Abstract: A new method of optical inspection of populated printed circuit boards (PCB), specifically of component leads and solder joints, is provided. At least a portion of the PCB being tested is illuminated with a beam of collimated light. A light detecting device detects specular reflection from the features being examined on the PCB for diagnostically useful patterns. For example, each properly soldered gull-wing lead produces three detectable reflections, each properly soldered J-type lead produces two detectable reflections, and each properly soldered rectangular lead produces one detectable reflection. Other PCB features produce other diagnostically useful reflections. An anomalous reflection indicates, for example, improper soldering or a misplaced component. The invention can be configured to inspect a plurality of leads simultaneously, allowing increased throughput.

Abstract: An apparatus and method for thermal processing of a workpiece in an assembly line. The workpiece is carried by a conveyor into a target zone, where one or more optical systems aim multiple radiation beams of a first wavelength at selected locations on the workpiece to heat those locations. Infrared radiation resulting from that heating is monitored for process quality control. Depending on the time profile of the infrared radiation, the workpiece may be diverted for reprocessing or discarded. Each optical systems is translated as a whole with respect to the workpiece, so that the beams can be aimed at a relatively large flat workpiece at incidence angles that do not depart excessively from vertical. The conveyor is transparent to the radiation beams, and a sensor, placed on the other side of the conveyor from the aiming mechanism, is used to calibrate the aim of the optical systems.

Abstract: An apparatus and method for thermal processing of a workpiece in an assembly line. The workpiece is carried by a conveyor into a target zone, where one or more optical systems aim multiple radiation beams of a first wavelength at selected locations on the workpiece to heat those locations. Infrared radiation resulting from that heating is monitored for process quality control. Depending on the time profile of the infrared radiation, the workpiece may be diverted for reprocessing or discarded. Each optical systems is translated as a whole with respect to the workpiece, so that the beams can be aimed at a relatively large flat workpiece at incidence angles that do not depart excessively from vertical. The conveyor is transparent to the radiation beams, and a sensor, placed on the other side of the conveyor from the aiming mechanism, is used to calibrate the aim of the optical systems.