Abstract: A Multi-Cycle Digital High Power Microwave (MCD-HPM) source includes a microwave transmission line (MTL) to which a plurality electrically charged thin film transmission lines (TFTL's) are connected by switches. The switches are activated in sequence to generate a square wave at a microwave output frequency. The activation signal is controlled by a free space time delay, which can vary the timing and/or routing of the activation signal by modifying at least one free space element, thereby adjusting the switch activation timing and varying the output frequency. In embodiments, the switches are photo-conducting switches, the activation signal is a laser beam, and the switch timing is varied by reorienting and/or repositioning mirrors and/or other elements in the free space time delay. The elements can be manually adjusted, or mounted on motorized stages and automatically controlled. Optical amplifiers can be included to compensate for losses in the time delay elements.

Abstract: A system and method for an automated way of running spice on a small portion of a design is presented. The system includes a sub-circuit netlist generation processor and an analog simulation processor. The sub-circuit netlist generation processor generates a sub-circuit netlist based, at least in part, on a HDL netlist, a parasitic capacitance database and trace rules. The sub-circuit netlist contains significantly fewer paths than the HDL netlist of an entire design so that its simulation time is much quicker. The analog simulation processor generates analog simulation results of the sub-circuit netlist based, at least in part, on dynamic inputs.

Abstract: An electronic device package includes a substrate and wire columns arranged in groups about a neutral stress point of the substrate. The height of the wire columns is substantially uniform for the plural groups of wire columns, and a length of at least one of the wire columns is greater than the uniform height. A method of fabricating an electronic device package having a column grid array includes applying two templates on wire columns of the column grid array and bending at least one wire column to increase its length while maintaining a uniform height for the column grid array. In another aspect, an electronic device package substrate includes wire columns having at least one non-uniformity in lengths of the columns, and the length of a wire column corresponds to a distance of that wire column from the neutral stress point of the substrate.

Abstract: A system is provided for semi-active laser designation, the system comprising: a guidance and control system having a plurality of wings disposed at an aerodynamically advantageous angle; a plurality of linear sensor arrays configured to measure location of a target, each the sensor array being disposed on a wing of the plurality of wings; and each the linear sensor array providing independent data to the guidance and control system as to the location of the target.

Abstract: A quadratic amplitude matching system and associated method with an associated tuning control system is provided for continuously and automatically tuning a quadratic amplitude matching filter (QAMF) to a band center of an interfering signal to provide improved rejection of an interfering signal coupled from a transmission antenna into a local receive antenna in the presence of local multi-path, thereby providing improved interference cancellation system performance. The matching control system is provided as an element of an interference cancellation system.

Abstract: An orientation-independent antenna that presents a circular polarization characteristic to incoming waves such that these waves are detected regardless or polarization and angle of arrival is provided with shorts across elements thereof that provide for crossed vertical loops and a horizontal loop to lower the VSWR at the lower frequencies of the antenna. The antenna includes crossed vertical loops and a horizontal loop, with the loops being phased to provide the circular polarization characteristic. In one embodiment, the antenna includes a number of elements on the faces of a cube, or the elements are positioned on the surface of a sphere. In another embodiment, the antenna is given both a right hand circular polarization characteristic and a left hand circular polarization characteristic in two different channels to provide for double the data throughput.

Abstract: A current mode logic voter circuit includes three two-input split NOR gates. Each two-input split NOR gate receives a corresponding pair of input signals and generates a pair of first output signals responsive to the input signals. A three input split NOR gate is coupled to the two-input split NOR gates to receive the first output signals and generates a second pair of output signals responsive to the first output signals from the two-input split NOR gates. The two and three-input split NOR gates can be formed from current mode logic buffer circuits, and in one embodiment in the three-input split NOR gate the buffer circuits are hardened.

Abstract: An integrated electronics matching circuit is placed directly at the feed points of an antenna to match a transmission line to the impedance of the antenna that results in preserving the originally-designed wide bandwidth of the antenna, which in one embodiment is 10:1. A methodology is provided for the design of the integrated electronics matching circuit that marries the output of an antenna modeling tool with an integrated circuit design tool, in which the S parameter outputs of the antenna modeling tool for the antenna ports are coupled to the corresponding ports of the integrated circuit designed by the integrated circuit design tool.

Abstract: What is provided is the use of an array of E-field sensors to detect the closest approach of incoming projectiles and to determine through time difference of arrival the bearing of the incoming projectile, thus to identify the bearing of the source of the projectile. dE/dT processing of the individual outputs of the E-field sensors indicates by the zero crossing the peak of the E-field disturbance and thus the instance of time of the closest approach of the projectiles to a sensor.

Abstract: An integrated piezoelectric ultrasound array structure configured to minimize the effects of differential thermal expansion between the array and the integrated circuit and to improve the mechanical and acoustical integrity of the array. The transducer array may have an interposed thinned supporting substrate and is matched to the integrated circuit substrate for thermal expansion so as to retain mechanical integrity of the array/IC bond within the working temperature range. Transducer elements are laterally isolated acoustically and as to thermal expansion by air or other acoustically attenuating medium of lower elastic modulus material between the elements. Acoustical effects are vertically acoustically isolated with capacitive coupling and small area solder bumps relative to wavelength, and further laterally acoustically isolated by thin supporting substrates relative to wavelength, including thinned semiconductor integrated circuit substrates.