Abstract: The tri-state dual-in-line package (DIP) switch includes a base with a plurality of transverse grooves, a plurality of conducting pins attached to the transverse grooves; a plurality of slide members, each having a top protrusion and one conducting element attached to the rear surface; and a cover having a plurality of openings for the top protrusions of the slide members. The base is tightly sealed to the cover by means of high frequency welding, wherein energy directors provided for in at least one of the base or said cover are melted by allowing high frequency current to pass through the cover to the base. The width of the base is wider than that of prior art and the conducting pins are folded twice to maintain a standard distance.