Abstract: A carrier board has electronic circuit components mounted thereon which are conductively connected to carrier board connectors which are in turn interconnected to an interconnect board. The interconnect board has a plurality of first conductors and second conductors that are separated and positioned to intersect to form a plurality of intersections. The first and second conductors may be selectively placed into conductive contact at selected intersect points to thereby form a desired electronic circuit. The interconnect board specifically includes a deformable material between the first and second conductors which are conductively connectable alternately and selectively through the imposition of pressure and temperature.