Abstract: Provided is a test pin for inspecting the presence of an electrical defect in a semiconductor and a camera module, the test pin comprising: a top plunger which is in contact with an object to be inspected to transmit an electrical signal thereto, and detects an output signal output from the object to be inspected; and a bottom plunger which transmits, to the top plunger, an electrical signal received from inspection equipment and transmits, to the inspection equipment, a monitoring signal detected by the top plunger, wherein the bottom plunger adopts a double spring structure and thus is configured to elastically support a load applied from the top plunger, such that the object to be inspected may be precisely inspected for the presence of an electrical defect, and electrical contact of the test pin may be improved, thereby increasing measurement precision.