Patents Assigned to BEIJING DEEPCOOL SCI-TECH CO., LTD.
  • Publication number: 20260211468
    Abstract: The present disclosure discloses a multi-compartment chassis structure, including a plurality of compartments provided as being adjacent to each other, the plurality of compartments are configured to accommodate a plurality of electronic components, and the plurality of compartments are separated from one another by a space, which is configured as air intake channel for one of the compartments. The chassis structure according to the present disclosure is obtained by modifying a chassis structure by adopting a layered configuration to divide the original space of the chassis into two or more independent compartments. The CPU and graphics card, which generate much heat, may be isolated from the water cooling radiator and fans of CPU physically to achieve independent cooling, so that cooling efficiency is significantly improved.
    Type: Application
    Filed: September 10, 2025
    Publication date: July 23, 2026
    Applicant: BEIJING DEEPCOOL SCI-TECH CO., LTD.
    Inventors: Edward XIA, Dongjin XU, Weichao LI
  • Publication number: 20250181122
    Abstract: The present disclosure discloses a computer case that includes a case body with a first side wall and a second side wall. The first side wall and the second side wall are opposite each other; the first side wall includes a first cooling position and the second side wall includes a second cooling position. A ratio of cooling area of ventilation and cooling devices mounted at the first and second cooling positions is not less than 2:3, or a ratio of projected area of the ventilation and cooling devices mounted at the second and first cooling positions is not less than 2:3. A high-efficiency through-type airflow path may be formed inside the case body, when a guiding airflow directions of the ventilation and cooling devices mounted at the first and second cooling positions are provided to be consistent with each other.
    Type: Application
    Filed: May 20, 2022
    Publication date: June 5, 2025
    Applicant: BEIJING DEEPCOOL SCI-TECH CO., LTD.
    Inventors: Dangsheng ZHAO, Weichao LI, Yong ZHANG, Yaojia LOU, Yijia DING