Abstract: A method of making a semiconductor structure includes a step of sputtering silver, copper, indium, and gallium on a substrate in an ambient including at least one chalcogen to deposit an alloy of silver, copper, indium, gallium, and at least one chalcogen. A film of the alloy can be deposited on a continuously moving substrate with a high throughput to form a p-type semiconductor absorber layer of a photovoltaic cell.

Abstract: An interconnect assembly. The interconnect assembly includes a trace that includes a plurality of electrically conductive portions. The plurality of electrically conductive portions is configured both to collect current from a first solar cell and to interconnect electrically to a second solar cell. In addition, the plurality of electrically conductive portions is configured such that solar-cell efficiency is substantially undiminished in an event that any one of the plurality of electrically conductive portions is conductively impaired.

Abstract: A solar panel includes a first photovoltaic cell, a second photovoltaic cell, and a flexible electrical connection structure which comprises an electrically conductive connector that electrically connects the first photovoltaic cell and the second photovoltaic cell in series along a connection direction. The electrically conductive connector does not extend from a first major surface of a flexible transparent insulating sheet through a thickness of the flexible transparent insulating sheet to a second major surface of the flexible transparent insulating sheet.

Abstract: A method of making a semiconductor device includes forming a semiconductor material stack having a sodium at an atomic concentration greater than 1×1019/cm3, depositing a transparent conductive oxide layer over the semiconductor material stack, such that sodium atoms diffuse from the semiconductor material stack into the transparent conductive oxide layer, and contacting a physically exposed surface of the transparent conductive oxide layer with a fluid to remove sodium from the transparent conductive oxide layer.

Abstract: Provided are novel interconnect wire network assemblies and methods of fabricating thereof. An assembly may include conductive portions/individual wires that, in certain embodiments, are substantially parallel to each other. The assembly also includes two or more carrier films (i.e., the front side and back side films) attached to opposite sides of the wires. The films are typically attached along the wire ends. The films are made from electrically insulating materials and at least the front side film is substantially transparent. The front side film is used to attach the wires to a photovoltaic surface of one cell, while the back side film is used for attachment to a substrate surface of another cell. These attachments electrically interconnect the two cells in series. In certain embodiments, one or both carrier films extend beyond two end wires and form insulated portions that allow much closer arrangements of the cells in a module.

Abstract: A solar cell containing a plurality of CIGS absorber sublayers has a conversion efficiency of at least 13.4 percent and a minority carrier lifetime below 2 nanoseconds. The sublayers may have a different composition from each other.

Abstract: Disclosed are wire assemblies for solar cells. One wire assembly includes a first polymer film and a second polymer film overlaying the first polymer film. The second polymer film has a wire embedded in it such that a surface of the wire that is facing away from the first polymer film is exposed. The gauge of the wire is about 36 to 46 gauge. The thickness of the second polymer film is about ¼ to ½ the diameter of the wire and about 0.5 to 1.5 mils.

Abstract: The invention relates to a method for producing a thin film solar cell module and thin film solar cell module thus produces. The method comprises the steps of forming a multi-layer structure (100) of multiple electrically interconnected thin film solar cells (1) on a substrate (2), the multi-layer structure comprising a back contact layer (10), a photovoltaic active layer (11), and a front contact layer (13); and forming a conductive grid (3) underneath or onto the front contact layer by depositing a conductive material through a mask (4) before or after forming the front contact layer (13), by moving the substrate (2) and the mask (4) with respect to a deposition source (5) of the conductive material.

Abstract: Provided are novel building integrable photovoltaic (BIP) modules and methods of fabricating thereof. A module may be fabricated from an insert having one or more photovoltaic cells by electrically interconnecting and mechanically integrating one or more connectors with the insert. Each connector may have one or more conductive elements, such as metal sockets and/or pins. At least two of all conductive elements are electrically connected to the photovoltaic cells using, for example, bus bars. These and other electrical components are electrically insulated using a temperature resistant material having a Relative Temperature Index (RTI) of at least about 115° C. The insulation may be provided before or during module fabrication by, for example, providing a prefabricated insulating housing and/or injection molding the temperature resistant material. The temperature resistant material and/or other materials may be used for mechanical integration of the one or more connectors with the insert.

Abstract: Provided are flexible photovoltaic modules having flaps for supporting junction boxes. Junction boxes are used for making electrical connections to photovoltaic cells sealed inside the modules. A flap may be formed by one or two flexible sealing sheets extending beyond the boundary of the photovoltaic cells. A junction box is attached to the front surface of the flap. In certain embodiments, a flap is formed by one sealing sheet, such as a back side sheet. Materials of the back side sheet may be different from materials of the front side sheet and be selected to ensure support to the junction box. Additional support to the junction box may be provided by extending one of its edges in between the two sealing sheets. This edge extension or other features may be used for mechanical protection of electrical leads extending between the junction box and photovoltaic cells.

Abstract: Provided are flexible photovoltaic modules having flexible module connectors that allow their connector bodies to move with respect to other parts of the modules in one or more directions. This flexibility may be used to align connector bodies during installation. Further, flexibility may help to overcome the thermal expansion differences of various modules and supporting structure components during operation. Flexible arms may be used to support connector bodies with respect to module sealing sheets to provide the necessary flexibility. Such modules may also include various touch safety features to keep conductive elements of the module connectors disconnected from the photovoltaic cells prior to installation of the module and during initial installation operations. Also provided are flexible photovoltaic assemblies, each including multiple modules electrically interconnected with each other and sealed at their interfaces.

Abstract: Provided are novel building integrable photovoltaic (BIP) modules that are mechanically and electrically interconnectable. According to various embodiments, the modules include channels and protrusion members. A channel of one module snugly fits over a protrusion member of an adjacent module to provide a moisture seal and, in certain embodiments, to collect water in between two modules and direct it downward. In certain embodiments, a channel is configured to interlock with a protrusion member in one or more directions. The channel is positioned along one edge of the module, while the protrusion member is positioned along the opposite edge, so that BIP modules can form a continuous interconnected row. The channel and protrusion member include electrical connectors having conductive elements. Inserting a protrusion member into a channel and, in certain embodiments, sliding one with respect to another also electrically interconnects the conductive elements.

Abstract: Provided are novel methods of fabricating photovoltaic modules using pressure sensitive adhesives (PSA) to secure wire networks of interconnect assemblies to one or both surfaces of photovoltaic cells. A PSA having suitable characteristics is provided near the interface between the wire network and the cell's surface. It may be provided together as part of the interconnect assembly or as a separate component. The interconnect assembly may also include a liner, which may remain as a part of the module or may be removed later. The PSA may be distributed in a void-free manner by applying some heat and/or pressure. The PSA may then be cured by, for example, exposing it to UV radiation to increase its mechanical stability at high temperatures, in particular at a, for example the maximum, operating temperature of the photovoltaic module. For example, the modulus of the PSA may be substantially increased during this curing operation.

Abstract: Provided are novel building integrable photovoltaic (BIP) modules having specially configured attachment structures for securing these modules to building structures and other BIP modules. In certain embodiments, a BIP module includes a base sheet supporting photovoltaic cells and having a rigid polymer portion and a flexible polymer portion. The flexible portion is designed to be penetrated with mechanical fasteners during installation. The flexible portion may include fastening pointers and/or through holes for identifying specific penetration locations. The rigid portion provides necessary structural rigidity and support to the module and more specifically to the photovoltaic cells. In certain other embodiments, a BIP module includes an adhesive bumper strip disposed along one edge of the module and configured for secure this module with respect to another module. During installation, the strip is positioned between a back sealing sheet of one module and a front sealing sheet of another module.

Abstract: Provided are novel building integrable photovoltaic (BIPV) structures having multiple photovoltaic portions offset with respect to each other along their lengths. An offset direction can correspond to the length of a row of installed BIPV structures. In some embodiments, a BIPV structure may include three offset photovoltaic portions and three corresponding flap portions for extending under photovoltaic portions of adjacent structures and sealing interfaces between installed structures. The novel BIPV structures can facilitate installation, while providing the flexibility to avoid obstacles. Provided also are novel BIPV assemblies having multi-conductor return lines extending through the assemblies. A BIPV assembly having a multi-conductor return line may include a return line for the assembly itself, and one or more return lines for other assemblies.

Abstract: An interconnect assembly. The interconnect assembly includes a trace that includes a plurality of electrically conductive portions. The plurality of electrically conductive portions is configured both to collect current from a first solar cell and to interconnect electrically to a second solar cell. In addition, the plurality of electrically conductive portions is configured such that solar-cell efficiency is substantially undiminished in an event that any one of the plurality of electrically conductive portions is conductively impaired.

Abstract: Provided are novel Building Integrable Photovoltaic (BIPV) modules having one or more connectors that are movable between extended and retracted positions. Connector adjustment may be performed in the field, for example, during installation of a module. In certain embodiments, a connector includes a connector body and extension body. The extension body flexibly attaches the connector body to the module and allows the connector body to move with respect to the module edge. In an extended position, the connector body is positioned closer to the edge and is configured to make electrical connections to a joiner connector for interconnecting with an adjacent module. In a retracted positioned, the connector body is positioned further from the edge and is configured to make electrical connections to a jumper for interconnecting the conductive elements of the connector. In certain embodiments, a jumper does not protrude beyond the edge when connected to the connector body.

Abstract: A sputtering target assembly, including a cylindrical backing tube, a magnet assembly disposed within the backing tube, and a conduit disposed within the backing tube and adapted for transporting coolant. The conduit includes at least one first opening positioned for providing the coolant in a substantially circumferential direction from the conduit toward an inner surface of the backing tube into a gap volume between a front side of the magnet assembly and the inner surface of the backing tube.

Abstract: The invention relates to a method for producing a thin film solar cell module and thin film solar cell module thus produces. The method comprises the steps of forming a multi-layer structure (100) of multiple electrically interconnected thin film solar cells (1) on a substrate (2), the multi-layer structure comprising a back contact layer (10), a photovoltaic active layer (11), and a front contact layer (13); and forming a conductive grid (3) underneath or onto the front contact layer by depositing a conductive material through a mask (4) before or after forming the front contact layer (13), by moving the substrate (2) and the mask (4) with respect to a deposition source (5) of the conductive material.

Abstract: Methods and apparatuses for cutting thin film solar cells are provided. According to various implementations, the methods involve cutting a substrate having thin film solar cell materials deposited thereon by inducing a tear along the cutting line. Simultaneously with the tearing, the torn edges may be plastically deformed to produce a desired torn edge cross-sectional profile. Such a fracture may be induced by clamping regions of the substrate while simultaneously displacing the clamped regions relative to each other through the thickness of the substrate as the substrate is fed through the clamps providing the clamping. Apparatuses for cutting are also provided. According to various implementations, the apparatus may have cutter rollers and support rollers configured with an adjustable radial overlap.