Abstract: A non-revivable Radio Frequency Identification (RFID) tag and a method of manufacturing the same are provided. The RFID tag includes a capacitor plate formed with a decoding point having an interior portion and an outer peripheral portion confining the interior portion. A conductive adhesive is filled into the interior portion and the outer peripheral portion, and then is solidified. The method includes the steps of: punching a recess on a capacitor plate of a circuit of the RFID tag to define a decoding point, wherein the decoding point has an interior portion and an outer peripheral portion confining the interior portion; filling a conductive adhesive into the decoding point in such a manner that the conductive adhesive is filled into the interior portion and the outer peripheral portion; and putting the RFID tag in an environment with a curing temperature so as to solidify or cure the conductive adhesive.

Abstract: A resonance tag includes a dielectric layer, a first circuit layer, a second circuit layer and a hard pad. The first circuit layer is formed on one surface of the dielectric layer, and the first circuit layer has a first electrode pattern and a coil. A second circuit layer is formed on the other surface of the dielectric layer, and the second circuit layer has a second electrode pattern and a wiring. A hard pad is formed on the second circuit layer and corresponding to the wiring of the second circuit layer, and then an edge of the hard pad is beyond the edge of the wiring.