Patents Assigned to Bala Electronics Corporation
  • Copper thick film conductor
    Patent number: 4072771
    Abstract: A method of making a copper thick film conductor paste which includes the step of preoxidizing a controlled amount of the copper powder particles. A copper thick film conductor paste, and an electrical conductor element and a method of making it from the paste.
    Type: Grant
    Filed: November 28, 1975
    Date of Patent: February 7, 1978
    Assignee: Bala Electronics Corporation
    Inventor: John D. Grier, Sr.