Patents Assigned to Benq Materials Corp.
  • Patent number: 7829167
    Abstract: A disc having a relief pattern and a transprint method thereof are provided. The transprint method for transprinting the relief pattern on a substrate of the disc includes the following steps. First, a transprint template is provided. A first surface of the transprint template has a complementary pattern corresponding to the relief pattern. Next, a pattern layer is formed on the substrate. Then, the transprint template is placed on and covers the pattern layer until the first surface of the transprint template closely contacts a second surface of the pattern layer, so that the relief pattern is formed on the second surface. Afterward, the pattern layer is cured by irradiation. Later, the transprint template is removed for exposing the second surface with the relief pattern.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: November 9, 2010
    Assignee: Benq Materials Corp.
    Inventor: Chih-Hsun Lin