Abstract: The present invention concerns the field of solid state capacitors and in particular high performance capacitors for use in modern electronic devices. Specifically, the present invention relates to a method by which powders of valve-action material may be modified to make them suitable for use in the formation of capacitor anodes for solid state electrolytic capacitors. According to the present invention there is provided a method of modifying raw valve-action material powder into capacitor grade structured powder comprising: (i) providing a raw powder to be converted; (ii) compressing a portion of the powder to form a porous solid mass of powder (iii) heating the solid mass to a pre-determined sintering temperature and maintaining the temperature for a pre-determined time period to form a sintered body, (iv) pulverising the sintered body to form a processed powder and (v) optionally grading the powder particles within pre-determined size ranges so as to collect capacitor grade powder.

Abstract: Manufacturing multiple solid state capacitors includes providing a metal substrate layer; forming on an upper surface of the substrate layer a plurality of upstanding bodies consisting of porous sintered valve-action metal; forming a dielectric layer on the bodies; forming a cathode layer on the dielectric layer; coating a top end of each upstanding body with at least one conducting intermediary layer by liquid or vapor phase deposition or by application of an immobilized flowable composition such as a solidifiable paste; forming an intimate physical contact between the cathode layer and the intermediate layer; encapsulating side walls of each body with an electrically insulating material; and dividing the processed substrate into a plurality of individual capacitor bodies each having a sleeve of encapsulating material, an anode terminal surface portion at one end consisting of exposed substrate and a cathode terminal surface portion at the other end consisting of exposed intermediary layer.

Abstract: The present invention concerns the field of solid state capacitors and in particular high performance capacitors for use in modern electronic devices. Specifically, the present invention relates to a method by which powders of valve-action material may be modified to make them suitable for use in the formation of capacitor anodes for solid state electrolytic capacitors. According to the present invention there is provided a method of modifying raw valve-action material powder into capacitor grade structured powder comprising: (i) providing a raw powder to be converted; (ii) compressing a portion of the powder to form a porous solid mass of powder (iii) heating the solid mass to a pre-determined sintering temperature and maintaining the temperature for a pre-determined time period to form a sintered body, (iv) pulverising the sintered body to form a processed powder and (v) optionally grading the powder particles within pre-determined size ranges so as to collect capacitor grade powder.

Abstract: The present invention concerns methodologies for the mass production of solid state components, in particular capacitors, although other component types including, but not limited to, diodes and resistors may be produced. According to one aspect of the method of manufacturing first and second substrates are provided with a plurality of first and second solid state electronic component elements formed on a surface of each substrate. The first and second substrates are aligned so that respective first and second component elements are each mutually aligned, and the first and second substrates are fixed together, so that the first and second elements are operatively connected one to another, thereby forming a substrate sandwich. The substrate sandwich may be divided to form a plurality of individual components, each comprising a first component element cooperatively connected to a second component element.

Abstract: The present invention concerns the field of solid state capacitors and relates particularly to massed production methods for manufacturing solid state capacitors.

Abstract: The present invention seeks to provide improved solid state capacitors and improved methods of manufacturing such capacitors. According to one aspect of the present invention solid state capacitors are manufactured by providing an electrically conducting substrate and forming a plurality of porous bodies comprising valve action materials on a substrate surface where each body has an upper surface distal to the substrate. An electrically insulating layer is formed over the bodies with a conducting cathode layer being formed over the insulating layer. The substrate is divided into a plurality of capacitor portions where each capacitor portion comprises a body portion and a substrate portion. The end region of each body portion distal from the substrate is provided with a platform that is a cathode terminal site in the final capacitor.

Abstract: The present invention relates to the field of solid state capacitors. The invention particularly relates to capacitors of the type in which a powder-formed valve action material, typically tantalum, forms a highly porous anode body portion of a solid state capacitor.

Abstract: The present invention concerns the field of solid state capacitors and relates particularly to massed production methods for manufacturing solid state capacitors.

Abstract: The present invention concerns the field of solid state capacitors and relates particularly to massed production methods for manufacturing solid state capacitors. The present invention seeks to provide a process simplification in order to provide an economic advantage.

Abstract: The application relates to the field of solid state capacitors. The invention particularly relates to an improved method of manufacturing multiple capacitors on a substrate.

Abstract: An electrical connector for connecting two adjacent printed circuit boards comprising an electrically insulating body on which are mounted connector elements. Each element has a first portion for electrically contacting a part of one board, and a second portion for contacting a part of the adjacent board, so as to provide electrical connection therebetween. The insulating body may lie between the boards to be interconnected. The connector comprises a first face for interaction with a first circuit board and a second bottommost face for interaction with a second circuit board. Connector elements include a resiliently moveable contact head.

Abstract: The invention relates to a method of removing water-insoluble binder from a porous article formed from pressed particulate material, such as tantalum powder. The invention provides a method capable of removing substantially all of the binder from the article for high purity applications, such as capacitor manufacture. The method comprises contacting the article with an aqueous solution of an agent which reacts with said binder to produce a water soluble derivative thereof whereby said binder derivative may be substantially dissolved in said solution. In a particular embodiment, the derivative is produced by hydrolysis of a fatty acid binder.

Abstract: An electrical connector for interconnecting circuit boards has an insulating body with adjacently disposed recesses defined along at least one of its sides and open at the sides. A connector element is disposed in each of the recesses having a contact foot extending outwardly from the recess for mounting to one circuit board and a movable contact head extending above an uppermost face of the insulating body for being resiliently pressed into contact with another circuit board. The connector element includes a flexible stem portion between the contact head and a horizontal portion mounted to the insulating body such that the flexible stem portion bends back over the mounted portion only once.