Patents Assigned to AXLEN, INC.
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Patent number: 9879843Abstract: Lighting systems, devices and techniques are provided to construct solid-state lighting devices and systems that provide energy-efficient illumination, including personal lighting devices, desktop lighting devices, and ceiling/overhead lighting devices based on semiconductor-based solid-state light sources such as LEDs or laser diodes. The disclosed solid-state lighting devices and systems use an illumination plate to receive the generated light from one or more LEDs or laser diodes and to process the received light to exhibit desired spatial distribution of light power across the illumination plate and desired direction of the output light from the illumination plate.Type: GrantFiled: August 29, 2013Date of Patent: January 30, 2018Assignee: Axlen, Inc.Inventors: Li Xu, Bo Pi, Anthony Hsu
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Patent number: 9759843Abstract: Techniques, devices and materials for light source devices that convert excitation light into different light via wavelength conversion materials. One example of a light source includes an excitation light source; a wavelength conversion material that absorbs light from the excitation light source and emits a longer wavelength light; and a layer of a transparent material that has plural optical structures in contact to or in close proximity to the wavelength conversion material to receive the emitted light from the wavelength conversion material and to modify the received light to produce output light with a desired spatial pattern associated with the plural optical structures.Type: GrantFiled: June 28, 2011Date of Patent: September 12, 2017Assignee: Axlen, Inc.Inventors: Li Xu, Bo Pi
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Patent number: 9480108Abstract: In one aspect, a light source module includes one or more light emitters of a first color forming a first color group, one or more light emitters of a second color forming a second color group, the one or more light emitters of the second color group connected in series to the one or more light emitters of the first color group, a second color group adjustment circuit connected in parallel to the one or more light emitters of the second color group, the second color group adjustment circuit configured to adjust one or both of color and intensity of output light of the second color group, and a current source connected in series to solid-state color emitters of the first and the second color groups.Type: GrantFiled: April 18, 2013Date of Patent: October 25, 2016Assignee: AXLEN, INC.Inventor: Bo Pi
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Patent number: 9370073Abstract: Techniques, systems and devices are described for controlling the adjustment of colors and optical power of output light of solid-state lighting devices for improved lighting performance. In one aspect, a solid-state lighting system includes a lighting device and a control panel, the lighting device including solid-state light emitters, driver circuits, line sensing electronics that receives signal modulation on a power line connecting the lighting device, a digital controller that decodes the signal modulation into a digital command, and a memory that stores the decoded digital command. The control panel sends the digital command to the lighting device via the power line and modulates electrical power to produce the signal modulation that carries the digital command. In some implementations, a visual indicator may be generated when the control panel receives a digital command from a user to acknowledge the receipt of the digital command.Type: GrantFiled: April 17, 2013Date of Patent: June 14, 2016Assignee: AXLEN, INC.Inventor: Bo Pi
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Patent number: 9151468Abstract: High lumen output and brightness illumination modules using an excitation light source and wavelength conversion part with multi-channel heat dissipation are disclosed. The exciting light source is a light emitting diode or a laser diode emitting in the UV and/or blue region. The luminescent material in the wavelength conversion part absorbs the excitation light and emit longer wavelength light. The enhancement approaches for brightness and polarization is disclosed.Type: GrantFiled: June 28, 2011Date of Patent: October 6, 2015Assignee: AXLEN, INC.Inventors: Li Xu, Yi Zhang
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Patent number: 9112119Abstract: Methods, systems, and devices are disclosed for light-emitting diode and laser diode packaging designs. In one aspect, an LED lighting device includes a substrate capable of dissipating heat, the substrate formed of a metal or ceramic material, an array of LED dies located on the substrate, electrically conductive lines on the substrate and electrically connected to the LED dies for electrically driving the LED dies to emit light, a grid structure over the substrate forming an array of cavities to surround the LED dies in respective cavities, an optically reflective coating at least partially covering one or more of exposed regions of the substrate, the electrically conductive lines, or surfaces of the grid structure, and optically transparent plates placed over at least some of the cavities of the grid structure allowing transmission of light produced by a respective LED die inside a respective cavity.Type: GrantFiled: April 4, 2013Date of Patent: August 18, 2015Assignee: Axlen, Inc.Inventors: Li Xu, Bo Pi
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Patent number: 9041316Abstract: Techniques for constructing a solid-state lighting module that includes solid-state light emitters that emit light of different colors and are selected from separated groups of solid-state light emitters that emit light of two or more separated colors, wherein one or more solid-state light emitters are selected from each of the separated color groups of solid-state light emitters. The lighting module includes a programmable device that stores or remembers desirable optical intensities of the separated color groups of solid-state light emitters, and a control circuit that individually controls light intensity of each of the separated color groups of solid-state light emitters. The light control circuit is coupled to or in communication with the programmable device to receive the desirable optical intensities of the separated groups of solid-state light emitters and is operable to adjust the intensities of the separated color groups of solid-state light emitters based on the desirable intensities.Type: GrantFiled: June 27, 2011Date of Patent: May 26, 2015Assignee: Axlen, Inc.Inventors: Bo Pi, Li Xu
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Patent number: 8896015Abstract: LED packages and their fabrication techniques are disclosed to provide LED package with improved thermal dissipation based on one or more thermally conductive channels or studs. In one implementation, a LED package includes a plastic body structured to have a hole that penetrates through the plastic body; a metal contact formed on the plastic body at one side of the hole to cover the hole; a LED mounted to the metal contact at a location that spatially overlaps with the hole; and a stud formed in the hole in contact with the metal contact at a first end of the stud and extending to an opening of the hole at a second end of the stud, the stud being formed of a thermally conductive material to transfer heat from the LED through the metal contact and the stud to dissipate the heat at the opening of the hole via the second end of the stud.Type: GrantFiled: June 27, 2011Date of Patent: November 25, 2014Assignee: Axlen, Inc.Inventors: Bo Pi, Li Xu
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Publication number: 20130278153Abstract: In one aspect, a light source module includes one or more light emitters of a first color forming a first color group, one or more light emitters of a second color forming a second color group, the one or more light emitters of the second color group connected in series to the one or more light emitters of the first color group, a second color group adjustment circuit connected in parallel to the one or more light emitters of the second color group, the second color group adjustment circuit configured to adjust one or both of color and intensity of output light of the second color group, and a current source connected in series to solid-state color emitters of the first and the second color groups.Type: ApplicationFiled: April 18, 2013Publication date: October 24, 2013Applicant: AXLEN, INC.Inventor: Bo Pi
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Publication number: 20130270998Abstract: Techniques, systems and devices are described for controlling the adjustment of colors and optical power of output light of solid-state lighting devices for improved lighting performance. In one aspect, a solid-state lighting system includes a lighting device and a control panel, the lighting device including solid-state light emitters, driver circuits, line sensing electronics that receives signal modulation on a power line connecting the lighting device, a digital controller that decodes the signal modulation into a digital command, and a memory that stores the decoded digital command. The control panel sends the digital command to the lighting device via the power line and modulates electrical power to produce the signal modulation that carries the digital command. In some implementations, a visual indicator may be generated when the control panel receives a digital command from a user to acknowledge the receipt of the digital command.Type: ApplicationFiled: April 17, 2013Publication date: October 17, 2013Applicant: AXLEN, INC.Inventor: Bo Pi
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Publication number: 20130264577Abstract: Methods, systems, and devices are disclosed for implementing high brightness lighting. In one aspect, an LED lighting device includes a substrate capable of dissipating heat, an LED die located on the substrate, an optically reflective structure that is electrically insulative and located on the substrate and structured to form an optically reflective cavity around the LED die, an electrically conductive line structured at least partially within the optically reflective structure and electrically connected to the LED die for electrically driving the LED die to emit the light, a phosphor material located to receive light emitted by the LED die to emit light under optical excitation of the light from the LED die, and an optical element placed in an optical path of the light emitted by the phosphor material to produce better directionality of the emitted light than directionality of emitted light by the phosphor material without the optical element.Type: ApplicationFiled: April 8, 2013Publication date: October 10, 2013Applicant: Axlen, Inc.Inventors: Li Xu, Bo Pi
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Publication number: 20130264946Abstract: Methods, systems, and devices are disclosed for light-emitting diode and laser diode packaging designs. In one aspect, an LED lighting device includes a substrate capable of dissipating heat, the substrate formed of a metal or ceramic material, an array of LED dies located on the substrate, electrically conductive lines on the substrate and electrically connected to the LED dies for electrically driving the LED dies to emit light, a grid structure over the substrate forming an array of cavities to surround the LED dies in respective cavities, an optically reflective coating at least partially covering one or more of exposed regions of the substrate, the electrically conductive lines, or surfaces of the grid structure, and optically transparent plates placed over at least some of the cavities of the grid structure allowing transmission of light produced by a respective LED die inside a respective cavity.Type: ApplicationFiled: April 4, 2013Publication date: October 10, 2013Applicant: AXLEN, INC.Inventors: Li Xu, Bo Pi
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Publication number: 20130258634Abstract: Techniques, devices and materials for light source devices that convert excitation light into different light via wavelength conversion materials. One example of a light source includes an excitation light source; a wavelength conversion material that absorbs light from the excitation light source and emits a longer wavelength light; and a layer of a transparent material that has plural optical structures in contact to or in close proximity to the wavelength conversion material to receive the emitted light from the wavelength conversion material and to modify the received light to produce output light with a desired spatial pattern associated with the plural optical structures.Type: ApplicationFiled: June 28, 2011Publication date: October 3, 2013Applicant: Axlen, Inc.Inventors: Li Xu, Bo Pi
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Publication number: 20130257287Abstract: Techniques for constructing a solid-state lighting module that includes solid-state light emitters that emit light of different colors and are selected from separated groups of solid-state light emitters that emit light of two or more separated colors, wherein one or more solid-state light emitters are selected from each of the separated color groups of solid-state light emitters. The lighting module includes a programmable device that stores or remembers desirable optical intensities of the separated color groups of solid-state light emitters, and a control circuit that individually controls light intensity of each of the separated color groups of solid-state light emitters. The light control circuit is coupled to or in communication with the programmable device to receive the desirable optical intensities of the separated groups of solid-state light emitters and is operable to adjust the intensities of the separated color groups of solid-state light emitters based on the desirable intensities.Type: ApplicationFiled: June 27, 2011Publication date: October 3, 2013Applicant: Axlen, Inc.Inventors: Bo Pi, Li Xu
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Publication number: 20130099275Abstract: LED packages and their fabrication techniques are disclosed to provide LED package with improved thermal dissipation based on one or more thermally conductive channels or studs. In one implementation, a LED package includes a plastic body structured to have a hole that penetrates through the plastic body; a metal contact formed on the plastic body at one side of the hole to cover the hole; a LED mounted to the metal contact at a location that spatially overlaps with the hole; and a stud formed in the hole in contact with the metal contact at a first end of the stud and extending to an opening of the hole at a second end of the stud, the stud being formed of a thermally conductive material to transfer heat from the LED through the metal contact and the stud to dissipate the heat at the opening of the hole via the second end of the stud.Type: ApplicationFiled: June 27, 2011Publication date: April 25, 2013Applicant: AXLEN, INC.Inventors: Bo Pi, Li Xu
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Publication number: 20130100635Abstract: High lumen output and brightness illumination modules using an excitation light source and wavelength conversion part with multi-channel heat dissipation are disclosed. The exciting light source is a light emitting diode or a laser diode emitting in the UV and/or blue region. The luminescent material in the wavelength conversion part absorbs the excitation light and emit longer wavelength light. The enhancement approaches for brightness and polarization is disclosed.Type: ApplicationFiled: June 28, 2011Publication date: April 25, 2013Applicant: AXLEN, INC.Inventors: Li Xu, Yi Zhang