Abstract: The present invention is a device for monitoring a lifetime of fan bearings, which is applied to a fan, comprising a base, at least one sensing unit, a processing unit, and a control plate. The base has a bearing sleeve receiving bearings. The sensing unit is selectively disposed on the bearing sleeve or on the bearing. The processing unit generates an informing signal based on comparison of a received temperature sensed signal generated by the sensing unit sensing the bearing temperature and an internal predetermined temperature value. By means of the device design of the present invention, the effects of effectively monitoring the bearings and predicting the remaining lifetime can be achieved.

Abstract: The present invention is a device for monitoring a lifetime of fan bearings, which is applied to a fan, comprising a base, at least one sensing unit, a processing unit, and a control plate. The base has a bearing sleeve receiving bearings. The sensing unit is selectively disposed on the bearing sleeve or on the bearing. The processing unit generates an informing signal based on comparison of a received temperature sensed signal generated by the sensing unit sensing the bearing temperature and an internal predetermined temperature value. By means of the device design of the present invention, the effects of effectively monitoring the bearings and predicting the remaining lifetime can be achieved.

Abstract: The present invention relates to a method for manufacturing a flat plate heat pipe, which includes steps of: forming a wick structure layer and at least one wick structure post on the inner surface of a chamber of a pipe, pressing the pipe to become a flattened pipe with the wick structure post being connected therein, connecting a conduit to the chamber, sealing both sides of the flattened pipe, evacuating air inside the chamber through the conduit, filling a working fluid into the chamber, and sealing the conduit. According to this method, a flat plate heat pipe can be made in a simplified manner with increased yield and reduced cost.

Abstract: A fan housing structure including a base seat and a sideboard. The base seat has a bed section and a mating section extending along a periphery of the bed section. The bed section has a bush made of a material other than the material of the bed section. The bush is disposed on the bed section to axially protrude therefrom. The sideboard is made of a material other than the material of the base seat. The sideboard is disposed on the mating section and integrally connected with the base seat. The sideboard and the base seat together define a space therebetween. The sideboard and the bush are made of a material other than the material of the base seat and are integrally connected with the base seat by means of insert injection molding. Accordingly, the fan housing structure has enhanced structural strength and thinner thickness to save room.

Abstract: A water-cooling heat dissipation system for LED signboard includes a frame, at least one water pipe system, and at least one water-cooling unit. At least one heat receiving section and at least one LED module in contact with one another are mounted to the frame. The water pipe system includes at least one water pipe extended through the heat receiving section. The water-cooling unit includes at least one water inlet and water outlet pipes, which are respectively connected to a front and a rear end of the water pipe system. The water-cooling unit drives a cooling liquid stored therein to circulate in between the water pipe system and the water-cooling unit, so that heat is quickly carried away from the heat receiving section by the cooling liquid to dissipate into surrounding environment. The water-cooling heat dissipation system has upgraded heat transfer efficiency to achieve good heat dissipation effect.

Abstract: A heat radiating fin assembly is formed from alternately stacked first and second heat radiating fins. The first and the second heat radiating fins each are provided on at least one lateral side with a projected point and a receded point, respectively, to thereby define an airflow guiding section on at least one longitudinal side of the heat radiating fin assembly. The airflow guiding section includes a first and a second airflow inlet, and a middle airflow inlet located between the first and the second airflow inlet. The heat radiating fin assembly can be associated with at least one heat pipe and a base to form a thermal module. The airflow guiding section enables widened airflow inlets, shortened airflow paths, reduced airflow pressure drop and flowing resistance, and upgraded cooling air flowing efficiency, so that the heat radiating fin assembly and the thermal module can provide excellent heat dissipating effect.

Abstract: A combination fan propeller structure including a hub and at least one first blade assembly. The hub includes a top section and an annular section extending from the top section. The annular section has a free end distal from the top section. The first blade assembly has at least one connection section for connecting with the free end to form the fan propeller structure.

Abstract: A heat dissipating cavity includes a cavity made of high thermal conductive material having a plurality of heat dissipating fins on the outside thereof, and temperature equalizing elements including heat pipes and heat expansion plates, which can be used individually or collectively. The heat generated by the heating electronic elements inside the cavity is first effectively conducted to the temperature equalizing elements, wherefrom effectively and evenly conducted to the entire cavity, and finally released out of the system by the plurality of heat dissipating fins. The use of temperature equalizing elements increases the homogeneity of the cavity's overall temperature and greatly improves the efficiency of heat dissipation.

Abstract: A heat dissipating cavity of looped heat pipe structure includes a cavity made of high thermal conductive material having a plurality of heat dissipating fins on the outside thereof, and looped heat pipes. The heat generated by the heating electronic elements inside the cavity is first effectively conducted to the looped heat pipes, wherefrom to the entire cavity, and finally released out of the system by the plurality of heat dissipating fins. The use of looped heat pipes increases the homogeneity of the cavity's overall temperature and greatly improves the efficiency of heat dissipation.

Abstract: A micro passage cold plate device for a liquid cooling radiator includes a upper cover and a lower plate. The upper cover has a working medium inlet at a side thereof and a working medium outlet at another side thereof. The inlet and outlet are trumpet-shaped such that the working medium expansively enters the cold plate gradually and leaves the cold plate with a reduced way gradually. Hence, the cold plate provides an even distribution of temperature, a lower thermal resistance and a better heat dissipation performance such that the stability of the two-state flow of the working medium is enhanced for heat dissipation device in the field of electronic field.

Abstract: A heat dissipating device includes a flat evaporator, a vapor pipe, a liquid pipe, and a condenser. The flat evaporator consists of a bottom plate, a porous material, and a top lid. The porous material is located on the bottom plate and provided with vapor flow passages. The vapor pipe and liquid pipe are communicably connected at respective one end to a vapor port and a liquid port on the evaporator, and at the other end to two sides of the condenser. The evaporator has simple structure and low manufacturing cost, and can fully effectively bear on an electronic chip to enable reduced room needed for installing the evaporator and reduced thermal resistance during heat dissipation. The heat dissipating device can be used to dissipate heat produced by computer chips, and to cool LED illuminating devices, chips for communication devices, high-power heat-producing elements in military, medical, aerial, and aerospace apparatuses.

Abstract: A liquid cooling heat dissipating device with heat tubes gathering heat sources includes a cold plate being disposed on the heat sources and a or a plurality of heat tubes disposed between the heat sources and the cold plate to contact with the heat sources completely, and an end of the respective heat tube is fixedly attached to the cold plate, respectively. The respective heat tube is sealed with a capillary material and a vapor-liquid working median contained inside. The respective heat tube contacts with the heat sources at different spots to gather the heat for being cooled with the cold plate simply.