Abstract: A coating apparatus has two Mg-targets mutually defining a slit and with a target Mg material purity of at least 99%. An anode arrangement and a gas inlet arrangement are adjacent a first end area of the slit, the gas inlet arrangement being connected to a gas tank arrangement with a working gas. The apparatus has a substrate carrier and conveying arrangement with which a planar substrate is movable across and distant from a second slit end area opposite the first end area and a further gas inlet arrangement is situated between the second slit end area and the substrate carrier and conveying arrangement and is connected to a gas tank arrangement containing oxygen.

Abstract: A method and apparatus for producing a substrate which is coated with a Mgo-layer, includes a pair of Mg targets which define a slit and which have a target purity of at least 99 percent. A working gas flows along the slit. Oxygen is provided in an area between the slit and the substrate to be coated. The temperature of the substrate is set by heating or cooling the substrate during the coating process.

Abstract: For heat conditioning flat panel glass substrates the substrates are directly exposed in vacuum to the radiation of lamps, the lamps being selected so that their spectral radiation characteristics (b, c) fit with the absorption characteristics (a) of the glass of the substrate.

Abstract: A first coating layer structure 3a is produced by coating, alignment, exposure and development. On this coating layer structure 3a is deposited the first colour filter layer system 5a0,5a1. Over the entire colour filter layer system 5 is deposited a sacrificial layer 7. Outside the vacuum container the coating layer structure is dissolved and with it the colour filter layer system regions 5a0 are removed. A further process of coating, alignment, exposure and development is carried out to create a coating layer structure 3b. Next the second colour filter layer system 5b and the second sacrificial layer 7b are deposited. Thereby the sacrificial layer 7 withstands the step of dissolving the coating and can be removed finally without damaging the colour filter layer system regions. Accordingly, any flakes 9 remaining from the lift-off are removed with the sacrificial layer 7.

Abstract: A vacuum packing configuration and installation for use therewith, has a first part and a second part. The first part includes a hydraulically or pneumatically expandable, medium-tight volume adapted to be acted upon by an hydraulic or pneumatic medium, with a wall facing the second part and forming sealing faces fastened on the first part. The wall is a resilient metal diaphragm.

Abstract: A vacuum packing configuration and installation for use therewith, has a first part and a second part. The first part includes a hydraulically or pneumatically expandable, medium-tight volume adapted to be acted upon by an hydraulic or pneumatic medium, with a wall facing the second part and forming sealing faces fastened on the first part. The wall is a resilient metal diaphragm.

Abstract: A substrate coated has at least one MgO-layer and an extent of at least 100 mm.times.100 mm. The layer has a predominant peak in the measuring diagram of the .THETA.-2.THETA.-method and the density of the material of the layer is at least 80% of the density of stoichiometric MgO-bulk material, which is .rho.=3.58 g/cm.sup.3.

Abstract: A process for dry etching a surface within a vacuum treatment reactor includes evacuating the reactor, generating a glow discharge within said reactor, feeding a reactive etching gas into said reactor and reacting said etching gas within said reactor, removing gas with reaction products of said reacting from said reactor and installing an initial flow of said etching gas into said reactor and reducing said flow after a predetermined time span and during said reacting. The vacuum treatment reactor has a reactor with a pumping arrangement for evacuating the reactor. A glow discharge generating arrangement is connected to an electric power supply. A gas tank arrangement is connected to the reactor and has a reactive etching gas such as SF.sub.4.

Abstract: A method for coating a sintered metal carbide substrate with a diamond film is disclosed, which comprises subjecting the substrate to a selective tungsten carbide etching step; subjecting the substrate to a selective Co etching step; and subsequently coating a desired section of the substrate with the diamond film, and where after completion of the selective tungsten carbide etching step and prior to diamond coating the substrate is nucleated with diamond powder through friction contact.

Abstract: An optical element is made of a material that is transparent to a selected spectral band and has an embedded optical layer system. The optical layer system has a first optical system in a first plane which at least predominately reflects light from a first band in the spectral band, and at least predominately transmits light from a second band in the spectral band. A second optical system is also provided in a second plane that intersects the first plane in a central area of the body of the optical element. The second system predominately transmits light from the first band and predominately reflects light from the second band. Optical paths are defined in the optical element between first and second entrances and exits for the light of the first and second bands.

Abstract: A sputter source has at least two electrically mutually isolated stationary bar-shaped target arrangements mounted one alongside the other and separated by respective slits. Each of the target arrangements includes a respective electric pad so that each target arrangement may be operated electrically independently from the other target arrangement. Each target arrangement also has a controlled magnet arrangement for generating a time-varying magnetron field upon the respective target arrangement. The magnet arrangements may be controlled independently from each other. The source further has an anode arrangement with anodes alongside and between the target arrangements and/or along smaller sides of the target arrangements.