Patents Assigned to Balsberg Oberflächentechnik GmbH
  • Process for the copper plating of substrates
    Patent number: 6576111
    Abstract: A process for the copper plating of substrates using insoluble anodes in acidic copper baths with separate replenishing of consumed copper ions, characterized in that the major portion of the copper ions is directly supplied in the form of copper carbonate and/or basic copper carbonate, dispensing with diaphragms and auxiliary electrolytes, in a separate tank operated in a bypass mode with respect to the working electrolyte, the released gaseous CO2 being separated off in said separate tank.
    Type: Grant
    Filed: December 28, 2000
    Date of Patent: June 10, 2003
    Assignee: Balsberg Oberflächentechnik GmbH
    Inventors: Jürgen Hupe, Walter Kronenberg, Eugen Breitkreuz, Ulrich Schmergel