Abstract: The present invention is a supplemental waterproof housing that completely surrounds a camera device, and it encloses an integrated and removable supplemental external battery and supplemental memory storage inside the external housing, and provides for a mounting point for lenses, filters or adaptors and handles attached to outside to the external housing. The internal compartment of the housing encloses an inner housing that holds the camera, and allows easy connections to the removable memory chips and removable battery packs through coupling adapters, connectors and bridges, which is all integrated into and enclosed by the external housing. The present invention also allows access to the internal compartment with one side of the inner housing providing a seal on one side of the waterproof housing, which is secured through waterproof seals, couplings and latches on the outside of the housing.
Type:
Grant
Filed:
September 9, 2016
Date of Patent:
October 16, 2018
Assignee:
Avant Technology, Inc.
Inventors:
Tim Peddecord, Justin M. Goodwin, Paul M. Goodwin
Abstract: The present invention is a supplemental waterproof housing that completely surrounds a camera device, and it encloses an integrated and removable supplemental external battery and supplemental memory storage inside the external housing, and provides for a mounting point for lenses, filters or adaptors and handles attached to outside to the external housing. The internal compartment of the housing encloses an inner housing that holds the camera, and allows easy connections to the removable memory chips and removable battery packs through coupling adapters, connectors and bridges, which is all integrated into and enclosed by the external housing. The present invention also allows access to the internal compartment with one side of the inner housing providing a seal on one side of the waterproof housing, which is secured through waterproof seals, couplings and latches on the outside of the housing.
Type:
Application
Filed:
September 9, 2016
Publication date:
March 16, 2017
Applicant:
Avant Technology, Inc.
Inventors:
Tim Peddecord, Justin M. Goodwin, Paul M. Goodwin
Abstract: A high speed, high reliability circuit module and connective strategy that is connectively compliant with a receptacle in compliance with the SFF-8639 Specification whether expressing for example a PCIe interface or a high speed SAS interface. The present invention reduces impedance discontinuity by reducing the interconnection length and cross-planar transit found in typical specification compliant connectors.
Abstract: A high speed, high reliability circuit module and connective strategy that is connectively compliant with a receptacle in compliance with the SFF-8639 Specification whether expressing for example a PCIe interface or a high speed SAS interface. The present invention reduces impedance discontinuity by reducing the interconnection length and cross-planar transit found in typical specification compliant connectors.