Abstract: A method for detonating a munition comprising the steps of providing a plurality of micro-detonators and microprocessors in said munition and initiating said micro-detonators in a predetermined sequence by means of said microprocessor. Depending on the specific predetermined sequence which is selected, one of a variety of explosive modes may be achieved.

Abstract: A method of performing chemical analysis is disclosed. The method includes the steps of forming carbide-derived carbon (CDC) material having a plurality of pore size, surface chemistry, and surface electrical properties. An array of the surface functionalized CDCs are used for atmospheric sampling, in which chemicals in the atmosphere are adsorbed on the CDCs. The adsorbed samples are desorbed later for analysis by a plurality of individual mass spectrometers.

Abstract: A method of spectral-spatial-temporal image detection is disclosed. In one embodiment, a spectrally differenced image is obtained by computing a difference of at least two intensity values in at least two spectral bands of an image. Further, a spatially filtered spectral image is obtained by applying a spatial median filter to the obtained spectrally differenced image. Furthermore, a temporal image is obtained by determining a temporal pixel value difference using a computed predictive frame difference. In addition, a spectral-spatial-temporal filtered image for detection is obtained by using the obtained spatially filtered spectral image and the temporal image.

Abstract: Embodiments of the invention are directed to methods and apparatus for infrared imagers including fast electrostatic shutters and offset compensation. Fast electrostatic shutters are used for video image correction including image offset compensation where temporal noise and scene nonuniformity are corrected. This method provides a shutterless experience for the user because the image will be blocked for only one frame at a time. A method of manufacturing an electrostatic infrared shutter includes a conductive infrared-transparent substrate, covering it with an insulating layer, depositing adhesive and a thin film stack, delineating a working area, providing contacts, heat-treating the assembly, and making the polymer non-reflective in the infrared.

Abstract: A method is provided for the integration of an optical gain material into a Complementary metal oxide semiconductor device, the method comprising the steps of: configuring a workpiece from a silicon wafer upon which is disposed an InP wafer bearing an epitaxy layer; mechanically removing the InP substrate; etching the InP remaining on epitaxy layer with hydrochloric acid; depositing at least one Oxide pad on revealed the epitaxy layer; using the Oxide pad as a mask during a first pattern etch removing the epitaxy to an N level; etching with a patterned inductively coupled plasma (ICP) technique; isolating the device on the substrate with additional pattern etching patterning contacts, applying the contacts.

Abstract: A system is provided for breaking rotational movement comprising: a rotatable member; a friction surface disposed on the rotatable member; a friction plate opposed to the friction surface, such that when the rotatable member rotates the friction plate is in contact with the friction surface; a rod, having at least a threaded portion, and the at least a portion of the rod being received within the rotatable member such that the rotatable member rotates about the rod and moves along the threaded portion towards the friction plate; and a compressive member, whereby a force is applied to the friction plate which increases with rotation of the rotatable member.

Abstract: A passive heat exchanger for gimbal thermal management is disclosed. In one embodiment, a thermal management system includes one or more electronics and/or sensor equipment. Further, the thermal management system includes a thermally conductive shell configured to house the electronics and/or sensor equipment. Furthermore, the thermally conductive shell includes an external surface and an internal surface. In addition, at least some portion of the external surface and the internal surface of the thermally conductive shell include an extended surface configured to reduce thermal resistance between an interior region of the thermally conductive shell and ambient air.

Abstract: An improved method for manufacturing a lateral germanium detector is disclosed. A detector window is opened through an oxide layer to expose a doped single crystalline silicon layer situated on a substrate. Next, a single crystal germanium layer is grown within the detector window, and an amorphous germanium layer is grown on the oxide layer. The amorphous germanium layer is then polished to leave only a small portion around the single crystal germanium layer. A dielectric layer is deposited on the amorphous germanium layer and the single crystal germanium layer. Using resist masks and ion implants, multiple doped regions are formed on the single crystal germanium layer. After opening several oxide windows on the dielectric layer, a refractory metal layer is deposited on the doped regions to form multiple germanide layers.

Abstract: A system and method are provided in which a first chip in a stacked multi-chip module configuration is affixed via one or more adhesion layers to a first portion of a partitioned interposer unit. Planar partitions of the interposer are physically bonded via multiple solder “bumps,” which possess high tensile strength but low resistance to horizontal shear force or torque. A second chip is affixed via one or more adhesion layers to the second portion of the partitioned interposer. The chips may thus be separated by horizontally and oppositely shearing or twisting the first and second portions of the partitioned interposer away from one another.

Abstract: An asymmetric slotted waveguide and method for fabricating the same. The slotted waveguide is constructed in silicon-on-insulator using a Complementary metal-oxide-semiconductor (CMOS) process. One or more wafers can be coated with a photo resist material using a photolithographic process in order to thereby bake the wafers via a post apply bake (PAB) process. An anti-reflective coating (TARC) can be further applied on the wafers and the wafers can be exposed on a scanner for the illumination conditions. After a post exposure bake (PEB), the wafers can be developed in a developer using a puddle develop process. Finally, the printed wafers can be processed using a shrink process to reduce the critical dimension (CD) of the slot and thereby achieve an enhanced asymmetric slotted waveguide that is capable of guiding the optical radiation in a wide range of optical modulation applications using an electro-optic polymer cladding.

Abstract: Disclosed is a dynamic real-time boresighting system and method. In one embodiment, the method includes obtaining a mapping function by associating deflection and rotation data of strategically located at least two sensors with sensor deflection data, real-time or static sensor readings from at least two sensors which are strategically located on the component in the aircraft or the land vehicle, while the aircraft or the land vehicle is moving or static respectively and determining an alignment of the component by comparing the real-time or static sensor readings obtained from the strategically located at least two sensors with the obtained mapping function.

Abstract: A method for integrating a slotted waveguide into a CMOS process is disclosed. A slot can be patterned on a SOI wafer by etching a first pad hard mask deposited over the wafer. The slot is then filled with a plug material by depositing a second pad hard mask over the first pad hard mask. A waveguide in association with one or more electronic and photonic devices can also be patterned on the SOI wafer. The trenches can be filled with an isolation material and then polished. Thereafter, the first and second pad hard masks can be stripped from the wafer. The slot can once again be filled with the plug material and patterned. After forming one or more electronic and photonic devices on the wafer using the standard CMOS process, a via can be opened up down to the nitride plug and the nitride plug can then be removed.

Abstract: A method for detonating a munition comprising the steps of providing a plurality of micro-detonators and microprocessors in said munition and initiating said micro-detonators in a predetermined sequence by means of said microprocessor. Depending on the specific predetermined sequence which is selected, one of a variety of explosive modes may be achieved.

Abstract: Embodiments of the invention are directed to methods and apparatus for infrared imagers including fast electrostatic shutters and offset compensation. Fast electrostatic shutters are used for video image correction including image offset compensation where temporal noise and scene nonuniformity are corrected. This method provides a shutterless experience for the user because the image will be blocked for only one frame at a time. A method of manufacturing an electrostatic infrared shutter includes a conductive infrared-transparent substrate, covering it with an insulating layer, depositing adhesive and a thin film stack, delineating a working area, providing contacts, heat-treating the assembly, and making the polymer non-reflective in the infrared.

Abstract: A system and method for improving the prompt dose radiation response of mixed-signal integrated circuits is disclosed. An internal analog circuit inside a mixed-signal integrated circuit generates an internal analog reference voltage that has been used for various purposes in the integrated circuit. At least one external capacitor is added either internal or external to a device package of the integrated circuit. The external capacitor reduces any change in the internal reference voltage due to prompt dose radiation by stabilizing the internal reference voltage and thus improves prompt dose radiation response of mixed-signal integrated circuits. A much greater value of capacitance may be provided without increase in dielectric rupture suceptability or decrease in manufacturing yield which may be associated with added on-chip capacitance. This increased capacitance primarily reduce the amount of disturbance caused to the internal node during a prompt dose radiation event.

Abstract: A method for growing germanium epitaxial films is disclosed. Initially, a silicon substrate is preconditioned with hydrogen gas. The temperature of the preconditioned silicon substrate is then decreased, and germane gas is flowed over the preconditioned silicon substrate to form an intrinsic germanium seed layer. Next, a mixture of germane and phosphine gases can be flowed over the intrinsic germanium, seed layer to produce an n-doped germanium seed layer. Otherwise, a mixture of diborane and germane gases can be flowed over the intrinsic germanium seed layer to produce a p-doped germanium seed layer. At this point, a hulk germanium layer can be grown on top of the doped germanium seed layer.

Abstract: A system is provided for the remote control of a spinning projectile, the system comprising: a polarized radiation source emitting polarized radiation wherein commands are encoded; a projectile round; a polarized radiation receiver disposed on the projectile round and configured to receive the polarized radiation; and a projectile steering mechanism, the mechanism directing movement of the projectile according to the commands communicated by means of rotation of polarization of the polarized radiation source.

Abstract: Techniques are disclosed that allow for resource allocation during situations requiring co-existence in cognitive radios. Even under situations of bandwidth scarcity, the techniques allow various users to be guaranteed quality of service (QoS) by proper distribution and allocation of resources. The techniques allow wireless communication systems to operate in a normal mode and a co-existence mode. In the co-existence mode of operation, sub-frame creation, sharing and zone formation schemes are implemented that enable the existing underlying frame structure to remain intact and inter-operable with the legacy systems and at the same time, provide a guaranteed QoS. The zones effectively create partitions in space, time and frequency, which result in interference avoidance and allow various users in neighboring cells to communicate on the same frequencies.

Abstract: A convenient handheld locator is provided for locating an item in an urban environment in which the locator is programmed to search for and locate specific items, with the detected item being displayed on the locator as to its identity or name, also displaying where the item is relative to the locator, as to position and range.

Abstract: An entry slit panel for a push-broom hyperspectral camera is formed at least partly from a silicon wafer on which at least one companion sensor is fabricated, whereby the companion sensor is co-planar with the slit and detects light imaged on the panel but not on the slit. In embodiments, the companion sensor is a panchromatic sensor or a sensor that detects light outside the wavelength range of the camera. At least a region of the wafer is back-thinned to a thickness appropriate for a diffraction slit. The slit can be etched or laser cut through the thinned region, or formed between the wafer and another wafer or a conventional blade. The wafer can be back-coated or metalized to ensure its opacity across the camera's wavelength range. The companion sensor can be located relative to the slit to detect scene features immediately before or after the hyperspectral camera.