Abstract: The present invention relates to the synthesis of luminophores and of reflective alumina for optimizing the emissive properties of a fluorescent layer.
Abstract: The present invention relates to the synthesis of luminophores and of reflective alumina for optimizing the emissive properties of a fluorescent layer.
Abstract: Disclosed is a polishing slurry for sapphire polishing that is capable of obtaining polishing speeds and smooth surfaces during the polishing of sapphire substrates that are equivalent to or better than in prior polishing processes even if the number of polishers and polishing hours are reduced. Also disclosed is a sapphire substrate polishing method. The slurry includes alumina abrasives and has a pH adjusted to the range of 10.0 to 14.0, and the sapphire is polished by means of the CMP technique by applying said slurry. The aforementioned alumina abrasives more preferably include at least ?-alumina, and the content thereof is more preferably 0.01 to 50 wt %. The mean particle size of the aforementioned alumina abrasives is preferably 0.05 to 10 ?m.
Abstract: The present invention relates to the synthesis of luminophores and of reflective alumina for optimizing the emissive properties of a fluorescent layer.
Abstract: The present invention provides a slurry composition for chemical mechanical polishing comprising spinel particles having the formula AO•xZ2O3 wherein A is at least one divalent cation, Z is at least one trivalent cation, and 0.01≦x≦100. The present invention also includes a method of chemical mechanical polishing the surface of a substrate using slurry compositions that include these spinel particles. The slurry compositions of the present invention provide the desired level of planarization and selectivity for both metal and oxide surfaces. In addition, the slurry compositions of the invention can be prepared such that they are substantially free of alpha phase alumina particles and other high hardness particles to produce a scratch-free polished surface.
Type:
Grant
Filed:
May 27, 1999
Date of Patent:
June 26, 2001
Assignees:
EKC Technology, Inc., Baikowski Chimie
Inventors:
Robert James Small, Maria Louise Peterson, Tuan Troung, Lionel Bonneau, Jean Claude Drouget
Abstract: A permanent precision liquid polishing suspension, and a method for making same, comprising fine abrasive polishing powders held in a suspension medium comprising an aqueous glycerine based composition thickened by a carboxy polymethylene polymer.