Patents Assigned to BAE Systems Information and Electronics Systems Integrations Inc.
  • Patent number: 8373543
    Abstract: A tag operates in an environment where transmitted interrogators are not possible or desired. High-efficiency diode rectifiers and low-power oscillators are used in combination with an energy storage element and hysteretic switch. The combination of multi-diode rectifier, low power tunnel diode oscillator, energy storage element and hysteretic switch allow for nanowatt levels of received RF power to be stored to produce micro-watts of RF transmit power. The device trickle charges off of ambient RF radiation until enough energy is stored for transmission.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: February 12, 2013
    Assignee: BAE Systems Information and Electronic Systems Integrations Inc.
    Inventors: Karl D. Brommer, Candice L. Brittain, Eldon M. Sutphin
  • Patent number: 8371202
    Abstract: A projector of multiple skewed light planes or sheets is located adjacent a vehicle to be protected and detectors are arranged to defect the penetration of the light sheets by an incoming object, with the time intervals between the piercing of the planes defining the path of the incoming object and its expected impact time. An array of bullet-firing barrels is arranged to project bullets in ah iron curtain under control of a fire control module that fires a round in a barrel above the projected flight path such that the round impacts the nose of the object and disables it. It is thus the piercing of the skewed light sheets mat provides information as to the impact point of the object as well as its time of arrival so that a round can be fired to intercept the object as it arrives at the iron curtain.
    Type: Grant
    Filed: May 2, 2011
    Date of Patent: February 12, 2013
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Jefferson E. Odhner, Geoffrey P. McKinnon
  • Patent number: 8373925
    Abstract: A system is provided for amplification of laser light, the system having: a plurality of non-silica optical fibers, each the non-silica optical fiber disposed within a sheath; each the non-silica optical fiber being doped with a dopant such that the non-silica fiber has a low non-linear effect; a light source, directing a light beam into a first the non-silica optical fiber; heat dissipating components disposed about the plurality of non-silica optical fibers forming a package; and the package being not greater than 100 cm3.
    Type: Grant
    Filed: December 22, 2009
    Date of Patent: February 12, 2013
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Daniel Creeden, John C. McCarthy
  • Patent number: 8371201
    Abstract: A method and apparatus is provided for increasing the effectiveness of destroying selected objects in a target cloud by prioritizing the objects detected in a large aperture IR detector aboard a carrier vehicle and sequentially illuminating the detected targets with coded laser radiation, followed by the launching of multiple miniature kill vehicles from the carrier vehicle, with each kill vehicle assigned to a differently-coded object in the target cloud due to the reflection back of the coded returns, thus to permit directing of individual miniature kill vehicles to a specific object in the target cloud prior to a handoff to an IR heat seeker in the miniature kill vehicle, actuated to guide the kill vehicle for a final kill.
    Type: Grant
    Filed: August 18, 2005
    Date of Patent: February 12, 2013
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Michael E. Deflumere, Richard J. Venuti, Fernando M. Faria
  • Patent number: 8373518
    Abstract: Conductive segments (transmission line conductors) are positioned within a transmission line structure in order to generate multi-cycle microwave pulses. The conductor segments are switchably coupled to one or the other conductor of the transmission lines, inside the transmission line structure. Microwave pulses may be induced in the transmission line by closing the switches in a controlled manner to discharge successive segments, or successive groups of segments, into the transmission lines. The induced pulses travel uninterrupted along the transmission lines in a desired direction to the load. Efficiency of systems and energy delivered to the load in multi-section transmission lines is increased and/or maximized by adjusting the ratio of characteristic impedances associated with the transmission line conductor segments according to an optimum ratio.
    Type: Grant
    Filed: June 14, 2011
    Date of Patent: February 12, 2013
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventor: Simon Y. London
  • Patent number: 8365671
    Abstract: A method for detonating a munition comprising the steps of providing a plurality of micro-detonators and microprocessors in said munition and initiating said micro-detonators in a predetermined sequence by means of said microprocessor. Depending on the specific predetermined sequence which is selected, one of a variety of explosive modes may be achieved.
    Type: Grant
    Filed: January 12, 2011
    Date of Patent: February 5, 2013
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventor: Paul R. Rohr
  • Patent number: 8365575
    Abstract: A method of performing chemical analysis is disclosed. The method includes the steps of forming carbide-derived carbon (CDC) material having a plurality of pore size, surface chemistry, and surface electrical properties. An array of the surface functionalized CDCs are used for atmospheric sampling, in which chemicals in the atmosphere are adsorbed on the CDCs. The adsorbed samples are desorbed later for analysis by a plurality of individual mass spectrometers.
    Type: Grant
    Filed: November 3, 2009
    Date of Patent: February 5, 2013
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventor: Tadd C. Kippeny
  • Publication number: 20130000828
    Abstract: Embodiments of the invention are directed to methods and apparatus for infrared imagers including fast electrostatic shutters and offset compensation. Fast electrostatic shutters are used for video image correction including image offset compensation where temporal noise and scene nonuniformity are corrected. This method provides a shutterless experience for the user because the image will be blocked for only one frame at a time. A method of manufacturing an electrostatic infrared shutter includes a conductive infrared-transparent substrate, covering it with an insulating layer, depositing adhesive and a thin film stack, delineating a working area, providing contacts, heat-treating the assembly, and making the polymer non-reflective in the infrared.
    Type: Application
    Filed: September 12, 2012
    Publication date: January 3, 2013
    Applicant: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Sergey Liberman, Michael Joswick
  • Patent number: 8343792
    Abstract: An improved method for manufacturing a lateral germanium detector is disclosed. A detector window is opened through an oxide layer to expose a doped single crystalline silicon layer situated on a substrate. Next, a single crystal germanium layer is grown within the detector window, and an amorphous germanium layer is grown on the oxide layer. The amorphous germanium layer is then polished to leave only a small portion around the single crystal germanium layer. A dielectric layer is deposited on the amorphous germanium layer and the single crystal germanium layer. Using resist masks and ion implants, multiple doped regions are formed on the single crystal germanium layer. After opening several oxide windows on the dielectric layer, a refractory metal layer is deposited on the doped regions to form multiple germanide layers.
    Type: Grant
    Filed: October 27, 2008
    Date of Patent: January 1, 2013
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Daniel N. Carothers, Craig M. Hill, Andrew T. S. Pomerene, Vu A. Vu, Robert Kamocsai, Timothy J. Conway
  • Patent number: 8338230
    Abstract: A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first portion of a partitioned interposer unit. Planar partitions of the interposer are physically bonded via multiple solder “bumps,” which possess high tensile strength but low resistance to horizontal shear force or torque. A second chip is affixed via one or more adhesion layers to the second portion of the partitioned interposer. The chips may thus be separated by horizontally and oppositely shearing or twisting the first and second portions of the partitioned interposer away from one another.
    Type: Grant
    Filed: September 27, 2011
    Date of Patent: December 25, 2012
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: John A. Hughes, Thomas E. Love, Eugene Lemoine, David H. Lee, Christopher Ebel
  • Publication number: 20120322177
    Abstract: A method for integrating a slotted waveguide into a CMOS process is disclosed. A slot can be patterned on a SOI wafer by etching a first pad hard mask deposited over the wafer. The slot is then filled with a plug material by depositing a second pad hard mask over the first pad hard mask. A waveguide in association with one or more electronic and photonic devices can also be patterned on the SOI wafer. The trenches can be filled with an isolation material and then polished. Thereafter, the first and second pad hard masks can be stripped from the wafer. The slot can once again be filled with the plug material and patterned. After forming one or more electronic and photonic devices on the wafer using the standard CMOS process, a via can be opened up down to the nitride plug and the nitride plug can then be removed.
    Type: Application
    Filed: December 2, 2011
    Publication date: December 20, 2012
    Applicant: BAE Systems Information And Electronic Systems Integration Inc.
    Inventors: Andrew TS Pomerene, Craig M. Hill, Timothy J. Conway, Stewart L. Ocheltree
  • Publication number: 20120321246
    Abstract: An asymmetric slotted waveguide and method for fabricating the same. The slotted waveguide is constructed in silicon-on-insulator using a Complementary metal-oxide-semiconductor (CMOS) process. One or more wafers can be coated with a photo resist material using a photolithographic process in order to thereby bake the wafers via a post apply bake (PAB) process. An anti-reflective coating (TARC) can be further applied on the wafers and the wafers can be exposed on a scanner for the illumination conditions. After a post exposure bake (PEB), the wafers can be developed in a developer using a puddle develop process. Finally, the printed wafers can be processed using a shrink process to reduce the critical dimension (CD) of the slot and thereby achieve an enhanced asymmetric slotted waveguide that is capable of guiding the optical radiation in a wide range of optical modulation applications using an electro-optic polymer cladding.
    Type: Application
    Filed: December 2, 2011
    Publication date: December 20, 2012
    Applicant: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Andrew TS Pomerene, Wesley D. Reinhardt, Craig M. Hill
  • Publication number: 20120312184
    Abstract: A method for detonating a munition comprising the steps of providing a plurality of micro-detonators and microprocessors in said munition and initiating said micro-detonators in a predetermined sequence by means of said microprocessor. Depending on the specific predetermined sequence which is selected, one of a variety of explosive modes may be achieved.
    Type: Application
    Filed: May 18, 2012
    Publication date: December 13, 2012
    Applicant: BAE Systems Information and Electronic Systems Integration Inc.
    Inventor: Paul R. ROHR
  • Patent number: 8330820
    Abstract: Embodiments of the invention are directed to methods and apparatus for infrared imagers including fast electrostatic shutters and offset compensation. Fast electrostatic shutters are used for video image correction including image offset compensation where temporal noise and scene nonuniformity are corrected. This method provides a shutterless experience for the user because the image will be blocked for only one frame at a time. A method of manufacturing an electrostatic infrared shutter includes a conductive infrared-transparent substrate, covering it with an insulating layer, depositing adhesive and a thin film stack, delineating a working area, providing contacts, heat-treating the assembly, and making the polymer non-reflective in the infrared.
    Type: Grant
    Filed: December 5, 2008
    Date of Patent: December 11, 2012
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Sergey Liberman, Michael Joswick
  • Publication number: 20120306050
    Abstract: A system and method for improving the prompt dose radiation response of mixed-signal integrated circuits is disclosed. An internal analog circuit inside a mixed-signal integrated circuit generates an internal analog reference voltage that has been used for various purposes in the integrated circuit. At least one external capacitor is added either internal or external to a device package of the integrated circuit. The external capacitor reduces any change in the internal reference voltage due to prompt dose radiation by stabilizing the internal reference voltage and thus improves prompt dose radiation response of mixed-signal integrated circuits. A much greater value of capacitance may be provided without increase in dielectric rupture suceptability or decrease in manufacturing yield which may be associated with added on-chip capacitance. This increased capacitance primarily reduce the amount of disturbance caused to the internal node during a prompt dose radiation event.
    Type: Application
    Filed: May 30, 2012
    Publication date: December 6, 2012
    Applicant: BAE Systems Information and Electronic Systems Integration Inc.
    Inventor: John C. Rodgers
  • Publication number: 20120304919
    Abstract: A method for growing germanium epitaxial films is disclosed. Initially, a silicon substrate is preconditioned with hydrogen gas. The temperature of the preconditioned silicon substrate is then decreased, and germane gas is flowed over the preconditioned silicon substrate to form an intrinsic germanium seed layer. Next, a mixture of germane and phosphine gases can be flowed over the intrinsic germanium, seed layer to produce an n-doped germanium seed layer. Otherwise, a mixture of diborane and germane gases can be flowed over the intrinsic germanium seed layer to produce a p-doped germanium seed layer. At this point, a hulk germanium layer can be grown on top of the doped germanium seed layer.
    Type: Application
    Filed: August 15, 2012
    Publication date: December 6, 2012
    Applicant: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Daniel N. Carothers, Craig M. Hill, Andrew T.S. Pomerene, Vu A. Vu
  • Patent number: 8326309
    Abstract: Techniques are disclosed that allow for resource allocation during situations requiring co-existence in cognitive radios. Even under situations of bandwidth scarcity, the techniques allow various users to be guaranteed quality of service (QoS) by proper distribution and allocation of resources. The techniques allow wireless communication systems to operate in a normal mode and a co-existence mode. In the co-existence mode of operation, sub-frame creation, sharing and zone formation schemes are implemented that enable the existing underlying frame structure to remain intact and inter-operable with the legacy systems and at the same time, provide a guaranteed QoS. The zones effectively create partitions in space, time and frequency, which result in interference avoidance and allow various users in neighboring cells to communicate on the same frequencies.
    Type: Grant
    Filed: March 6, 2009
    Date of Patent: December 4, 2012
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Apurva N. Mody, Ranga Reddy
  • Patent number: 8324542
    Abstract: A system is provided for the remote control of a spinning projectile, the system comprising: a polarized radiation source emitting polarized radiation wherein commands are encoded; a projectile round; a polarized radiation receiver disposed on the projectile round and configured to receive the polarized radiation; and a projectile steering mechanism, the mechanism directing movement of the projectile according to the commands communicated by means of rotation of polarization of the polarized radiation source.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: December 4, 2012
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventor: Robert D Frey, Jr.
  • Patent number: 8319636
    Abstract: A convenient handheld locator is provided for locating an item in an urban environment in which the locator is programmed to search for and locate specific items, with the detected item being displayed on the locator as to its identity or name, also displaying where the item is relative to the locator, as to position and range.
    Type: Grant
    Filed: July 21, 2011
    Date of Patent: November 27, 2012
    Assignee: BAE Systems Information and Electronic Systems Integration Inc.
    Inventors: Karl D. Brommer, Court E. Rossman, Cedric L. Logan, Paul E. Gili
  • Publication number: 20120292726
    Abstract: An entry slit panel for a push-broom hyperspectral camera is formed at least partly from a silicon wafer on which at least one companion sensor is fabricated, whereby the companion sensor is co-planar with the slit and detects light imaged on the panel but not on the slit. In embodiments, the companion sensor is a panchromatic sensor or a sensor that detects light outside the wavelength range of the camera. At least a region of the wafer is back-thinned to a thickness appropriate for a diffraction slit. The slit can be etched or laser cut through the thinned region, or formed between the wafer and another wafer or a conventional blade. The wafer can be back-coated or metalized to ensure its opacity across the camera's wavelength range. The companion sensor can be located relative to the slit to detect scene features immediately before or after the hyperspectral camera.
    Type: Application
    Filed: January 24, 2012
    Publication date: November 22, 2012
    Applicant: BAE Systems Information and Electronic Systems Integration Inc.
    Inventor: Thomas H. Wallace