the body and exert a spring force upon the ferrule to retain and stabilize it in the connected position.

Abstract: A wirebond protector has an elongated shape that corresponds to the elongated array of wirebonds along the edge of a microelectronic device that connect a semiconductor die to electrical conductors on a substrate. In making the microelectronic device with wirebond protection, wirebonds are first formed in the conventional manner The wirebond protector is then attached to the device in an orientation in which it extends along the array of wirebonds to at least partially cover the wirebonds.

Abstract: A first signal shaper generates a first signal having a first asymmetry. A second signal shaper generates a second signal having a second asymmetry different from the first asymmetry. The first and second signals have approximately the same peak-to-peak amplitude. An AC measurement element acquires a first scaled representation of the shape of the first signal and a second scaled representation of the shape of the second signal. A DC measurement element receives the first signal and the second signal and generates a first value responsive to the first signal and a second value responsive to the second signal. A processor calculates a first factor responsive to the shape of the first signal and a second factor responsive to the shape of the second signal. The processor applies the first and second factors and the first and second values in a function that generates the AC/DC cross-calibration coefficient.

Abstract: A USB connector is provided that has an OE module and high-speed electrical connections integrated therein. The OE module includes an optical module, at least one laser diode, at least one photodiode, an optical transceiver IC, and a PCB. The optical module, the laser diode, the photodiode, and the IC are mounted on a surface of the PCB. The OE module is secured within the USB connector. The PCB includes conductive traces and electrical contact pads. The conductive traces electrically connect the IC with the contact pads. The contact pads are electrically connected via through holes formed in the PCB to the high-speed electrical connections, which, in turn, are electrically connected to conductive traces of a motherboard or a computer.

Abstract: A 2-to-1 POF optical coupler, a bi-directional link that employs the coupler, and methods for performing 2-to-1 optical coupling are provided, wherein the 2-to-1 POF optical coupler is configured to provide a carefully-selected amount of cross-sectional overlap at the interface between the end face of a main POF or POF pigtail and the end face of the coupler. The amount of overlap is selected to ensure that optical coupling losses are reduced and optical efficiency is increased in both directions in a bi-directional optical communications links. Consequently, signal integrity is improved, limitations on link length are relaxed, and overall link performance is improved while, at the same time, overall link costs are reduced.

Abstract: The device is an optoelectronic device or transparent waveguide device that comprises a growth surface, a growth mask, an optical waveguide core mesa and a cladding layer. The growth mask is located on the semiconductor surface and defines an elongate growth window having a periodic grating profile. The optical waveguide core mesa is located in the growth window and has a trapezoidal cross-sectional shape. The cladding layer covers the optical waveguide core mesa and extends over at least part of the growth mask. Such devices are fabricated by providing a wafer comprising a growth surface, growing an optical waveguide core mesa on the growth surface by micro-selective area growth at a first growth temperature and covering the optical waveguide core mesa with cladding material at a second growth temperature, lower than the first growth temperature.

Abstract: An optics system is provided that is made up of a single diffractive optical element that performs beam collimating, beam splitting, and light blocking functions. The diffractive optical element is made up of a substrate having a first surface comprising an entrance facet and a second surface comprising an exit facet. The first surface comprising the entrance facet performs at least the functions of collimating the beam of light produced by the light source and of tilting the collimated beam in a particular direction. The second surface comprising the exit facet performs at least the functions of splitting the tilted collimated beam into at least two collimated light beams and of blocking unintended light (i.e., one or more mode order groups that are not intended to be used for imaging purposes). By performing all of these functions on different surfaces of a single substrate, an extremely compact optics system having very high optical efficiency and a very high signal-to-noise ratio is realized.

Abstract: Semiconductor devices and a method for generating light in a semiconductor device are invented and disclosed. The method includes the steps of forming a vertical cavity surface emitting laser including an active region and an oxide layer, the active region separated from the oxide layer and configured to generate light in response to an injected current and introducing an implant layer adjacent and underneath the oxide layer to confine the injected current to a region of the device where charge carriers are combining to generate light. The semiconductor devices include an implant layer between the oxide layer and the active region. The implant layer prevents lateral leakage current from exiting a region of the device where charge carriers are combining to generate light.

Abstract: A method and apparatus for use in an optical receiver are provided for monitoring the received optical power in the optical receiver over wide range of optical power levels with high accuracy. An adjustable resistor circuit of the apparatus has a first resistor and one or more second resistors that may be switched into and out of parallel with the first resistor to vary the resistance of the adjustable resistor circuit. A controller of the optical receiver controls the switching of the one or more second resistors into and out of parallel with the first resistor. Varying the resistance of the adjustable resistor circuit in this manner causes the value of the analog voltage signal representing the received optical power to be varied prior to being input to the ADC of the controller. In this way, the amplitude of the analog voltage signal is reduced when it is at the high end of the received power range so as not to exceed the input range of the ADC of the controller IC.

Abstract: A torpedo is provided for use in pulling an optical communications device through ducts, vents, pipes, and the like. The torpedo has at least one mating feature formed thereon that mates with at least one mating feature formed on a boot of an optical fiber cable when the torpedo is attached to the boot. The mating feature formed on the torpedo is typically a key and the mating feature formed on the boot is typically a keyway having a shape that is complementary to the shape of the key. The mating of the key and keyway eliminate the need to use a clamping force to ensure that the grip between the torpedo and the cable will not be lost or compromised when the torpedo is being pulled. The boot of the optical fiber cable may be a standard boot of a standard optical fiber cable, and therefore does not need to be a specialized boot designed specifically for the purpose of attaching to a torpedo.

Abstract: A wirebond protector has an elongated shape that corresponds to the elongated array of wirebonds along the edge of a microelectronic device that connect a semiconductor die to electrical conductors on a substrate. In making the microelectronic device with wirebond protection, wirebonds are first formed in the conventional manner The wirebond protector is then attached to the device in an orientation in which it extends along the array of wirebonds to at least partially cover the wirebonds.

Abstract: A controllable delay element is coupled in parallel with a calibration circuit. The calibration circuit receives a periodic reference signal and generates a series of sample voltages responsive to a time-varying analog voltage, the periodic reference signal, and the delayed periodic signal at the output of the controllable delay element. The calibration circuit distributes the series of sampled voltages for determining the components of a first vector. The first vector components are used to calculate the phase that results from a control signal applied to the controllable delay element. After the control signal is modified, a second vector is used to calculate the phase that results from the control signal. The delay can be determined by the product of the period of the reference signal and the difference in phase.

Abstract: A digital image process for a digital camera contains a preprocessor and a postprocessor. The preprocessor can include, for example, a uniformity corrector, a sampling filter, a modulation transformer, and a ditherer. The postprocessor can include a color interpolator, an RGB reconstruction block, a digital compressor, and a color pattern data buffer. The digital image process is programmable to operate one or more of the processing blocks of one or both the preprocessor and the postprocessor for flexible programming that can adapt to the requirements of various digital camera designs or users.