Patents Assigned to BAIKOWSKI
  • Patent number: 9416309
    Abstract: The present invention relates to the synthesis of luminophores and of reflective alumina for optimizing the emissive properties of a fluorescent layer.
    Type: Grant
    Filed: October 8, 2014
    Date of Patent: August 16, 2016
    Assignee: Baikowski
    Inventor: Lionel Bonneau
  • Patent number: 8883116
    Abstract: The present invention relates to the synthesis of luminophores and of reflective alumina for optimizing the emissive properties of a fluorescent layer.
    Type: Grant
    Filed: March 18, 2010
    Date of Patent: November 11, 2014
    Assignee: Baikowski
    Inventor: Lionel Bonneau
  • Publication number: 20130037515
    Abstract: Disclosed is a polishing slurry for sapphire polishing that is capable of obtaining polishing speeds and smooth surfaces during the polishing of sapphire substrates that are equivalent to or better than in prior polishing processes even if the number of polishers and polishing hours are reduced. Also disclosed is a sapphire substrate polishing method. The slurry includes alumina abrasives and has a pH adjusted to the range of 10.0 to 14.0, and the sapphire is polished by means of the CMP technique by applying said slurry. The aforementioned alumina abrasives more preferably include at least ?-alumina, and the content thereof is more preferably 0.01 to 50 wt %. The mean particle size of the aforementioned alumina abrasives is preferably 0.05 to 10 ?m.
    Type: Application
    Filed: April 27, 2011
    Publication date: February 14, 2013
    Applicant: BAIKOWSKI JAPAN CO., LTD.
    Inventors: Daisuke Hosoi, Takashi Shigeta
  • Publication number: 20120012791
    Abstract: The present invention relates to the synthesis of luminophores and of reflective alumina for optimizing the emissive properties of a fluorescent layer.
    Type: Application
    Filed: March 18, 2010
    Publication date: January 19, 2012
    Applicant: BAIKOWSKI
    Inventor: Lionel Bonneau
  • Patent number: 6251150
    Abstract: The present invention provides a slurry composition for chemical mechanical polishing comprising spinel particles having the formula AO•xZ2O3 wherein A is at least one divalent cation, Z is at least one trivalent cation, and 0.01≦x≦100. The present invention also includes a method of chemical mechanical polishing the surface of a substrate using slurry compositions that include these spinel particles. The slurry compositions of the present invention provide the desired level of planarization and selectivity for both metal and oxide surfaces. In addition, the slurry compositions of the invention can be prepared such that they are substantially free of alpha phase alumina particles and other high hardness particles to produce a scratch-free polished surface.
    Type: Grant
    Filed: May 27, 1999
    Date of Patent: June 26, 2001
    Assignees: EKC Technology, Inc., Baikowski Chimie
    Inventors: Robert James Small, Maria Louise Peterson, Tuan Troung, Lionel Bonneau, Jean Claude Drouget
  • Patent number: 4242842
    Abstract: A permanent precision liquid polishing suspension, and a method for making same, comprising fine abrasive polishing powders held in a suspension medium comprising an aqueous glycerine based composition thickened by a carboxy polymethylene polymer.
    Type: Grant
    Filed: August 8, 1979
    Date of Patent: January 6, 1981
    Assignee: La Pierre Synthetique Baikowski, S.A.
    Inventor: Paul J. Yancey