Abstract: Disclosed are a heat sink base and a heat sink. The heat sink base includes a base body. The bottom of the base body is provided with at least one protruded structure, and the bottom of the base body abuts against the top of the CPU. Each of the at least one protruded structure includes a gentle region with a protrusion, and a slope region surrounding the protruded gentle region with the protrusion. The gentle region of the protruded structure abuts against a high heat flux region at the top of the CPU, thus forming a region with relatively high pressure and relatively stable pressure compared with the slope region. Therefore, the heat sink base provided by the present invention has a simple and reasonable structure, and can efficiently dissipate the heat generated by the CPU, thus improving the cooling efficiency and obtaining more stable and more consistent cooling performance.

Abstract: Disclosed is a heat pipe arrangement method for a heat dissipation and transfer device. The heat dissipation and transfer device includes a metal base, a heat dissipation fin, a heat dissipation fan and a plurality of heat pipes. Each heat pipe includes a heat absorption end and a heat dissipation end. The heat dissipation ends of the plurality of heat pipes are provided in the heat dissipation fin in a penetrating manner. The heat dissipation fan is provided on the heat dissipation fin. Tops of the heat absorption ends of the plurality of heat pipes are tightly mounted on a mounting surface of the metal base. The heat pipe arrangement method includes: arranging the heat absorption ends of the plurality of heat pipes in parallel to each other, center distances between the heat absorption ends of the plurality of heat pipes being different.

Abstract: A shrinking device and a liquid cooling system are provided. The shrinking device includes a housing, and a shrinking bag at least partially inserted into the housing. The shrinking bag is in communication with the outside atmosphere through a vent hole. The shrinking device according to the present invention can solve the liquid leakage problem caused by excessive pressure inside the system.

Abstract: The present invention relates to a heat dissipation fan, where the heat dissipation fan includes a fan frame and a fan blade, where the fan blade includes a hub and a plurality of double-layer blades evenly disposed around the hub, and a primary air intake area is formed between the double-layer blades; the double-layer blade includes a primary blade and a secondary blade, where the secondary blade is fixed on the primary blade, and a secondary air intake area is formed between the primary blade and the secondary blade; and when the heat dissipation fan works, an airflow enters the primary air intake area and the secondary air intake area of the heat dissipation fan through an air inlet of the heat dissipation fan, and forms a first airflow in the primary air intake area and a second airflow in the secondary air intake area, and the first airflow and the second airflow flow out through an air outlet of the heat dissipation fan.

Abstract: The present invention discloses a water cooling system for a computer, which includes a radiator, a cooling block in fluid communication with the radiator, and a liquid storage tank in fluid communication with the radiator and the cooling block. The radiator, the cooling block and the liquid storage tank are of an integrated structure. The water cooling system of the invention has an integrated structure which does not require user to assemble the components, thereby avoiding incidents such as liquid leakage. The water cooling system is provided with the liquid storage tank that is at least partially exposed outside a water cooling case, thereby increasing the amount of a cooling liquid, improving the heat dissipating efficiency, enabling a user to easily observe the amount of the cooling liquid, and improving the appearance of the water cooling case.

Abstract: The present invention provides a water block for a water-cooling CPU radiator. The water block includes an upper shell, a bottom shell, an external pipe and a water pump. The upper shell includes a shell body and an upper cover. The shell body is provided with a first cavity, a side wall of the shell body is provided with a water outlet. The upper cover is provided with a water inlet, and both the water inlet and the water outlet are in fluid communication with the first cavity. The bottom shell is arranged at the lower end of the shell body and is provided with a second cavity, and the two sides of the bottom shell are provided with an upper water port and a water inlet, respectively, which are communicated with the second cavity. The external pipe is arranged outside the upper shell and the bottom shell.

Abstract: The present invention relates to a heat dissipation fan, where the heat dissipation fan includes a fan frame and a fan blade, where the fan blade includes a hub and a plurality of double-layer blades evenly disposed around the hub, and a primary air intake area is formed between the double-layer blades; the double-layer blade includes a primary blade and a secondary blade, where the secondary blade is fixed on the primary blade, and a secondary air intake area is formed between the primary blade and the secondary blade; and when the heat dissipation fan works, an airflow enters the primary air intake area and the secondary air intake area of the heat dissipation fan through an air inlet of the heat dissipation fan, and forms a first airflow in the primary air intake area and a second airflow in the secondary air intake area, and the first airflow and the second airflow flow out through an air outlet of the heat dissipation fan.

Abstract: A cooling fan, which may be installed on a corresponding position of the cooling fins of a CPU or a cooling hole-plate of a computer mainframe, includes: a fan body, a fan frame and a fan impeller. The fan frame is circular in shape. The fan body is arranged along the outer circumference of the fan frame. The fan impeller is installed in the fan frame. A rubber layer, which is formed by secondary injection molding, is arranged at the outer surface of the fan body and the contact parts between the cooling fins and the upper and lower edges of the fan frame, respectively. Through holes are provided at the upper and lower parts of four end corners of the fan body, respectively, and rubber layers are also provided at the inner walls of the through holes.