Patents Assigned to AZOTEK CO., LTD.
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Patent number: 11649332Abstract: A method of processing liquid crystal polymer film is provided. The method includes the following steps. A metal substrate is provided. A liquid crystal polymer film is provided. The liquid crystal polymer film and the metal substrate are laminated to form a composite layer. The composite layer is heated at a first temperature and a processed liquid crystal polymer film is obtained through the separation of the heated liquid crystal polymer film from the substrate. A processing device of liquid crystal polymer film is further provided, including a lamination member, a transport member, a heating member, and a separation member.Type: GrantFiled: April 28, 2022Date of Patent: May 16, 2023Assignee: AZOTEK CO., LTD.Inventor: Li-Hua Wang
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Patent number: 11597806Abstract: A method of processing liquid crystal polymer film is provided. The method includes the following steps. A metal substrate is provided. A liquid crystal polymer film is provided. The liquid crystal polymer film and the metal substrate are laminated to form a composite layer. The composite layer is heated at a first temperature and a processed liquid crystal polymer film is obtained through the separation of the heated liquid crystal polymer film from the substrate. A processing device of liquid crystal polymer film is further provided, including a lamination member, a transport member, a heating member, and a separation member.Type: GrantFiled: November 15, 2019Date of Patent: March 7, 2023Assignee: AZOTEK CO., LTD.Inventor: Li-Hua Wang
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Patent number: 11530308Abstract: A method of manufacturing a modified liquid crystal polymer includes: providing a liquid crystal polymer having a first melting point; heating the liquid crystal polymer to a first temperature and maintaining at the first temperature for a first time period, in which the first temperature is lower than or equal to the first melting point; and cooling the liquid crystal polymer to a second temperature to form a first modified liquid crystal polymer, the second temperature being lower than the first temperature, the first modified liquid crystal polymer having a second melting point, in which the second melting point is higher than the first melting point.Type: GrantFiled: February 19, 2020Date of Patent: December 20, 2022Assignee: AZOTEK CO., LTD.Inventor: Hung-Jung Lee
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Patent number: 11483934Abstract: A metal substrate includes a first insulating substrate, a second insulating substrate, a first metal layer, a second metal layer and a release layer. The first insulating substrate has a first modified surface and a second surface opposite to the first modified surface. The first metal layer faces the second surface. The release layer is bonded on the first modified surface. The second insulating substrate is bonded on a side of the release layer, such that the release layer is between the first modified surface and the second insulating substrate. The second metal layer is disposed on a side of the second insulating substrate, such that the second insulating substrate is between the release layer and the second metal layer. An original surface roughness of the first modified surface has a variation substantially less than 10% after the first modified surface is released from the release layer.Type: GrantFiled: July 1, 2016Date of Patent: October 25, 2022Assignee: AZOTEK CO., LTD.Inventor: Hung-Jung Lee
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Patent number: 11376816Abstract: A method of manufacturing a liquid crystal polymer film, which includes the following operations: providing a liquid crystal polymer powder; uniformly dispersing the liquid crystal polymer powder in a solvent to form a mixed solution; coating the mixed solution on a carrier board to form a coating layer; heating the coating layer to a first temperature to remove the solvent in the coating layer; heating the liquid crystal polymer powder to a second temperature after the solvent is removed to form the liquid crystal polymer film.Type: GrantFiled: December 21, 2018Date of Patent: July 5, 2022Assignee: AZOTEK CO., LTD.Inventor: Hung-Jung Lee
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Patent number: 11225563Abstract: The disclosure provides a composite for forming an insulating substrate. The composite includes 100 parts by weight of a liquid crystal polymer and 0.5-85 parts by weight of a dielectric additive. The liquid crystal polymer has a repeating unit represented by in which Ar is 1,4-phenylene, 1,3-phenylene, 2,6-naphthalene, or 4,4?-biphenylene, Y is —O— or —NH—, and X is carboxamido, imido/imino, amidino, aminocarbonylamino, aminothiocarbonyl, aminocarbonyloxy, aminosulfonyl, aminosulfonyloxy, aminosulfonylamino, carboxyl ester, (carboxyl ester)amino, (alkoxycarbonyl)oxy, alkoxycarbonyl, hydroxyamino, alkoxyamino, cyanato, isocyanato, or a combination thereof.Type: GrantFiled: July 23, 2019Date of Patent: January 18, 2022Assignee: AZOTEK CO., LTD.Inventor: Hung-Jung Lee
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Patent number: 11044802Abstract: A circuit board includes a first insulating structure, a first redistribution layer, a second insulating structure, and a second redistribution layer. The first insulating structure has an upper surface and includes a first liquid crystal polymer layer. The first redistribution layer is disposed on the upper surface of the first insulating structure. The second insulating structure is disposed on the upper surface of the first insulating structure and covers the first redistribution layer. The second insulating structure has a top surface opposite to the upper surface and includes a second liquid crystal polymer layer. The second redistribution layer is disposed on the top surface of the second insulating structure.Type: GrantFiled: October 2, 2017Date of Patent: June 22, 2021Assignees: AZOTEK CO., LTD., Career Technology (MFG.) Co., LtdInventors: Hung-Jung Lee, Mou-Lin Li
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Patent number: 10813213Abstract: The present disclosure provides a high-frequency composite substrate which includes a metal layer and an insulating structure. The insulating structure includes at least one liquid crystal polymer (LCP) layer with dielectric constant ranged from about 2 to about 4. The liquid crystal polymer layer adheres to the metal layer. The high-frequency composite substrate may reduce the adverse effects caused by the Resistor-Capacitor delay (RC delay).Type: GrantFiled: October 31, 2017Date of Patent: October 20, 2020Assignee: AZOTEK CO., LTD.Inventor: Hung-Jung Lee
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Patent number: 10745621Abstract: A liquid crystal polymer composite is disclosed herein. The liquid crystal polymer composite includes a solvent, a soluble liquid crystal polymer, and an additive. The soluble liquid crystal polymer is dissolved in the solvent. The additive includes an organic polymer or inorganic filler, while the additive is dispersed or dissolved in the solvent.Type: GrantFiled: May 3, 2018Date of Patent: August 18, 2020Assignee: AZOTEK CO., LTD.Inventor: Hung-Jung Lee
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Patent number: 10743423Abstract: A manufacturing method of a composite substrate is provided. A first conductive layer is formed on a first liquid crystal polymer layer. The first conductive layer is patterned to form a patterned first conductive layer. A second liquid crystal polymer layer including a soluble liquid crystal polymer is formed to cover the patterned first conductive layer. The second liquid crystal polymer layer which is on the patterned first conductive layer is removed.Type: GrantFiled: March 30, 2018Date of Patent: August 11, 2020Assignee: AZOTEK CO., LTD.Inventor: Hung-Jung Lee
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Patent number: 10212829Abstract: A metal substrate includes a first insulating substrate, a second insulating substrate, a first metal layer and a second metal layer. The first insulating substrate has a first modified surface and a second surface opposite to the first modified surface. The first metal layer faces the second surface. The second insulating substrate is bonded on the first modified surface, such that the first insulating substrate is between the second insulating substrate and the first metal layer. The second metal layer is disposed on a side of the second insulating substrate, such that the second insulating substrate is between the first modified surface and the second metal layer. An original surface roughness of the first modified surface has a variation substantially less than 10% after the first modified surface is released from the second insulating substrate.Type: GrantFiled: December 16, 2016Date of Patent: February 19, 2019Assignee: AZOTEK CO., LTD.Inventor: Hung-Jung Lee
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Patent number: 9573352Abstract: A metal substrate includes a first insulating substrate, a second insulating substrate, a first metal layer and a second metal layer. The first insulating substrate has a first modified surface and a second surface opposite to the first modified surface. The first metal layer faces the second surface. The second insulating substrate is bonded on the first modified surface, such that the first insulating substrate is between the second insulating substrate and the first metal layer. The second metal layer is disposed on a side of the second insulating substrate, such that the second insulating substrate is between the first modified surface and the second metal layer. An original surface roughness of the first modified surface has a variation substantially less than 10% after the first modified surface is released from the second insulating substrate.Type: GrantFiled: September 3, 2014Date of Patent: February 21, 2017Assignee: AZOTEK CO., LTD.Inventor: Hung-Jung Lee
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Patent number: 9414485Abstract: A metal substrate includes a first insulating substrate, a second insulating substrate, a first metal layer, a second metal layer and a release layer. The first insulating substrate has a first modified surface and a second surface opposite to the first modified surface. The first metal layer faces the second surface. The release layer is bonded on the first modified surface. The second insulating substrate is bonded on a side of the release layer, such that the release layer is between the first modified surface and the second insulating substrate. The second metal layer is disposed on a side of the second insulating substrate, such that the second insulating substrate is between the release layer and the second metal layer. An original surface roughness of the first modified surface has a variation substantially less than 10% after the first modified surface is released from the release layer.Type: GrantFiled: September 4, 2014Date of Patent: August 9, 2016Assignee: AZOTEK CO., LTD.Inventor: Hung-Jung Lee