Abstract: Automatic separator to separate the supporting sub-layer from the print support in work elements for microelectronics and method to realize such separation. The automatic separator comprises a pick up plate provided with depression-type elements for picking up the print support. The pick up plate is movable from a first position in which each print support is stored together with the associated supporting sub-layer to a second position wherein each print support is positioned without the associated supporting sub-layer for a subsequent manufacturing phase. The pick up plate during its movement bring the supporting sub-layer in contact with stationary detachment elements which cause the separation of the supporting sub-layer from the related print support.