Abstract: The present disclosure discloses a method for forming a high-density aligned carbon nanotube film. The method includes injecting a carbon nanotube solution into a container, and adding a dispersant to form a carbon nanotube-dispersant composite. The method also includes adding a substance that interacts with the carbon nanotube-dispersant composite and then dispersing the obtained carbon nanotube solution using water ultrasonic or probe ultrasonic to obtain a carbon nanotube solution containing a dispersant. Then a large-area or patterned high-quality aligned carbon nanotube film can be formed on a substrate by using processes such as pulling, injection dripping or printing. The method is low-cost and suitable for the preparation of large-area high-density aligned carbon nanotubes, and satisfies various needs for industrial application of carbon-based integrated circuits.
Type:
Application
Filed:
September 4, 2020
Publication date:
October 20, 2022
Applicants:
BEIJING HUA TAN YUAN XIN ELECTRONICS TECHNOLOGY CO., LTD, BEIJING INSTITUTE OF CARBON-BASED INTEGRATED CIRCUIT
Abstract: The present disclosure discloses a device and a method for preparing a high-density aligned carbon nanotube film. The device includes a container main body, a buffer partition plate and a solvent lead-out part. The buffer partition plate is located at a lower part of the container main body. The solvent lead-out part communicates with an interior of the container main body through a through hole in a side wall of the container main body and extends to an outside of the container main body. The method includes injecting a carbon nanotube solution into a container; immersing a substrate in the carbon nanotube solution; injecting a sealing liquid that is immiscible with the carbon nanotube solution along the substrate or the side wall of the container main body; and leading the solvent out or pulling the substrate such that the liquid surface of the substrate undergoes relative motion.
Type:
Application
Filed:
September 4, 2020
Publication date:
October 6, 2022
Applicants:
BEIJING HUA TAN YUAN XIN ELECTRONICS TECHNOLOGY CO., LTD, BEIJING INSTITUTE OF CARBON-BASED INTEGRATED CIRCUIT