Abstract: This disclosure provides a method and apparatus for a single pair Ethernet (SPE) wire-to-board connector. The SPE connector may include a female connector portion and a male connector portion. The female connector portion may include a first electrical contact having a first press-fit pin and a first female portion, a second electrical contact having a second press-fit pin and a second female portion, and a first outer shield, the first outer shield mechanically secured to the first insulative housing. The first and second electrical contacts may be positioned partially within the first insulative housing. The male connector portion includes a third electrical contact comprising a first insulation displacement contact (IDC) portion and a first male portion, a fourth electrical contact comprising a second DC portion and a second male portion, and a second outer shield, the second outer shield mechanically secured to a second insulative housing.

Abstract: An antenna system is provided. The antenna system includes a circuit board. The antenna system further includes a first antenna structure and a second antenna structure. The first antenna structure is positioned between the circuit board and the second antenna structure such that the first antenna structure forms a ground plane for the second antenna structure. In addition, the first antenna structure is electrically coupled to the circuit board via a first conductive path. The second antenna structure is electrically coupled to the circuit board via a second conductive path extending through an opening defined by the first antenna structure.

Abstract: The present invention is directed to a multilayer ceramic capacitor. A plurality of active electrodes may be arranged within a monolithic body of the capacitor and parallel with a longitudinal direction. A first shield electrode may be arranged within the monolithic body and parallel with the longitudinal direction. The first shield electrode may be connected with a first external terminal. The first shield electrode may have a first longitudinal edge and a second longitudinal edge that are each aligned with the lateral direction and face away from the first external terminal. The second longitudinal edge may be offset in the longitudinal direction from the first longitudinal edge by a shield electrode offset distance. A second shield electrode may be connected with a second external terminal. The second shield electrode may be approximately aligned with the first shield electrode in the Z-direction.

Abstract: Improved termination features for multilayer electronic components are disclosed. Monolithic components are provided with plated terminations whereby the need for typical thick-film termination stripes is eliminated or greatly simplified. Such termination technology eliminates many typical termination problems and enables a higher number of terminations with finer pitch, which may be especially beneficial on smaller electronic components. The subject plated terminations are guided and anchored by exposed internal electrode tabs and additional anchor tab portions which may optionally extend to the cover layers of a multilayer component. Such anchor tabs may be positioned internally or externally relative to a chip structure to nucleate additional metallized plating material. External anchor tabs positioned on top and bottom sides of a monolithic structure can facilitate the formation of wrap-around plated terminations.

Abstract: A broadband multilayer ceramic capacitor may include a monolithic body including a plurality of dielectric layers stacked in the Z-direction, a first external terminal, and a second external terminal. A plurality of active electrodes, a bottom shield electrode, and a top shield electrode may be arranged within the monolithic body. The top shield electrode may be positioned between the active electrodes and a top surface of the capacitor and spaced apart from the top surface of the capacitor by a top-shield-to-top distance. A bottom shield electrode may be positioned between the active electrodes and the bottom surface of the capacitor and spaced apart from the bottom surface of the capacitor by a bottom-shield-to-bottom distance. A ratio of the top-shield-to-top distance to the bottom-shield-to-bottom distance may be between about 0.8 and about 1.2. The bottom-shield-to-bottom distance may range from about 8 microns to about 100 microns.

Abstract: A multilayer filter may include a plurality of dielectric layers stacked in a Z-direction. A first conductive layer may overlie one of the dielectric layers, and a second conductive layer may overlie another of the dielectric layers and be spaced apart from the first conductive layer in the Z-direction. A first via may be connected with the second conductive layer at a first location. A second via may be connected with the second conductive layer at a second location that is spaced apart in a first direction from the first location. The first conductive layer may overlap the second conductive layer at an overlapping area to form a capacitor. At least a portion of the overlapping area may be located between the first location and the second location in the first direction. The second conductive layer may be free of via connections that intersect the overlapping area.

Abstract: A solid electrolytic capacitor containing a capacitor element is provided. The capacitor element contains a sintered porous anode body, a dielectric that overlies the anode body, a solid electrolyte that overlies the dielectric, and an external polymer coating that overlies the solid electrolyte and includes conductive polymer particles.

Abstract: A capacitor comprising a solid electrolytic capacitor element that contains a sintered porous anode body, a dielectric film that is formed by sequential vapor deposition and overlies the anode body, and a solid electrolyte that overlies the dielectric film is provided. A method for forming a solid electrolytic capacitor element is also provided.

Abstract: A capacitor assembly that is capable of exhibiting good electrical properties even under a variety of conditions is provided. More particularly, the capacitor contains a capacitor element that includes a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte that overlies the dielectric. The solid electrolyte contains an adhesion layer that is positioned between an inner conductive polymer layer and an outer conductive polymer layer. The adhesion layer is formed from an organometallic compound and the outer layer is formed from pre-polymerized conductive polymer particles.

Abstract: Discrete cofired feedthrough filters are provided for medical implanted device applications. A plurality of discrete vertical feedthrough filter elements are respectively associated with a plurality of signal wires or pins otherwise supported by an insulating feedthrough and a ferrule. The resulting discrete device comprises a single-element device which is cheaper to make, and which reduces cross-talk between adjacent signal wires/pins while otherwise accommodating changes in feedthrough pitch without having to redesign the filter.

Abstract: A capacitor comprising a solid electrolytic capacitor element that a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte is provided. The solid electrolyte contains an interior conductive polymer film that overlies the dielectric, which may be formed by sequential vapor deposition. An exterior conductive polymer layer also overlies the interior conductive polymer film.

Abstract: The present invention is directed to a surface mount coupling capacitor and a circuit board containing a surface mount coupling capacitor. The coupling capacitor includes a main body containing at least two sets of alternating dielectric layers and internal electrode layers. The coupling capacitor includes external terminals electrically connected to the internal electrode layers wherein the external terminals are formed on a top surface of the coupling capacitor and a bottom surface of the coupling capacitor opposing the top surface of the coupling capacitor.

Abstract: A supercapacitor module is provided. In some implementations, the supercapacitor module may include a first supercapacitor having a first parameter value for a capacitor parameter in a first test condition. The supercapacitor module may include a second supercapacitor having a second parameter value for the capacitor parameter in about the first test condition. A ratio of the second parameter value to the first parameter value may be from about 0.8 to about 1.2. The supercapacitor module may prevent overvoltages across the first and second supercapacitors, such that the supercapacitor module may satisfactorily operate without a balancing circuit.

Abstract: A thermal connector comprising an electrically insulating beam having a first end face at a first end and a second end face at a second end is provided. The second end face may be opposite the first end face in an X direction. The beam may have a width in a Y direction perpendicular to the X direction. The beam may also have a top face and a bottom face offset from the top face in a Z direction. The thermal connector may include a first terminal attached to the bottom face and adjacent the first end and a second terminal attached to the top face and adjacent the first end. The connector may have an overall thickness in the Z direction, which includes the first and second terminals and is greater than 1.27 mm and less than 3.81 mm.

Abstract: A solid electrolytic capacitor containing a capacitor element is provided. The capacitor element contains a sintered porous anode body, a dielectric that overlies the anode body, a solid electrolyte that overlies the dielectric that includes conductive polymer particles that contain a complex formed from a thiophene polymer and a copolymer counterion, and an external polymer coating that overlies the solid electrolyte and includes conductive polymer particles.

Abstract: A high frequency multilayer filter may include a plurality of dielectric layers and a signal path having an input and an output. The multilayer filter may include an inductor including a conductive layer formed over a first dielectric layer. The inductor may be electrically connected at a first location with the signal path and electrically connected at a second location with at least one of the signal path or a ground. The multilayer filter may include a capacitor including a first electrode and a second electrode that is separated from the first electrode by a second dielectric layer. The multilayer filter has a characteristic frequency that is greater than about 6 GHz.

Abstract: A multilayer filter may include a dielectric layer having a top surface, a bottom surface, and a thickness in a Z-direction between the top surface and the bottom surface. The multilayer filter may include a conductive layer formed on the top surface of the dielectric layer. The multilayer filter may include a via assembly formed in the dielectric layer and connected to the conductive layer on the top surface of the dielectric layer. The via assembly may extend to the bottom surface of the dielectric layer. The via assembly may have a length in the Z-direction and a total cross-sectional area in an X-Y plane that is perpendicular to the Z-direction. The via assembly may have an area-to-squared-length ratio that is greater than about 3.25.

Abstract: A high power thin film filter is disclosed includes a substrate having a substrate thickness in a Z-direction between a first surface and a second surface. A thin film capacitor may be formed over the first surface. A thin film inductor may be spaced apart from the thin film capacitor by at least the thickness of the substrate. A via may be formed in the substrate that electrically connects the thin film capacitor and the thin film inductor. The via may include a polymeric composition.

Abstract: A solid electrolytic capacitor containing a capacitor element is provided. The capacitor element contains a sintered porous anode body, a dielectric that overlies the anode body, and a solid electrolyte that overlies the dielectric that includes a conductive polymer. The capacitor does not exhibit an anomalous charging current when charged at a constant voltage rate increase of 120 volts per second, as determined at an operating frequency of 120 Hz and temperature of about 23° C.

Abstract: A filter assembly is disclosed that includes a monolithic filter having a surface and a heat sink coupled to the surface of the monolithic filter. The heat sink includes a layer of thermally conductive material that can have a thickness greater than about 0.02 mm. The heat sink may provide electrical shielding for the monolithic filter. In some embodiments, the filter assembly may include an organic dielectric material, such as liquid crystalline polymer or polyphenyl ether. In some embodiments, the filter assembly may include an additional monolithic filter.