Patents Assigned to Belits Computer systems, Inc.
  • Low-profile thermosyphon-based cooling system for computers and other electronic devices
    Patent number: 7958935
    Abstract: This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant inside the evaporator to evaporate or boil. The resulting vapor enters a condenser and returns to a liquid phase. Cooling fins are attached to the condenser to facilitate heat transfer with the surrounding airflow. The cooling system and computer or electronic device fit within standard computer cases and high density server rack-mountable cases.
    Type: Grant
    Filed: June 18, 2007
    Date of Patent: June 14, 2011
    Assignee: Belits Computer Systems, Inc.
    Inventors: Alex Belits, Valeriy Belits
  • Low-Profile Thermosyphon-Based Cooling System for Computers and Other Electronic Devices
    Publication number: 20070242438
    Abstract: This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant inside the evaporator to evaporate or boil. The resulting vapor enters a condenser and returns to a liquid phase. Cooling fins are attached to the condenser to facilitate heat transfer with the surrounding airflow. The cooling system and computer or electronic device fit within standard computer cases and high density server rack-mountable cases.
    Type: Application
    Filed: June 18, 2007
    Publication date: October 18, 2007
    Applicant: Belits Computer Systems, Inc.
    Inventors: Alex Belits, Valeriy Belits
  • Low-profile thermosyphon-based cooling system for computers and other electronic devices
    Patent number: 7231961
    Abstract: This invention provides a cooling system comprising a thermosyphon for computer and electronic devices. The thermosyphon comprises an evaporator placed on top of a heat source, such as CPU. Heat from the heat source causes liquid coolant inside the evaporator to evaporate or boil. The resulting vapor enters a condenser and returns to a liquid phase. Cooling fins are attached to the condenser to facilitate heat transfer with the surrounding airflow. The cooling system and computer or electronic device fit within standard computer cases and high density server rack-mountable cases.
    Type: Grant
    Filed: March 23, 2005
    Date of Patent: June 19, 2007
    Assignee: Belits Computer systems, Inc.
    Inventors: Belits Alex, Belits Valeriy