Abstract: A system and method for automatically modifying a first layout of a circuit. The first layout may describe a plurality of layers used in a fabrication process to manufacture the circuit. When performed, the fabrication process may result in a vertical electrical connection between two of the layers. However, the vertical electrical connection may not be directly specified by the first layout. The system and method may operate to apply a set of rules to the first layout to automatically generate a modified layout directly specifying a vertical electrical connection between the two layers. The set of rules may be based on knowledge of the fabrication process, and may be designed to modify the geometry of the first layout to more closely model the real geometry of the circuit that will result from the fabrication process. The modified layout may enable an electromagnetic (EM) simulation of the circuit to be accurately performed.

Abstract: Automatically modifying a layout to perform circuit simulation. Initially, a first layout of the electronic system may be received or stored. A second layout of the electronic system may be automatically generated based on the first layout. The automatic generation may involve automatically simplifying the first layout using a set of rules for electromagnetic (EM) simulation. The second layout may then be used to perform EM simulation of the electronic system, e.g., to perform verification.

Abstract: A system and method for automatically modifying a first layout of a circuit. The first layout may describe a plurality of layers used in a fabrication process to manufacture the circuit. When performed, the fabrication process may result in a vertical electrical connection between two of the layers. However, the vertical electrical connection may not be directly specified by the first layout. The system and method may operate to apply a set of rules to the first layout to automatically generate a modified layout directly specifying a vertical electrical connection between the two layers. The set of rules may be based on knowledge of the fabrication process, and may be designed to modify the geometry of the first layout to more closely model the real geometry of the circuit that will result from the fabrication process. The modified layout may enable an electromagnetic (EM) simulation of the circuit to be accurately performed.

Abstract: Automatically modifying a layout to perform circuit simulation. Initially, a first layout of the electronic system may be received or stored. A second layout of the electronic system may be automatically generated based on the first layout. The automatic generation may involve automatically simplifying the first layout using a set of rules for electromagnetic (EM) simulation. The second layout may then be used to perform EM simulation of the electronic system, e.g., to perform verification.

Abstract: Creating and detecting crossings of conductive traces on different layers of an integrated circuit or a conducting trace over a device contact in a system. Values are stored by a system simulator corresponding to a galvanic potential or same “net”. According to a set of rule based instructions vias are automatically displayed, correct-by-construction, and via connections between the traces, or the trace and device contact, to short circuit the paths. The via structure will not be created if it will short-circuit a conducting trace not associated with the net in question. By connecting traces on different layers using automatically created via structures so as not to short circuit other net traces, errors are eliminated and design cycles reduced when compared to a manual design scheme of inserting via connections. There is an interactive mode which allows the via to be easily resized by the use of familiar control handles.

Abstract: This invention is directed to a methodology of creating and detecting crossings of conductive traces on different layers of an integrated circuit or a conducting trace over a device contact during a system. Values are stored by the system simulator corresponding to the galvanic potential or same “net,” and then by a set of rule based instructions the vias are automatically displayed, correct-by-construction, and via connections between the traces, or the trace and device contact, to short circuit the paths. The via structure will not be created if it will short-circuit a conducting trace not associated with the net in question. By connecting traces on different layers using automatically created via structures so as not to short circuit other net traces, errors are eliminated and design cycles reduced when compared to a manual design scheme of inserting via connections. There is a number of useful variations that can be applied to the via structure automatically created.