Abstract: A housing that includes separated and removable transmitter modules, and common receiver circuitry. The receiver is common to all modules, but the modules can be removed and replaced to allow different frequencies and the like. Each module also includes its own heat handling mechanism such as a heat sink.
Abstract: In an optoelectronic module (1) comprising a plastics material package (2) accommodating a base (8) fixed to the package (2) and supporting an optical component (9) coupled by an optical fiber (5) to an optical connector (4) of the package (2), fiber displacements associated with thermal stresses are avoided by mounting the base so that it floats on the package (2) and possibly the connector (4). The floating mounting of the base (8) is obtained by using for fixing the base one or more adhesives (13, 14) having a greater elasticity than the adhesives used to fix each of the two ends (6, 7) of the fiber (5) to the base (8) and the connector (4), respectively.
Type:
Grant
Filed:
May 22, 2002
Date of Patent:
May 18, 2004
Assignee:
Avanex Corp.
Inventors:
Sylvaine Kerboeuf, Emmanuel Grard, Claude Artigue, Pierre Jean Laroulandie, Alwin Goeth, Klaus Adam