Abstract: An apparatus comprises a substrate, a dielectric disposed on the semiconductor substrate, an acoustic resonator disposed on the dielectric, and an electrical interconnect disposed in the dielectric and configured to transmit an electrical signal to or from at least one electrode of the acoustic resonator through a signal path disposed at least partially below a level of the acoustic resonator.
Type:
Grant
Filed:
May 28, 2014
Date of Patent:
October 17, 2017
Assignee:
AVAGO TECHNOLOGIES GENERAL IP SINGAPORE (SINGAPORE) PTE. LTD.