Patents Assigned to Avery Dennison Corporation
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Patent number: 11926755Abstract: Coated substrates comprising a topcoat are disclosed. The coated substrate may be substantially free of PVC while having performance comparable to a coated substrate comprising PVC. The topcoat may comprise a base polymer comprising a polyvinylpyrrolidone copolymer, such as polyvinylpyrrolidone/vinyl acetate. The base polymer may also comprise a cationic acrylic resin. The topcoat may also comprise a pigment system and optionally, a crosslinking system.Type: GrantFiled: September 13, 2019Date of Patent: March 12, 2024Assignee: Avery Dennison CorporationInventor: Dhananjay Patil
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Patent number: 11919672Abstract: An apparatus can comprise a first hollow needle and a first ejector pin with a first portion of an outer peripheral surface comprising a stepped recess from the second portion of the outer peripheral surface. In some embodiments, the apparatus may further comprise a second hollow needle. In some embodiments, a first end portion of the cap can be configured for mounting to a nose of the apparatus. The cap can comprise the aperture that may be sized for insertion of the tip of the first hollow needle through the aperture when the cap is removed from the nose. In some embodiments, a nose of the apparatus can comprise a first support surface facing an outer direction and a second support surface facing the outer direction and protruding from the first support surface in the outer direction.Type: GrantFiled: April 8, 2020Date of Patent: March 5, 2024Assignee: Avery Dennison CorporationInventors: Robert C. Uschold, Soniya Soniya
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Patent number: 11885456Abstract: A multilayer tape assembly is described which can be used with insulation jacketing and particularly for self-sealing lap (SSL) applications. The tape assembly includes two adhesive layers with associated carrier and release layers in conjunction with a differential release system. Various methods of use are also described, including a method of insulating an object.Type: GrantFiled: June 9, 2021Date of Patent: January 30, 2024Assignee: Avery Dennison CorporationInventor: David J. Shuey
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Patent number: 11872829Abstract: A protective film that can be included in multi-layer film laminates for use in marketing, advertising campaigns, particularly outdoor or other environment impacted promotions and safety applications. The film includes at least two different polyurethane polymers and is free or substantially free of polyvinyl chloride based polymer. One polyurethane has an ultimate elongation less than 200%, and another polyurethane has an ultimate elongation more than 400%. The film may be transparent, translucent, clear or have other desirable optical properties.Type: GrantFiled: September 16, 2022Date of Patent: January 16, 2024Assignee: Avery Dennison CorporationInventors: Jason Schaner, Michael Ramsay, Steven Reekmans, Xiang Liu
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Patent number: 11852275Abstract: A multilayer tape assembly is described which can be used with insulation jacketing and particularly for self-sealing lap (SSL) applications. The tape assembly includes two adhesive layers with associated carrier and release layers in conjunction with a differential release system. Various methods of use are also described, including a method of forming a securable insulation jacket.Type: GrantFiled: June 9, 2021Date of Patent: December 26, 2023Assignee: Avery Dennison CorporationInventor: David J. Shuey
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Patent number: 11798438Abstract: An adhesive article includes a polymeric layer, a haptic layer disposed adjacent a first major surface of the polymeric layer, and an adhesive layer disposed adjacent a second major surface of the polymeric layer. The haptic layer includes a predetermined amount of at least one release agent. A method of forming the adhesive article includes providing the polymeric layer, disposing the haptic layer over and directly on the polymeric layer, and disposing the adhesive layer over and directly on the polymeric layer opposite the haptic layer.Type: GrantFiled: May 19, 2022Date of Patent: October 24, 2023Assignee: Avery Dennison CorporationInventors: Dennis M. Liebman, Dean T. Dupont
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Patent number: 11787214Abstract: Microporous structures in face films are described for improving printability of the films. Also described are laminates and pressure sensitive adhesive laminates including the microporous structured face films. Various related methods are additionally described.Type: GrantFiled: December 28, 2018Date of Patent: October 17, 2023Assignee: Avery Dennison CorporationInventors: David Bland, Wen-Li Chen, Michael Ramsay, Shanshan Wang
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Patent number: 11763127Abstract: Identification labels and their incorporation in rubber-based articles are described. The labels include RFID components and can be incorporated in tires. The labels can withstand the relatively harsh conditions associated with vulcanization.Type: GrantFiled: October 5, 2022Date of Patent: September 19, 2023Assignee: Avery Dennison CorporationInventors: Pavel Janko, Denis Markov
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Patent number: 11735070Abstract: According to an embodiment of the present disclosure, a method of labeling a plurality of products includes coating a pressure sensitive adhesive to a roll of face stock, the roll of face stock configured to be converted to a plurality of individual labels aligned in a single lane; singulating an individual label from the roll of face stock; and applying the individual label to a product of the plurality of products, wherein the coating, singulating and applying are conducted sequentially in a single continuous operation with a single continuous web of material.Type: GrantFiled: September 2, 2020Date of Patent: August 22, 2023Assignee: Avery Dennison CorporationInventors: Prakash Mallya, David Nicholas Edwards
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Patent number: 11717593Abstract: Various adhesive compositions are described which may optionally comprise one or more active agents such as pharmaceutical agents. The incorporation of one or more absorbents in combination with one or more crystallization inhibitors improves adhesive characteristics of the compositions. Also described are related methods of improving adhesive characteristics of adhesive compositions with the use of a combination of absorbent and inhibitor. Also described are related methods of using the compositions and articles incorporating such compositions.Type: GrantFiled: March 13, 2014Date of Patent: August 8, 2023Assignee: Avery Dennison CorporationInventor: Neal Carty
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Patent number: 11713406Abstract: Vibration damping viscoelastic damping material laminates are described. The tapes generally include at least two viscoelastic damping material layers and at least one substrate. The tapes may optionally include one or more release liners. Also described are constrained layer systems formed by adhering the tape to a first substrate and/or second substrate undergoing vibration.Type: GrantFiled: September 20, 2017Date of Patent: August 1, 2023Assignee: Avery Dennison CorporationInventors: Henry W. Milliman, Joseph L. Meckler, Mahesh Ganesan, Luke N. Johnson
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Patent number: 11707549Abstract: Methods for forming and incorporating microparticles containing one or more active agents into adhesives are described. The methods involve spray drying a liquid of the one or more active agents and obtaining the active agent in a particulate form. The dry powder is then blended or otherwise incorporated with the adhesive of interest. Also described are various medical products utilizing the adhesive and one or more active agents in microparticle form, and related methods of use.Type: GrantFiled: May 20, 2021Date of Patent: July 25, 2023Assignee: Avery Dennison CorporationInventors: Anne Marie Wibaux, Peter Johnson
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Patent number: 11701863Abstract: Provided herein are multilayer damping laminates comprising at least one constraining layer and at least one discontinuous damping layer. At least one discontinuous damping layer comprises one or more damping material regions and one or more gap regions, wherein the percent coverage of at least one discontinuous damping layer by one or more damping material regions is less than 99%. Also provided are systems and methods using the multilayer damping laminates.Type: GrantFiled: May 15, 2019Date of Patent: July 18, 2023Assignee: Avery Dennison CorporationInventors: Henry W. Milliman, Mahesh Ganesan
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Patent number: 11684020Abstract: A fastener device adapted for attaching at least one tag (or other identifier) to an object. The fastener device comprises a T-bar component, a paddle component, and a filament component flexibly attached to both the T-bar component on one end and the paddle component on the other end. In some embodiments, the fastener device is deployable via a fastener dispensing device comprising a needle designed to puncture a hole in at least one tag and the object while also inserting the T-bar component through the hole. Once inserted, the paddle component exerts a cantilever spring force against at least one tag holding the tag(s) securely against the object.Type: GrantFiled: November 16, 2021Date of Patent: June 27, 2023Assignee: Avery Dennison CorporationInventors: David L. Schuttler, Charles J. Burout, III
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Patent number: 11685841Abstract: Cure in place pressure sensitive adhesive compositions are described that comprise one or more of a bodying component, a structural diluent, a radical diluent as well as additives such as crosslinkers, external catalysts, photoinitiators and stabilizers/process aids. The bodying component can be acrylic or non-acrylic.Type: GrantFiled: April 29, 2021Date of Patent: June 27, 2023Assignee: Avery Dennison CorporationInventors: Michael Zajaczkowski, Michael T. Waterman, Kyle R. Heimbach, Eric L. Bartholomew, Brandon S. Miller
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Patent number: 11661533Abstract: Pressure sensitive adhesives that include hyperbranched silsesquioxane-core polymers are described. Also described are various methods for producing the noted polymers and pressure sensitive adhesives. In addition, a variety of articles including tapes utilizing the pressure sensitive adhesives are described.Type: GrantFiled: July 24, 2018Date of Patent: May 30, 2023Assignee: Avery Dennison CorporationInventor: Ranjit Malik
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Patent number: 11661532Abstract: Adhesives for use in polishing pads in chemical mechanical planarization (CMP) applications are described. The adhesives include an adhesive component and exhibit particular properties. Also described are transfer tapes containing the adhesives, CMP pads utilizing the adhesives, and related methods of use.Type: GrantFiled: June 7, 2016Date of Patent: May 30, 2023Assignee: Avery Dennison CorporationInventors: Josh M. Bogner, Dong-Tsai Hseih
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Patent number: 11590255Abstract: Adhesives comprising rubber, tackifier, oil, and optionally absorbent and active ingredient are described. The adhesives are suitable for medical applications as they are repositionable on skin. Also described are medical articles using the adhesives.Type: GrantFiled: November 10, 2017Date of Patent: February 28, 2023Assignee: Avery Dennison CorporationInventors: Xianbo Hu, Neal Carty
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Patent number: D1002354Type: GrantFiled: October 15, 2021Date of Patent: October 24, 2023Assignee: Avery Dennison CorporationInventor: Robert Charles Uschold
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Patent number: D1003153Type: GrantFiled: October 11, 2021Date of Patent: October 31, 2023Assignee: Avery Dennison CorporationInventor: Robert Charles Uschold