Patents Assigned to Benefil Worldwide Oy
  • Patent number: 7517177
    Abstract: The aim of this invention is to present a method in which holes (1) are drilled into the ground for the injection of highly expansive grouts (5), so that the subsoil is void filled and compacted and thus the liquefaction potential under earthquake and vibration forces are reduced.
    Type: Grant
    Filed: September 26, 2007
    Date of Patent: April 14, 2009
    Assignee: Benefil Worldwide Oy
    Inventor: Mete E. Erdemgil
  • Patent number: 7290962
    Abstract: The aim of this invention is to present a method in which holes (1) are drilled into the ground for the injection of highly expansive grouts (5), so that the subsoil is void filled and compacted and thus the liquefaction potential under earthquake and vibration forces are reduced.
    Type: Grant
    Filed: November 5, 2003
    Date of Patent: November 6, 2007
    Assignee: Benefil Worldwide Oy
    Inventor: Mete E. Erdemgil