Abstract: A non-volatile memory cell and a non-volatile memory device are provided. The non-volatile memory cell includes a latch structure, a first read/write circuit, a first memristor, a second read/write circuit and a second memristor. The first read/write circuit controls a writing operation of the first memristor. The second read/write circuit controls a writing operation of the second memristor. When a restore operation is performed, the data in the latch structure is restored by using the resistance difference between the first memristor and the second memristor. The non-volatile device of the invention combines the advantages of fast memory unit and non-volatile memory, and it may work at a high speed and retain data when powered off.

Abstract: A method for fabricating a phase change memory device uses the well-developed semiconductor process to fabricate a larger-size sacrifice beforehand, and next uses a wet etching technology to form a narrowed sacrifice layer having a smaller size, and then removes the narrowed sacrifice layer to form the desired mask pattern, whereby the method can precisely define and easily adjust a smaller-size heater and have a stable fabrication process.

Abstract: A non-volatile memory device includes plural non-memory cells. Each non-volatile memory cell includes a first switch, a first memristor, a second switch, a second memristor and a third switch. The control terminal of the first switch is coupled to a word line. The first memristor is provided with a first impedance. The control terminal of the second switch is coupled to the word line. The second memristor is provided with a second impedance. The first switch, the first memristor, the second switch and the second memristor are serially connected between a bit line and an inverted bit line in an alternate manner. The third switch is used for configuring the first impedance and the second impedance. The non-volatile memory device provided by the disclosure has a characteristic of quick access and the data stored therein does not require a dynamic update.

Abstract: A method of manufacturing a phase change memory includes: (i) forming a first dielectric layer, a conductive contact and a first electrode over a semiconductor substrate; (ii) forming a second dielectric layer having an opening over the first dielectric layer, the opening exposing a top surface of the first electrode; (iii) forming a barrier layer lining a sidewall of the opening; (iv) forming a phase change element in the opening, wherein the phase change element includes a base and a peripheral wall extending upwards along the barrier layer from a periphery of the base, and an inner side of the peripheral wall defines a recess having an inlet and a bottom portion; (v) forming a heater filled in the recess; and (vi) forming a second electrode over the heater. A phase change memory is disclosed herein as well.

Abstract: A manufacturing method of a phase change memory includes following steps. A first mask layer is formed on a dielectric layer, and a second mask layer is formed on the first mask layer. Then, the first mask layer and the second mask layer are patterned to expose a side surface of the first mask layer. A portion of the first mask layer is removed from the side surface of the first mask layer to form a columnar protrusion. After removing the second mask layer, a heating material layer is formed to conformally cover sidewalls and an upper surface of the columnar protrusion. The heating material layer on the upper surface of the columnar protrusion is removed, so as to form an annular heater from the heating material layer; and the annular heater surrounds the columnar protrusion.

Abstract: A memory driving circuit includes a current source configured to output a second current, a first switching unit configured to undergo switching to connect to the current source selectively to output the second current, a voltage generating unit configured to provide a reference voltage, a capacitive energy storage unit configured to store energy according to the reference voltage, a third switching unit configured to undergo switching to connect the voltage generating unit and the capacitive energy storage unit selectively, a second switching unit configured to undergo switching to connect the capacitive energy storage unit selectively to output a third current, and a current output terminal configured to output the second current, the third current, or the sum of the second current and the third current.

Abstract: A memory device includes a memory array, a word line driver, and source drivers. The memory array includes memory units. The memory units arranged in the same column are coupled to corresponding bit line. The memory units arranged in the same row are coupled to corresponding word line. The memory units arranged in the rows are divided into N groups, in which N is an integer greater than or equal to 2. The word line driver is configured to selectively enable the word lines. Source drivers are coupled to the memory units in the groups respectively and configured to output N source control signals. When any word line in a first group is enabled, the source control signals corresponding to the first group and a second group of which the sequence for read-write operation is next to the first group are controlled at a select level by corresponding source drivers.

Abstract: A non-volatile storage device adopt memristors to store data and uses fewer transistors to realize the same circuit function, whereby to decrease the chip area and reduce the time and energy spent in initiating the device. Further, the non-volatile storage device disposes appropriate electronic elements in the spacing between adjacent memristors to meet the layout design rule and achieve high space efficiency in the chip lest the space between memristors be wasted.