Abstract: A photoresist composition is provided. The photoresist composition includes an alkali-soluble resin; a photosensitizer containing a first compound that contains a diazonaphthoquinone represented by Formula 1 and a second compound that contains a diazonaphthoquinone represented by Formula 2; and a solvent. and R1 is selected from the group consisting of a hydrogen atom, an alkyl group having 1 to 4 carbons, an alkenyl group having 2 to 4 carbons, a cycloalkyl group having 3 to 8 carbons, and an aryl group having 6 to 12 carbons, and R2 is selected from the group consisting of Cl, F, Br, and I.
Type:
Application
Filed:
February 28, 2011
Publication date:
November 24, 2011
Applicants:
AZ ELECTRONIC MATERIALS K.K., SAMSUNG ELECTRONICS CO., LTD.
Inventors:
Hi-Kuk LEE, Sang-Hyun YUN, Cha-Dong KIM, Jung-In PARK, Deok-Man KANG, Youn-Suk KIM, Sae-Tae OH