Publication number: 20140213057
Abstract: A chemical mechanical polishing (CMP) composition comprising (A) inorganic particles, organic particles, or a mixture or composite thereof, (B) a glycoside of the formulae 1 to 6 wherein R1 is alkyl, aryl, or alkylaryl, R2 is H, X1, X2, X3, X4, X5, X6, alkyl, aryl, or alkylaryl, R3 is H, X1, X2, X3, X4, X5, X6, alkyl, aryl, or alkylaryl, R4 is H, X1, X2, X3, X4, X5, X6, alkyl, aryl, or alkylaryl, R5 is H, X1, X2, X3, X4, X5, X6, alkyl, aryl, or alkylaryl, and the total number of monosaccharide units (X1, X2, X3, X4, X5, or X6) in the glycoside is in the range of from 1 to 20, and (C) an aqueous medium.
Type:
Application
Filed:
September 4, 2012
Publication date:
July 31, 2014
Applicant:
BASF SE
Inventor:
Ning GAO