Abstract: This invention features a disc refacing system, comprising a rotatable platter for holding a disc thereon, a grinding pad assembly, and a polishing pad assembly. Each pad assembly can be rotated at high speed. Each pad assembly can be alternately engaged with the disc on the platter. The platter and a pad assembly can be alternately engaged and disengaged, to allow a disc to be loaded and unloaded from the platter. There is a source of grinding compound, which can be applied to the grinding pad assembly.