Abstract: A screwdriver blade has faces formed on front and back sides of a shank. Each face has a drive surface extending from each side edge inward toward a longitudinal axis. Each drive surface is inclined relative to a plane containing the axis and bisecting each of the side edges. A thickness of the blade increases from the shank distal end. Each of the drive surfaces appears curved when viewed in a distal end view. Each of the drive surfaces extends from the shank distal end to a face proximal end. A central portion between each of the drive surfaces may also appear curved when viewed in a distal end view, or it may be flat. The drive surfaces and the central portion may be formed at a single radius of curvature. The central portion may have a increasing width from the distal end or it may have a constant width.

Abstract: A screwdriver blade has faces formed on front and back sides of a shank. Each face has a drive surface extending from each side edge inward toward a longitudinal axis. Each drive surface is inclined relative to a plane containing the axis and bisecting each of the side edges. A thickness of the blade increases from the shank distal end. Each of the drive surfaces appears curved when viewed in a distal end view. Each of the drive surfaces extends from the shank distal end to a face proximal end. A central portion between each of the drive surfaces may also appear curved when viewed in a distal end view, or it may be flat. The drive surfaces and the central portion may be formed at a single radius of curvature. The central portion may have a increasing width from the distal end or it may have a constant width.

Abstract: Back end photoresist strippers and residue compositions are provided by non-aqueous compositions that are essentially non-corrosive toward copper as well as aluminum and that comprise a polar organic solvent, a hydroxylated amine, and as a corrosion inhibitor fructose.

Abstract: Non-aqueous stripping and cleaning compositions for cleaning microelectronics devices, the composition having a least one organic sulfur-containing polar compound as a stripping solvent, at least one water-free source of a strong hydroxide base, and at least one hydroxypyridine stabilizing agent to inhibit detrimental side reactions.

Abstract: Nanoelectronic and microelectronic cleaning corn positions for cleaning nanoelectronic and microelectronic substrates under supercritical fluid state conditions, and particularly cleaning compositions useful with and having improved compatibility with nanoelectronic and microelectronic substrates characterized by silicon dioxide, sensitive low-n or high-K dielectrics and copper, tungsten, tantalum, nickel, gold, cobalt, palladium, platinum, chromium, ruthenium, rhodium, iridium, hafnium, titanium, molybdenum, tin and other metallization, as well as substrates of A1 or Al(Cu) metallizations and advanced interconnect technologies, are provided by nanoelectronic and microelectronic cleaning compositions.

Abstract: The invention provides cleaning compositions for cleaning microelectronic substrates that are able to essentially completely clean such substrates and inhibit metal corrosion or produce essentially no corrosion of the metal elements of such substrates, and to do so at relatively short cleaning times and relatively low temperatures compared to the cleaning times required for prior art alkaline-containing cleaning compositions. The invention also provides method of using such cleaning compositions to clean microelectronic substrates without producing any significant corrosion of the metal elements of the microelectronic substrate. The cleaning compositions of this invention comprise (a) at least one organic solvent, (b) at least one unneutralized inorganic phosphorus-containing acid, and (c) water. The cleaning compositions of this invention optionally can have present in the compositions other components, such as for example surfactants, metal complexing or chelating agents, corrosion inhibitors, and the like.

Abstract: Ammonia-free, HF-free cleaning compositions for cleaning photoresist and plasma ash residues from microelectronic substrates, and particularly to such cleaning compositions useful with and having improved compatibility with microelectronic substrates characterized by sensitive porous and low-? to high-? dielectrics and copper metallization. The cleaning composition contain one or more non-ammonium producing, non-HF producing fluoride salt (non ammonium, quaternary ammonium fluoride salt) in a suitable solvent matrix.

Abstract: An improved excipient comprising substantially homogeneous particles of a compressible, high functionality granular microcrystalline cellulose based excipient is provided. The improved excipient comprises microcrystalline cellulose and a binder, and optionally a disintegrant, and is formed by spraying a homogeneous slurry of the components. The excipient provides enhanced flowability/good flow properties, excellent/high compactibility, and increased API loading and blendability as compared to the individual components, and as compared to conventional excipients formed from the same materials. The improved excipient has strong intraparticle bonding bridges between the components, resulting in a unique structural morphology including significant open structures or hollow pores. The presence of these pores provides a surface roughness that is the ideal environment for improved blending with an API.

Abstract: The invention provides alkaline compositions useful in the microelectronics industry for stripping or cleaning semiconductor wafer substrates by removing photoresist residues and other unwanted contaminants. The compositions contain (a) one or more bases and (b) one or more metal corrosion inhibiting metal halides of the formula: WzMXy where M is a metal selected from the group Si, Ge, Sn, Pt, P, B, Au, Ir, Os, Cr, Ti, Zr, Rh, Ru, and Sb; X is a halide selected from F, Cl, Br and I; W is selected from H, to an alkali or alkaline earth metal, and a metal ion-free hydroxide base moiety; y is a numeral of from 4 to 6 depending on the metal halide; and z is a numeral of 1, 2 or 3.

Abstract: A low cost re-usable end-cap for disposable chromatographic columns or solid phase extraction cartridges that simultaneously provide sealing of the column and axial compression, and chromatography columns and solid phase extraction cartridges employing such re-usable end caps.

Abstract: Microelectronic cleaning compositions for cleaning microelectronic substrates, and particularly cleaning compositions useful with and having improved compatibility with microelectronic substrates characterized by silicon dioxide, sensitive low-? or high-? dielectrics and copper, tungsten, tantalum, nickel, gold, cobalt, palladium, platinum, chromium, ruthenium, rhodium, iridium, hafnium, titanium, molybdenum, tin and other metallization, as well as substrates of Al or Al(Cu) metallizations and advanced interconnect technologies, are provided by microelectronic cleaning compositions comprising halogen acids, salts and derivatives thereof.

Abstract: Ultrapure olefinic polymeric articles of manufacture can be prepared by a process comprising: providing olefinic polymeric material containing impurities, subjecting the olefinic polymeric material to supercritical CO2 at a pressure of at least about 4000 psi (281.23 kg/cm2) at a temperature of from about 35° C. and above, to extract the impurities from the olefinic polymeric material and produce ultrapure olefinic polymeric material, and molding ultrapure articles of manufacture from the ultrapure, olefinic polymeric material.

Abstract: Cleaning compositions suitable for cleaning microelectronic structures having silicon dioxide, low-k or high-k dielectrics and copper or aluminum metallizations contain an oxidizing agent and a polar organic solvent selected from amides, sulfones, sulfolenes, selenones and saturated alcohols, and optionally other components.

Abstract: Ammonia-free cleaning compositions for cleaning microelectronic substrates, and particularly to such cleaning compositions useful with and having improved compatibility with microelectronic substrates characterized by sensitive porous, low-? and high-? dielectrics and copper metallization. Cleaning compositions for stripping photoresists, cleaning residues from plasma generated organic, organometallic and inorganic compounds, and cleaning residues from planarization processes. The cleaning composition contain one or more non-ammonium producing strong base containing non-nucleophilic, positively charged counter ions and one or more steric hindered amide solvents.

Abstract: The invention relates to methods of producing Protein A without contamination of the Protein A by animal products. The invention also relates to a vegetarian fermentation media in which Staphylococcus aureus is grown to produce a vegetarian Protein A. The invention further relates to a vegetarian Protein A and the use of a vegetarian Protein A in therapeutic and prophylactic methods.

Abstract: Back end photoresist strippers and cleaning compositions of this invention are provided by amino acid-free, non-aqueous cleaning compositions that are essentially non-corrosive toward copper as well as aluminum and that comprise at least one polar organic solvent, at least one hydroxylated organic amine, and at least one corrosion inhibitor compound with multiple hydroxyl functional groups that is a compound of the formula: T1-[(CR1R2)m—(CR3R4)n]p—(CR5R6)q-T2 where at least one of R1 and R2 OH and if one of R1 and R2 is not OH, it is selected from H, alkyl or alkoxy, m is a whole integer of 1 or greater, R3 and R4 are selected from H, alkyl or alkoxy, n is 0 or a greater whole positive integer, p is a whole integer of 1 or greater; at least one of R5 and R6 is OH and if one of R5 and R6 is not OH, it is selected from H, alkyl or alkoxy, q is a whole integer of 1 or greater; T1 and T2 are selected from H, alkyl, hydroxyalkyl, polyhydroxyalkyl, aminoalkyl, carbonylalkyl or amide groups or T1 and T2 may be co

Abstract: A wrench socket assembly has outer and inner sleeves. Each sleeve has a socket drive cavity at each end. The four socket cavities are of different sizes for driving different sizes of fasteners. The outer sleeve has a central section between its socket cavities that slidably receives the inner sleeve. The inner sleeve and the outer sleeve have a torque transmitting feature to allow the inner sleeve to transmit torque through the central section to the outer sleeve. The inner sleeve has a drive section centrally located between its socket cavities. A conventional extension bar from a socket wrench will engage the central drive section located within the inner sleeve.

Abstract: Ultrapure olefinic polymeric articles of manufacture can be prepared by a process comprising: providing olefinic polymeric material containing impurities, subjecting the olefinic polymeric material to supercritical CO2 at a pressure of at least about 4000 psi (281.23 kg/cm2) at a temperature of from about 35° C. and above, to extract the impurities from the olefinic polymeric material and produce ultrapure olefinic polymeric material, and molding ultrapure articles of manufacture from the ultrapure, olefinic polymeric material.

Abstract: Ammonia-free, HF-free cleaning compositions for cleaning photoresist and plasma ash residues from microelectronic substrates, and particularly to such cleaning compositions useful with and having improved compatibility with microelectronic substrates characterized by sensitive porous and low-? to high-? dielectrics and copper metallization. The cleaning composition contain one or more non-ammonium producing, non-HF producing fluoride salt (non ammonium, quaternary ammonium fluoride salt) in a suitable solvent matrix.